Where does Taiwan Semiconductor Manufacturing Company Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Taiwan Semiconductor Manufacturing Company Ltd. ranks #5 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Taiwan Semiconductor Manufacturing Company Ltd. hold?

Taiwan Semiconductor Manufacturing Company Ltd. holds 31,041 US utility patents granted between 2015 and 2025, spanning 251 technology areas.

What is Taiwan Semiconductor Manufacturing Company Ltd.'s Innovation Score?

Taiwan Semiconductor Manufacturing Company Ltd. has an Innovation Score of 81.5 out of 100 (top 1% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Taiwan Semiconductor Manufacturing Company Ltd. focus on?

Taiwan Semiconductor Manufacturing Company Ltd.'s top technology area is H01L (Semiconductor Devices NOT Covered BY Class H10) with 19,657 patents, ranking #1 of 3,373 assignees active in that subclass. Grants appear in 251 CPC subclasses total.

Is Taiwan Semiconductor Manufacturing Company Ltd.'s patent grant rate increasing or decreasing?

Taiwan Semiconductor Manufacturing Company Ltd.'s recent grant velocity is +45% compared to the prior five-year period (grant years, not application filing dates). The company is maintaining or growing its granted-patent output.

What does claim depth mean for Taiwan Semiconductor Manufacturing Company Ltd.'s patents?

Taiwan Semiconductor Manufacturing Company Ltd.'s patents average 19.7 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Taiwan Semiconductor Manufacturing Company Ltd.

Q: How is the Taiwan Semiconductor Manufacturing Company Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO PatentsView assignee record - 31,041 granted patents across 251 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01L (Semiconductor Devices NOT Covered BY Class H10).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Taiwan ranks #5 of 49,997 US assignees by granted-patent volume, with 31,041 patents across 251 technology areas.

#5
of 49,997 US assignees by volume: Top 1%
by Innovation Score (81.5/100): 19.7
avg claims per patent: +45%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R5 · Foreign Corporation #5 · 31,041 grants

GRANTS-MEGA · TOP-DECILE · CLEAR-GAP · CPC-BROAD · INNOV-ELITE · CLAIMS-RICH · TYPE-FRNCORP · VEL-UP · BOOK-FULL

GRANTS-MEGA 31K grants
TOP-DECILE #5/49,997
CLEAR-GAP Apple
CPC-BROAD H01L · 251 areas
INNOV-ELITE 81.5/100
CLAIMS-RICH 19.7 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-UP +45% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Apple Inc. (±481 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Taiwan’s 81.5 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 35.7 pts (44%) Velocity 9.0 pts (11%) Breadth 25.0 pts (31%) Claim depth 11.8 pts (14%)

Qualcomm Incorporated · highest

85
Taiwan Semiconductor… · this assignee

82
KIA · near

81
Samsung · near

81
Meta Platforms · near

81
Chengdu BOE… · near

81
3D Lighting… · lowest

7

What this shows Taiwan's Innovation Score is 81.5/100 (top 1% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Taiwan?

Each dot is one of Taiwan’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Taiwan’s own 19.7 claims/patent is ABOVE the 16.1 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Taiwan vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

How Taiwan's grant cadence moved

Between 2020–2024, Taiwan Semiconductor Manufacturing Company Ltd. received 16,352 grants versus 11,292 in 2015–2019 (+45% equal-window velocity, above median growth). Across complete PatentsView years, output peaked in 2024 at 3,994 grants and bottomed in 2015 at 1,775. Lead class H01L accounts for 63.3% of the portfolio across 251 subclasses.

Taiwan's three-year grant acceleration

From 2019–2021 to 2022–2024, Taiwan Semiconductor Manufacturing Company Ltd. moved from 7,978 to 10,713 grants (1.34x the prior three-year total, a multiple, not a CAGR). Among 3,296 tracked assignees with ≥100 grants and ≥20 prior-period grants, that multiple ranks #588. See the growth leaderboard.

