CPC technology class · H01
H01F - Magnets
Magnets; inductances; transformers; selection of materials for their magnetic properties. 21,711 US utility patents granted 2015–2025, with the leading assignees and year-by-year filing trajectory.
- 21,711
- US patents granted
- H01
- Parent CPC class
- 20
- Active assignees
- +36%
- 5-yr velocity
The verdict
Magnets ranks #93 of 670 CPC technology areas - 21,711 US patents granted since 2015, with filing up 36% over five years.
- #93
- of 670 CPC technology areas
- 21,711
- US patents granted, 2015–2025
- Murata Manufacturing
- leading assignee (1,164)
- +36%
- filing velocity, last 5 yrs
CPC subclass H01F - MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - covers 21,711 US utility patents granted between 2015 and 2025 according to USPTO PatentsView records, within the broader CPC class H01 (ELECTRIC ELEMENTS). See our CPC classification guide for how the system works.
The competitive landscape in H01F is shaped by 20 distinct companies actively filing in this space. Murata Manufacturing Co., Ltd. leads with 1,164 patents, followed by TDK Corporation at 904 grants and Taiwan Semiconductor Manufacturing Company Ltd. at 281.
Filing activity in H01F is up 36% over the past five years versus 2015-2019, a sharp acceleration suggesting an emerging or fast-moving technology area. All counts come directly from USPTO PatentsView and reflect US granted utility patents only.
Is H01F innovation accelerating?
US utility-patent grants per year in H01F, 2015–2025 - recent five years are up 36% versus 2015–2019.
Who leads H01F?
The 12 most active assignees in MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - wider bars mean more grants
- Murata Manufacturing
MURATA MANUFACTURING CO., LTD.
1,164 patents
- Tdk
TDK CORPORATION
904 patents
- Taiwan Semiconductor… 281
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
281 patents
- Hitachi 234
HITACHI, LTD.
234 patents
- Taiyo Yuden 223
TAIYO YUDEN CO., LTD.
223 patents
- Jfe Steel 209
JFE Steel Corporation
209 patents
- Sumitomo Electric Ind… 171
Sumitomo Electric Industries, Ltd.
171 patents
- Nippon Steel 167
NIPPON STEEL CORPORATION
167 patents
- Lg Innotek 158
LG INNOTEK CO., LTD.
158 patents
- Sumitomo Wiring Syste… 119
SUMITOMO WIRING SYSTEMS, LTD.
119 patents
- Autonetworks 116
AUTONETWORKS TECHNOLOGIES, LTD.
116 patents
- Abb Schweiz 115
ABB Schweiz AG
115 patents
What this shows Murata Manufacturing is the most active filer in H01F, holding 1,164 of the 21,711 patents in this class. Concentration at the top signals how contestable this technology area is for new entrants.
View data table
| Rank | Company | Patents in H01F |
|---|---|---|
| #1 | Murata Manufacturing Co., Ltd. | 1,164 |
| #2 | TDK Corporation | 904 |
| #3 | Taiwan Semiconductor Manufacturing Company Ltd. | 281 |
| #4 | Hitachi, Ltd. | 234 |
| #5 | Taiyo Yuden Co., Ltd. | 223 |
| #6 | JFE Steel Corporation | 209 |
| #7 | Sumitomo Electric Industries, Ltd. | 171 |
| #8 | Nippon Steel Corporation | 167 |
| #9 | LG Innotek Co., Ltd. | 158 |
| #10 | Sumitomo Wiring Systems, Ltd. | 119 |
| #11 | Autonetworks Technologies, Ltd. | 116 |
| #12 | ABB Schweiz Ag | 115 |
| #13 | Delta Electronics (shanghai) Co., Ltd. | 111 |
| #14 | Realtek Semiconductor Corp. | 110 |
| #15 | Witricity Corporation | 107 |
| #16 | Nucurrent, Inc. | 103 |
| #17 | Delta Electronics, Inc. | 100 |
| #18 | Cyntec Co., Ltd. | 99 |
| #19 | Sumida Corporation | 76 |
| #20 | Siemens Healthcare Limited | 64 |
About This Class
CPC subclass H01F belongs to class H01.
21,711 patents were granted in this class between 2015 and 2025.
20 companies actively patent in this space.
Classification System
Cooperative Patent Classification (CPC) is a hierarchical patent classification system used by the USPTO and EPO.
Footprint here vs. claim strategy
Each dot is a leading H01F assignee, placed by how many patents it holds in this class (horizontal) against its company-wide average claims per patent (vertical) - a read on whether the class is led by broad-but-shallow filers or focused deep-claim players.
Top 14 H01F assignees by class footprint. Bubble size = patents in H01F. Source: USPTO PatentsView (claim depth is company-wide across all classes).
Frequently Asked Questions
What is CPC class H01F?
How many patents have been filed in H01F?
Which company holds the most patents in H01F?
How is patent data for H01F collected?
What is the difference between CPC class and subclass?
Read our methodology - how this data is sourced, computed, and verified.
Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error.