CPC technology class · H01

H01L - Semiconductor Devices Not Covered By Class H10

Semiconductor devices not covered by class h10. 165,178 US utility patents granted 2015–2025, with the leading assignees and year-by-year grant trajectory.

165,178
US patents granted
#1/14
in H01
40.6%
H01 class share
-7%
5-yr velocity

The verdict

According to USPTO PatentsView, Semiconductor Devices Not Covered By Class H10 ranks #5 of 670 CPC technology areas - 165,178 US patents granted since 2015, with recorded grant volume down 7% over five years.

#5
of 670 CPC technology areas
165,178
US patents granted, 2015–2025
Taiwan Semiconductor…
leading assignee (19,657)
-7%
grant velocity, last 5 yrs

How H01L's grant cadence moved

Between 2020–2024, H01L recorded 71,055 grants versus 76,350 in 2015–2019 (-7% equal-window velocity). Across complete years, output peaked in 2019 at 15,944 grants and bottomed in 2023 at 13,284 (+20% peak-over-trough). Lead assignee Taiwan Semiconductor Manufacturing Company Ltd. holds 11.9% of the class ; the top three share 22.8%.

Leaderboard read

H01L concentration, lead at 11.9%

Taiwan Semiconductor Manufacturing Company Ltd. leads this historical grant record at 11.9% of H01L - foreign corporation assignees hold 70% of class grants (106,767 of 153,513). Figures describe granted US utility patents in this CPC subclass, not current investment or legal strength.

Leader's share
11.9%

19,657 of 165,178 grants

Top three share
22.8%

of the class's recorded grants

Lead over #2
8,995

more grants than Samsung Electronics Co., Ltd.

Where H01L sits inside H01

Among 14 subclasses in H01 (Electric Elements), H01L ranks #1 and holds 40.6% of the parent class's 406,481 recorded grants. Sibling chips below are the other subclasses in the same parent class, not the nationwide volume/lead-share peers further down.

Rising assignees active in H01L

Company-wide grant multiples (2022–2024 vs 2019–2021) among assignees with ≥5 patents in this subclass. Growth is company-wide; class patent counts are subclass-specific.

  1. #1 Meta Platforms Technologies, LLC 1285x 0 → 1,285 company-wide · 70 in H01L
  2. #2 Resonac Corporation 192x 0 → 192 company-wide · 75 in H01L
  3. #3 Wuhan Tianma Microelectronics Co., Ltd. Shanghai Branch 142x 0 → 142 company-wide · 6 in H01L
  4. #4 Hitachi Energy Ltd 120x 0 → 120 company-wide · 15 in H01L
  5. #5 Zhejiang LAB 115x 0 → 115 company-wide · 6 in H01L

H01L grants by year, peak 2019 (15,944)

US utility-patent grants per year in H01L, 2015–2025 - recent five years are down 7% versus 2015–2019.

10,00012,00014,00016,00018,000 20152016201720182019202020212022202320242025 11,106

Who leads H01L?

The 12 most active assignees in Semiconductor Devices NOT Covered BY Class H10 - wider bars mean more grants

patents

What this shows Taiwan Semiconductor… is the most active filer in H01L, holding 19,657 of the 165,178 patents in this class. Concentration at the top signals how contestable this technology area is for new entrants.

Source USPTO PatentsView, granted utility patents As of 2015–2025 grant years
View data table

Footprint here vs. claim strategy

Each dot is a leading H01L assignee, placed by how many patents it holds in this class (horizontal) against its company-wide average claims per patent (vertical) - a read on whether the class is led by broad-but-shallow filers or focused deep-claim players.

Top 14 H01L assignees by class footprint. Bubble size = patents in H01L. Source: USPTO PatentsView (claim depth is company-wide across all classes). Scatter plot of 14 data points (bubble-sized by third dimension). 10121416182022 0500010000150002000025000 Patents in H01L Avg claims / patent (company-wide) Taiwan Semiconductor…SamsungInternational…Applied MaterialsIntelTokyo ElectronMicron TechnologyGlobalfoundriesInfineonUnited Microelectronic…Texas Instruments…Sk hynixSemiconductor Energy…Boe Technology Group
Top 14 H01L assignees by class footprint. Bubble size = patents in H01L. Source: USPTO PatentsView (claim depth is company-wide across all classes).

Classes near H01L's 165,178-grant footprint

Nationwide nearest neighbors for H01L (#5 of 670 by volume ; lead share 11.9%) - not the H01 parent-class siblings above.

Questions about H01L

Which company holds the most patents in H01L?
Taiwan Semiconductor Manufacturing Company Ltd. leads H01L with 19,657 patents (11.9% of the subclass). By PatentsView assignee type, foreign corporations account for 70% of class grants.
Which H01L assignees grew fastest recently?
Among assignees with ≥5 grants in H01L, Meta Platforms Technologies, LLC shows the highest company-wide grant multiple (1285x: 0 grants in 2019–2021 → 1,285 in 2022–2024) while holding 70 patents in this subclass. Growth is company-wide, not class-only.
How does H01L compare inside parent class H01?
Inside H01 (Electric Elements), H01L ranks #1 of 14 subclasses by grant volume and holds 40.6% of the parent class total. The largest sibling is H01M (63,620 grants).

What to do with this data

H01L in context - here's where to go next.

  • Taiwan Semiconductor Manufacturing Company Ltd. leads H01L with 19,657 grants in this class. See full portfolio
  • H01L ranks #5 of 670 by grant volume among all tracked CPC technology areas. See the ranking
  • Inside parent class H01, the largest sibling subclass is H01M with 63,620 grants. Explore H01M

Figures reflect USPTO PatentsView grant data through 2026-05-15; pending applications not yet granted are not counted.

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error.