PlainPatent

CPC technology class · H01

H01R - Electrically-conductive Connections

Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors. 35,523 US utility patents granted 2015–2025, with the leading assignees and year-by-year filing trajectory.

35,523
US patents granted
H01
Parent CPC class
20
Active assignees
-6%
5-yr velocity

The verdict

Electrically-conductive Connections ranks #48 of 670 CPC technology areas - 35,523 US patents granted since 2015, with filing down 6% over five years.

#48
of 670 CPC technology areas
35,523
US patents granted, 2015–2025
Sumitomo Wiring Syste…
leading assignee (1,543)
-6%
filing velocity, last 5 yrs
Top assignee: Sumitomo Wiring Systems, Ltd. (1,543 patents)

CPC subclass H01R - ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - covers 35,523 US utility patents granted between 2015 and 2025 according to USPTO PatentsView records, within the broader CPC class H01 (ELECTRIC ELEMENTS). See our CPC classification guide for how the system works.

The competitive landscape in H01R is shaped by 20 distinct companies actively filing in this space. Sumitomo Wiring Systems, Ltd. leads with 1,543 patents, followed by Yazaki Corporation at 1,482 grants and Foxconn Interconnect Technology Limited at 847.

Filing activity in H01R is down 6% over the past five years versus 2015-2019, a relatively steady filing pace. All counts come directly from USPTO PatentsView and reflect US granted utility patents only.

Is H01R innovation accelerating?

US utility-patent grants per year in H01R, 2015–2025 - recent five years are down 6% versus 2015–2019.

1,5002,0002,5003,0003,5004,000 20152016201720182019202020212022202320242025 1,822

Who leads H01R?

The 12 most active assignees in ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - wider bars mean more grants

patents

What this shows Sumitomo Wiring Syste… is the most active filer in H01R, holding 1,543 of the 35,523 patents in this class. Concentration at the top signals how contestable this technology area is for new entrants.

Source USPTO PatentsView, granted utility patents As of 2015–2025 grant years
View data table
Top patent holders in CPC subclass H01R
Rank Company Patents in H01R
#1 Sumitomo Wiring Systems, Ltd. 1,543
#2 Yazaki Corporation 1,482
#3 Foxconn Interconnect Technology Limited 847
#4 Sumitomo Electric Industries, Ltd. 729
#5 Autonetworks Technologies, Ltd. 694
#6 Molex, Llc 599
#7 Japan Aviation Electronics Industry, Limited 523
#8 TE Connectivity Co. Ltd. 459
#9 Commscope Technologies Llc 326
#10 Hubbell Incorporated 324
#11 TE Connectivity Germany Gmbh 284
#12 Tyco Electronics (shanghai) Co., Ltd. 279
#13 HON HAI Precision Industry Co., Ltd. 268
#14 Lotes Co., Ltd 260
#15 Aptiv Technologies Ag 249
#16 Tyco Electronics Co., Ltd 245
#17 TE Connectivity Solutions Gmbh 240
#18 Amphenol Corporation 228
#19 Foxconn (kunshan) Computer Connector Co., Ltd. 221
#20 Phoenix Contact Gmbh & Co. KG 219

About This Class

CPC subclass H01R belongs to class H01.

35,523 patents were granted in this class between 2015 and 2025.

20 companies actively patent in this space.

Classification System

Cooperative Patent Classification (CPC) is a hierarchical patent classification system used by the USPTO and EPO.

← All Technology Classes Technology Rankings →

Footprint here vs. claim strategy

Each dot is a leading H01R assignee, placed by how many patents it holds in this class (horizontal) against its company-wide average claims per patent (vertical) - a read on whether the class is led by broad-but-shallow filers or focused deep-claim players.

Top 14 H01R assignees by class footprint. Bubble size = patents in H01R. Source: USPTO PatentsView (claim depth is company-wide across all classes).

Top 14 H01R assignees by class footprint. Bubble size = patents in H01R. Source: USPTO PatentsView (claim depth is company-wide across all classes). Scatter plot of 14 data points (bubble-sized by third dimension). 5101520 0500100015002000 Patents in H01R Avg claims / patent (company-wide) Sumitomo Wiring Syste…YazakiFoxconn Interconnect…Sumitomo Electric Ind…AutonetworksMolexJapan Aviation Indust…Te ConnectivityCommscopeHubbell IncorporatedTe Connectivity Germa…Tyco (Shanghai)Hon Hai Precision Ind…Lotes
Top 14 H01R assignees by class footprint. Bubble size = patents in H01R. Source: USPTO PatentsView (claim depth is company-wide across all classes).

Frequently Asked Questions

What is CPC class H01R?
CPC subclass H01R covers ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS. It belongs to CPC class H01 (ELECTRIC ELEMENTS), with 35,523 US utility patents granted since 2015.
How many patents have been filed in H01R?
35,523 US utility patents were granted in CPC subclass H01R between 2015 and 2025, based on USPTO PatentsView data.
Which company holds the most patents in H01R?
Sumitomo Wiring Systems, Ltd. leads H01R with 1,543 patents, making it the most active assignee in this technology area.
How is patent data for H01R collected?
Patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office. It covers all US granted utility patents and assigns CPC codes based on the technology described in each patent.
What is the difference between CPC class and subclass?
A CPC class (e.g., H01) is a broad technology category. Subclasses like H01R provide finer granularity within that category. PlainPatent organizes data at the subclass level (4-character codes) for the most useful view of technology domains.

Read our methodology - how this data is sourced, computed, and verified.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent Editorial

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error.