CPC technology class · H01
H01L - Semiconductor Devices Not Covered By Class H10
Semiconductor devices not covered by class h10. 165,178 US utility patents granted 2015–2025, with the leading assignees and year-by-year grant trajectory.
- 165,178
- US patents granted
- #1/14
- in H01
- 40.6%
- H01 class share
- -7%
- 5-yr velocity
The verdict
According to USPTO PatentsView, Semiconductor Devices Not Covered By Class H10 ranks #5 of 670 CPC technology areas - 165,178 US patents granted since 2015, with recorded grant volume down 7% over five years.
- #5
- of 670 CPC technology areas
- 165,178
- US patents granted, 2015–2025
- Taiwan Semiconductor…
- leading assignee (19,657)
- -7%
- grant velocity, last 5 yrs
How H01L's grant cadence moved
Between 2020–2024, H01L recorded 71,055 grants versus 76,350 in 2015–2019 (-7% equal-window velocity). Across complete years, output peaked in 2019 at 15,944 grants and bottomed in 2023 at 13,284 (+20% peak-over-trough). Lead assignee Taiwan Semiconductor Manufacturing Company Ltd. holds 11.9% of the class ; the top three share 22.8%.
Leaderboard read
H01L concentration, lead at 11.9%
Taiwan Semiconductor Manufacturing Company Ltd. leads this historical grant record at 11.9% of H01L - foreign corporation assignees hold 70% of class grants (106,767 of 153,513). Figures describe granted US utility patents in this CPC subclass, not current investment or legal strength.
- Leader's share
- 11.9%
- Top three share
- 22.8%
- Lead over #2
- 8,995
19,657 of 165,178 grants
of the class's recorded grants
more grants than Samsung Electronics Co., Ltd.
Where H01L sits inside H01
Among 14 subclasses in H01 (Electric Elements), H01L ranks #1 and holds 40.6% of the parent class's 406,481 recorded grants. Sibling chips below are the other subclasses in the same parent class, not the nationwide volume/lead-share peers further down.
Rising assignees active in H01L
Company-wide grant multiples (2022–2024 vs 2019–2021) among assignees with ≥5 patents in this subclass. Growth is company-wide; class patent counts are subclass-specific.
- #1 Meta Platforms Technologies, LLC 1285x 0 → 1,285 company-wide · 70 in H01L
- #2 Resonac Corporation 192x 0 → 192 company-wide · 75 in H01L
- #3 Wuhan Tianma Microelectronics Co., Ltd. Shanghai Branch 142x 0 → 142 company-wide · 6 in H01L
- #4 Hitachi Energy Ltd 120x 0 → 120 company-wide · 15 in H01L
- #5 Zhejiang LAB 115x 0 → 115 company-wide · 6 in H01L
H01L grants by year, peak 2019 (15,944)
US utility-patent grants per year in H01L, 2015–2025 - recent five years are down 7% versus 2015–2019.
Who leads H01L?
The 12 most active assignees in Semiconductor Devices NOT Covered BY Class H10 - wider bars mean more grants
- Taiwan Semiconductor…
Taiwan Semiconductor Manufacturing Company Ltd.
19,657 patents
- Samsung
Samsung Electronics Co., Ltd.
10,662 patents
- International… 7,298
International Business Machines Corporation
7,298 patents
- Applied Materials 4,095
Applied Materials, Inc.
4,095 patents
- Intel 4,089
Intel Corporation
4,089 patents
- Tokyo Electron 3,737
Tokyo Electron Limited
3,737 patents
- Micron Technology 3,107
Micron Technology, Inc.
3,107 patents
- Globalfoundries 2,756
GlobalFoundries Inc.
2,756 patents
- Infineon 2,127
Infineon Technologies AG
2,127 patents
- United Microelectronic… 1,985
United Microelectronics Corp.
1,985 patents
- Texas Instruments… 1,812
Texas Instruments Incorporated
1,812 patents
- Sk hynix 1,653
SK hynix Inc.
1,653 patents
What this shows Taiwan Semiconductor… is the most active filer in H01L, holding 19,657 of the 165,178 patents in this class. Concentration at the top signals how contestable this technology area is for new entrants.
View data table
| Rank | Company | Patents in H01L |
|---|---|---|
| #1 | Taiwan Semiconductor Manufacturing Company Ltd. | 19,657 |
| #2 | Samsung Electronics Co., Ltd. | 10,662 |
| #3 | International Business Machines Corporation | 7,298 |
| #4 | Applied Materials, Inc. | 4,095 |
| #5 | Intel Corporation | 4,089 |
| #6 | Tokyo Electron Limited | 3,737 |
| #7 | Micron Technology, Inc. | 3,107 |
| #8 | GlobalFoundries Inc. | 2,756 |
| #9 | Infineon Technologies AG | 2,127 |
| #10 | United Microelectronics Corp. | 1,985 |
| #11 | Texas Instruments Incorporated | 1,812 |
| #12 | SK hynix Inc. | 1,653 |
| #13 | Semiconductor Energy Laboratory Co., Ltd. | 1,630 |
| #14 | BOE Technology Group Co., Ltd. | 1,578 |
| #15 | Renesas Electronics Corporation | 1,542 |
| #16 | Kabushiki Kaisha Toshiba | 1,532 |
| #17 | Mitsubishi Electric Corporation | 1,396 |
| #18 | Lam Research Corporation | 1,341 |
| #19 | Fuji Electric Co., Ltd. | 1,285 |
| #20 | Nichia Corporation | 1,186 |
Footprint here vs. claim strategy
Each dot is a leading H01L assignee, placed by how many patents it holds in this class (horizontal) against its company-wide average claims per patent (vertical) - a read on whether the class is led by broad-but-shallow filers or focused deep-claim players.
Classes near H01L's 165,178-grant footprint
Nationwide nearest neighbors for H01L (#5 of 670 by volume ; lead share 11.9%) - not the H01 parent-class siblings above.
Nearest by grant volume
Nearest by lead-assignee share
Questions about H01L
Which company holds the most patents in H01L?
Which H01L assignees grew fastest recently?
How does H01L compare inside parent class H01?
What to do with this data
H01L in context - here's where to go next.
- Taiwan Semiconductor Manufacturing Company Ltd. leads H01L with 19,657 grants in this class. See full portfolio
- H01L ranks #5 of 670 by grant volume among all tracked CPC technology areas. See the ranking
- Inside parent class H01, the largest sibling subclass is H01M with 63,620 grants. Explore H01M
Figures reflect USPTO PatentsView grant data through 2026-05-15; pending applications not yet granted are not counted.
Methodology - H01L figures are USPTO PatentsView granted-utility totals for this subclass (165,178 grants in the tracked window).
Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error.