Samsung

106,890
International Bus…

72,926
Canon

34,378
LG

32,607
Taiwan Semiconduc… ◀

31,041
Apple

30,560
Qualcomm Incorpor…

30,354
Intel

27,498
Microsoft Technol…

24,392

What this shows Taiwan sits among the ten largest US patent holders, a tier dominated by electronics and semiconductor multinationals.

Other top-10 patent holders

The other largest US assignees by granted patent volume.

Leaders in H01L (Semiconductor Devices NOT Covered BY Class H10)

Other assignees with the most granted patents in Taiwan's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Taiwan, neither rank-band nor same-CPC leaders (those blocks stay above). In H01L (Semiconductor Devices NOT Covered BY Class H10), Taiwan ranks #1 of 3,373 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (82 here).

Samsung Electronics Co., Ltd. 81 KIA Corporation 81 Meta Platforms Technologies, LLC 81 Chengdu BOE Optoelectronics Technology Co., Ltd. 81

Similar claim depth

Nearest assignees by average claims per patent (19.7 here).

BMC Software, Inc. 19.7 avg Tribune Broadcasting Company, LLC 19.7 avg Mertec, LLC 19.7 avg Hypres, Inc. 19.7 avg

Taiwan's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

82 Top 1% higher than 99% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Taiwan Semiconductor Manufacturing Company Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	1,775	5.7%
2016	2,291	7.4%
2017	2,425	7.8%
2018	2,462	7.9%
2019	2,339	7.5%
2020	2,838	9.1%
2021	2,801	9.0%
2022	3,031	9.8%
2023	3,688	11.9%
2024	3,994	12.9%
2025partial year	3,397	10.9%

Which technologies does Taiwan Semiconductor Manufacturing Company Ltd. patent most?

H01L - Semiconductor Devices NOT Covered BY Class H10 19,657

H10D - Inorganic Electric Semiconductor Devices 13,882

H10B - Electronic Memory Devices 3,369

G11C - Static Stores 2,498

G03F - Photomechanical Production OF Textured OR Patterned Surfaces, e.g. FOR Printing, FOR Processing OF Semiconductor DEVICES; Materials THEREFOR; Originals THEREFOR; Apparatus Specially Adapted THEREFOR; 2,018

G06F - Electric Digital Data Processing 1,961

B82Y - Specific Uses OR Applications OF NANOSTRUCTURES; Measurement OR Analysis OF NANOSTRUCTURES; Manufacture OR Treatment OF Nanostructures 1,724

H10F - Inorganic Semiconductor Devices Sensitive TO Infrared Radiation, Light, Electromagnetic Radiation OF Shorter Wavelength OR Corpuscular Radiation 1,413

H10N - Electric Solid-state Devices NOT Otherwise Provided FOR 1,299

H03K - Pulse Technique 762

G01R - Measuring Electric VARIABLES; Measuring Magnetic Variables 606

H01J - Electric Discharge Tubes OR Discharge Lamps 537

C23C - Coating Metallic MATERIAL; Coating Material With Metallic MATERIAL; Surface Treatment OF Metallic Material BY Diffusion Into THE Surface, BY Chemical Conversion OR SUBSTITUTION; Coating BY Vacuum Evaporation, BY Sputtering, BY ION Implantation OR BY Chemical Vapour Deposition, IN General 493

G02B - Optical Elements, Systems OR Apparatus 478

B81C - Processes OR Apparatus Specially Adapted FOR THE Manufacture OR Treatment OF Microstructural Devices OR Systems 467

Top 15 of 251 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Taiwan Semiconductor Manufacturing Company Ltd.'s patent record in context - here's where to go next.

Taiwan Semiconductor Manufacturing Company Ltd.'s lead technology class is H01L (Semiconductor Devices NOT Covered BY Class H10), 63.3% of its portfolio - see every assignee active in that class. Explore H01L
Ranked #5 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Taiwan Semiconductor Manufacturing Company Ltd. is a top-10 global holder - see how it stacks up against Samsung Electronics Co., Ltd., another of the largest patent portfolios. Compare portfolios
Innovation Score of 81.5/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.