PlainPatent

CPC technology class · H01

H01R - Electrically-conductive Connections

Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors. 35,523 US utility patents granted 2015–2025, with the leading assignees and year-by-year grant trajectory.

35,523
US patents granted
#3/14
in H01
8.7%
H01 class share
-17%
5-yr velocity

The verdict

According to USPTO PatentsView, Electrically-conductive Connections ranks #48 of 670 CPC technology areas - 35,523 US patents granted since 2015, with recorded grant volume down 17% over five years.

#48
of 670 CPC technology areas
35,523
US patents granted, 2015–2025
Sumitomo Wiring Systems
leading assignee (1,543)
-17%
grant velocity, last 5 yrs

How H01R's grant cadence moved

Between 2020–2024, H01R recorded 13,902 grants versus 16,652 in 2015–2019 (-17% equal-window velocity). Across complete years, output peaked in 2019 at 3,576 grants and bottomed in 2024 at 2,226 (+61% peak-over-trough). Lead assignee Sumitomo Wiring Systems, Ltd. holds 4.3% of the class ; the top three share 10.9%.

Leaderboard read

H01R concentration, lead at 4.3%

Sumitomo Wiring Systems, Ltd. leads this historical grant record at 4.3% of H01R - foreign corporation assignees hold 71% of class grants (17,757 of 25,007). Figures describe granted US utility patents in this CPC subclass, not current investment or legal strength.

Leader's share
4.3%

1,543 of 35,523 grants

Top three share
10.9%

of the class's recorded grants

Lead over #2
61

more grants than Yazaki Corporation

Where H01R sits inside H01

Among 14 subclasses in H01 (Electric Elements), H01R ranks #3 and holds 8.7% of the parent class's 406,481 recorded grants. Sibling chips below are the other subclasses in the same parent class, not the nationwide volume/lead-share peers further down.

H01L 165,178 H01M 63,620 H01Q 29,793 H01J 24,482 H01F 21,711 H01H 14,753 H01B 14,745 H01S 12,879

Rising assignees active in H01R

Company-wide grant multiples (2022–2024 vs 2019–2021) among assignees with ≥5 patents in this subclass. Growth is company-wide; class patent counts are subclass-specific.

  1. #1 LG Energy Solution, Ltd. 770x 2 → 1,539 company-wide · 37 in H01R
  2. #2 Huawei Digital Power Technologies Co., Ltd. 245x 0 → 245 company-wide · 9 in H01R
  3. #3 Proterial, Ltd. 139x 0 → 139 company-wide · 10 in H01R
  4. #4 Kyocera AVX Components Corporation 100x 1 → 100 company-wide · 8 in H01R
  5. #5 TE Connectivity Solutions GmbH 68x 4 → 271 company-wide · 240 in H01R

H01R grants by year, peak 2019 (3,576)

US utility-patent grants per year in H01R, 2015–2025 - recent five years are down 17% versus 2015–2019.

1,5002,0002,5003,0003,5004,000 20152016201720182019202020212022202320242025 1,822

Who leads H01R?

The 12 most active assignees in Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors - wider bars mean more grants

patents

What this shows Sumitomo Wiring… is the most active filer in H01R, holding 1,543 of the 35,523 patents in this class. Concentration at the top signals how contestable this technology area is for new entrants.

Source USPTO PatentsView, granted utility patents As of 2015–2025 grant years
View data table
Top patent holders in CPC subclass H01R
Rank Company Patents in H01R
#1 Sumitomo Wiring Systems, Ltd. 1,543
#2 Yazaki Corporation 1,482
#3 Foxconn Interconnect Technology Limited 847
#4 Sumitomo Electric Industries, Ltd. 729
#5 Autonetworks Technologies, Ltd. 694
#6 Molex, LLC 599
#7 Japan Aviation Electronics Industry, Limited 523
#8 TE Connectivity Co. Ltd. 459
#9 Commscope Technologies LLC 326
#10 Hubbell Incorporated 324
#11 TE Connectivity Germany GmbH 284
#12 Tyco Electronics (Shanghai) Co., Ltd. 279
#13 HON HAI Precision Industry Co., Ltd. 268
#14 Lotes Co., Ltd 260
#15 Aptiv Technologies AG 249
#16 Tyco Electronics Co., Ltd 245
#17 TE Connectivity Solutions GmbH 240
#18 Amphenol Corporation 228
#19 Foxconn (KUNSHAN) Computer Connector Co., Ltd. 221
#20 Phoenix Contact GMBH & Co. KG 219

Footprint here vs. claim strategy

Each dot is a leading H01R assignee, placed by how many patents it holds in this class (horizontal) against its company-wide average claims per patent (vertical) - a read on whether the class is led by broad-but-shallow filers or focused deep-claim players.

Top 14 H01R assignees by class footprint. Bubble size = patents in H01R. Source: USPTO PatentsView (claim depth is company-wide across all classes). Scatter plot of 14 data points (bubble-sized by third dimension). 5101520 0500100015002000 Patents in H01R Avg claims / patent (company-wide) Sumitomo Wiring…YazakiFoxconn Interconnect…Sumitomo Electric…AutonetworksMolexJapan Aviation…Te ConnectivityCommscopeHubbell IncorporatedTe Connectivity…Tyco (Shanghai)Hon Hai Precision…Lotes
Top 14 H01R assignees by class footprint. Bubble size = patents in H01R. Source: USPTO PatentsView (claim depth is company-wide across all classes).

Classes near H01R's 35,523-grant footprint

Nationwide nearest neighbors for H01R (#48 of 670 by volume ; lead share 4.3%) - not the H01 parent-class siblings above.

Nearest by grant volume

G10L 35,471 B01J 35,809 C08L 36,183 Y02B 34,811

Nearest by lead-assignee share

C10K 4.4% B05C 4.3% A23C 4.4% B33Y 4.3%

Questions about H01R

Which company holds the most patents in H01R?
Sumitomo Wiring Systems, Ltd. leads H01R with 1,543 patents (4.3% of the subclass). By PatentsView assignee type, foreign corporations account for 71% of class grants.
Which H01R assignees grew fastest recently?
Among assignees with ≥5 grants in H01R, LG Energy Solution, Ltd. shows the highest company-wide grant multiple (770x: 2 grants in 2019–2021 → 1,539 in 2022–2024) while holding 37 patents in this subclass. Growth is company-wide, not class-only.
How does H01R compare inside parent class H01?
Inside H01 (Electric Elements), H01R ranks #3 of 14 subclasses by grant volume and holds 8.7% of the parent class total. The largest sibling is H01L (165,178 grants).

What to do with this data

H01R in context - here's where to go next.

  • Sumitomo Wiring Systems, Ltd. leads H01R with 1,543 grants in this class. See full portfolio
  • H01R ranks #48 of 670 by grant volume among all tracked CPC technology areas. See the ranking
  • Inside parent class H01, the largest sibling subclass is H01L with 165,178 grants. Explore H01L

Figures reflect USPTO PatentsView grant data through 2026-05-15; pending applications not yet granted are not counted.

Methodology - H01R figures are USPTO PatentsView granted-utility totals for this subclass (35,523 grants in the tracked window).

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error.