CPC technology class · H01

H01B - Cables

Cables; conductors; insulators; selection of materials for their conductive, insulating or dielectric properties. 14,745 US utility patents granted 2015–2025, with the leading assignees and year-by-year grant trajectory.

Compiled by PlainPatent · May 15, 2026

14,745
US patents granted: #8/14
in H01: 3.6%
H01 class share: -8%
5-yr velocity

The verdict

According to USPTO PatentsView, Cables ranks #127 of 670 CPC technology areas - 14,745 US patents granted since 2015, with recorded grant volume down 8% over five years.

#127
of 670 CPC technology areas: 14,745
US patents granted, 2015–2025: Sumitomo Wiring Systems
leading assignee (655): -8%
grant velocity, last 5 yrs

How H01B's grant cadence moved

Between 2020–2024, H01B recorded 5,842 grants versus 6,333 in 2015–2019 (-8% equal-window velocity). Across complete years, output peaked in 2019 at 1,503 grants and bottomed in 2023 at 1,014 (+48% peak-over-trough). Lead assignee Sumitomo Wiring Systems, Ltd. holds 4.4% of the class ; the top three share 11.1%.

Leaderboard read

H01B concentration, lead at 4.4%

Sumitomo Wiring Systems, Ltd. leads this historical grant record at 4.4% of H01B - foreign corporation assignees hold 73% of class grants (5,808 of 7,918). Figures describe granted US utility patents in this CPC subclass, not current investment or legal strength.

Leader's share: 4.4%
Top three share: 11.1%
Lead over #2: 100

Where H01B sits inside H01

Among 14 subclasses in H01 (Electric Elements), H01B ranks #8 and holds 3.6% of the parent class's 406,481 recorded grants. Sibling chips below are the other subclasses in the same parent class, not the nationwide volume/lead-share peers further down.

H01L 165,178 H01M 63,620 H01R 35,523 H01Q 29,793 H01J 24,482 H01F 21,711 H01H 14,753 H01S 12,879

Rising assignees active in H01B

Company-wide grant multiples (2022–2024 vs 2019–2021) among assignees with ≥5 patents in this subclass. Growth is company-wide; class patent counts are subclass-specific.

#1 Proterial, Ltd. 139x 0 → 139 company-wide · 49 in H01B
#2 Hitachi Energy Ltd 120x 0 → 120 company-wide · 22 in H01B
#3 TE Connectivity Solutions GmbH 68x 4 → 271 company-wide · 29 in H01B
#4 Hitachi Energy Switzerland AG 24x 7 → 171 company-wide · 17 in H01B
#5 Innomotics GMBH 16x 0 → 16 company-wide · 6 in H01B

H01B grants by year, peak 2019 (1,503)

US utility-patent grants per year in H01B, 2015–2025 - recent five years are down 8% versus 2015–2019.

Sumitomo Wiring…

655
Sumitomo Electric…

555
Yazaki

431
Autonetworks

378
Hitachi

291
Furukawa Electric

178
Dow Global

170
Nexans

139
E I Du Pont De…

95
Borealis

94
Prysmian S p A

86
Mitsubishi Materials

84

What this shows Sumitomo Wiring… is the most active filer in H01B, holding 655 of the 14,745 patents in this class. Concentration at the top signals how contestable this technology area is for new entrants.

View data table

Top patent holders in CPC subclass H01B
Rank	Company	Patents in H01B
#1	Sumitomo Wiring Systems, Ltd.	655
#2	Sumitomo Electric Industries, Ltd.	555
#3	Yazaki Corporation	431
#4	Autonetworks Technologies, Ltd.	378
#5	Hitachi, Ltd.	291
#6	Furukawa Electric Co., Ltd.	178
#7	DOW Global Technologies LLC	170
#8	Nexans	139
#9	E.I. DU Pont DE Nemours AND Company	95
#10	Borealis AG	94
#11	Prysmian S.p.A.	86
#12	Mitsubishi Materials Corporation	84
#13	Southwire Company, LLC	76
#14	General Cable Technologies Corporation	68
#15	Commscope Technologies LLC	66
#16	Dexerials Corporation	65
#17	Schlumberger Technology Corporation	62
#18	Fujikura Ltd.	59
#19	Idemitsu Kosan Co., Ltd.	57
#20	Encore Wire Corporation	56

Footprint here vs. claim strategy

Each dot is a leading H01B assignee, placed by how many patents it holds in this class (horizontal) against its company-wide average claims per patent (vertical) - a read on whether the class is led by broad-but-shallow filers or focused deep-claim players.

Top 14 H01B assignees by class footprint. Bubble size = patents in H01B. Source: USPTO PatentsView (claim depth is company-wide across all classes).

Classes near H01B's 14,745-grant footprint

Nationwide nearest neighbors for H01B (#127 of 670 by volume ; lead share 4.4%) - not the H01 parent-class siblings above.

Nearest by grant volume

H01H 14,753 F16B 14,787 G01M 14,845 C04B 14,853

Nearest by lead-assignee share

F42B 4.4% B25G 4.4% H03L 4.5% C01G 4.4%

Questions about H01B

Which company holds the most patents in H01B?

Sumitomo Wiring Systems, Ltd. leads H01B with 655 patents (4.4% of the subclass). By PatentsView assignee type, foreign corporations account for 73% of class grants.

Which H01B assignees grew fastest recently?

Among assignees with ≥5 grants in H01B, Proterial, Ltd. shows the highest company-wide grant multiple (139x: 0 grants in 2019–2021 → 139 in 2022–2024) while holding 49 patents in this subclass. Growth is company-wide, not class-only.

How does H01B compare inside parent class H01?

Inside H01 (Electric Elements), H01B ranks #8 of 14 subclasses by grant volume and holds 3.6% of the parent class total. The largest sibling is H01L (165,178 grants).

What to do with this data

H01B in context - here's where to go next.

Sumitomo Wiring Systems, Ltd. leads H01B with 655 grants in this class. See full portfolio
H01B ranks #127 of 670 by grant volume among all tracked CPC technology areas. See the ranking
Inside parent class H01, the largest sibling subclass is H01L with 165,178 grants. Explore H01L

Figures reflect USPTO PatentsView grant data through 2026-05-15; pending applications not yet granted are not counted.

Methodology - H01B figures are USPTO PatentsView granted-utility totals for this subclass (14,745 grants in the tracked window).

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error.