CPC technology class · H01
H01L - Semiconductor Devices NOT Covered BY Class H10
Semiconductor devices not covered by class h10. 165,178 US utility patents granted 2015–2025, with the leading assignees and year-by-year filing trajectory.
- 165,178
- US patents granted
- H01
- Parent CPC class
- 20
- Active assignees
- +8%
- 5-yr velocity
The verdict
Semiconductor Devices NOT Covered BY Class H10 ranks #5 of 670 CPC technology areas - 165,178 US patents granted since 2015, with filing up 8% over five years.
- #5
- of 670 CPC technology areas
- 165,178
- US patents granted, 2015–2025
- Taiwan Semiconductor…
- leading assignee (19,657)
- +8%
- filing velocity, last 5 yrs
CPC subclass H01L - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10 - covers 165,178 US utility patents granted between 2015 and 2025 according to USPTO PatentsView records, within the broader CPC class H01 (ELECTRIC ELEMENTS). See our CPC classification guide for how the system works.
The competitive landscape in H01L is shaped by 20 distinct companies actively filing in this space. Taiwan Semiconductor Manufacturing Company Ltd. leads with 19,657 patents, followed by Samsung Electronics Co., Ltd. at 10,662 grants and International Business Machines Corporation at 7,298.
Filing activity in H01L is up 8% over the past five years versus 2015-2019, a relatively steady filing pace. All counts come directly from USPTO PatentsView and reflect US granted utility patents only.
Is H01L innovation accelerating?
US utility-patent grants per year in H01L, 2015–2025 - recent five years are up 8% versus 2015–2019.
Who leads H01L?
The 12 most active assignees in SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10 - wider bars mean more grants
- Taiwan Semiconductor…
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
19,657 patents
- Samsung
SAMSUNG ELECTRONICS CO., LTD.
10,662 patents
- International Busines… 7,298
International Business Machines Corporation
7,298 patents
- Applied Materials 4,095
Applied Materials, Inc.
4,095 patents
- Intel 4,089
Intel Corporation
4,089 patents
- Tokyo Electron 3,737
TOKYO ELECTRON LIMITED
3,737 patents
- Micron Technology 3,107
Micron Technology, Inc.
3,107 patents
- Globalfoundries 2,756
GlobalFoundries Inc.
2,756 patents
- Infineon 2,127
Infineon Technologies AG
2,127 patents
- United Microelectroni… 1,985
UNITED MICROELECTRONICS CORP.
1,985 patents
- Texas Instruments Inc… 1,812
TEXAS INSTRUMENTS INCORPORATED
1,812 patents
- Sk hynix 1,653
SK hynix Inc.
1,653 patents
What this shows Taiwan Semiconductor… is the most active filer in H01L, holding 19,657 of the 165,178 patents in this class. Concentration at the top signals how contestable this technology area is for new entrants.
View data table
| Rank | Company | Patents in H01L |
|---|---|---|
| #1 | Taiwan Semiconductor Manufacturing Company Ltd. | 19,657 |
| #2 | Samsung Electronics Co., Ltd. | 10,662 |
| #3 | International Business Machines Corporation | 7,298 |
| #4 | Applied Materials, Inc. | 4,095 |
| #5 | Intel Corporation | 4,089 |
| #6 | Tokyo Electron Limited | 3,737 |
| #7 | Micron Technology, Inc. | 3,107 |
| #8 | Globalfoundries Inc. | 2,756 |
| #9 | Infineon Technologies Ag | 2,127 |
| #10 | United Microelectronics Corp. | 1,985 |
| #11 | Texas Instruments Incorporated | 1,812 |
| #12 | SK Hynix Inc. | 1,653 |
| #13 | Semiconductor Energy Laboratory Co., Ltd. | 1,630 |
| #14 | BOE Technology Group Co., Ltd. | 1,578 |
| #15 | Renesas Electronics Corporation | 1,542 |
| #16 | Kabushiki Kaisha Toshiba | 1,532 |
| #17 | Mitsubishi Electric Corporation | 1,396 |
| #18 | Lam Research Corporation | 1,341 |
| #19 | FUJI Electric Co., Ltd. | 1,285 |
| #20 | Nichia Corporation | 1,186 |
About This Class
CPC subclass H01L belongs to class H01.
165,178 patents were granted in this class between 2015 and 2025.
20 companies actively patent in this space.
Classification System
Cooperative Patent Classification (CPC) is a hierarchical patent classification system used by the USPTO and EPO.
Footprint here vs. claim strategy
Each dot is a leading H01L assignee, placed by how many patents it holds in this class (horizontal) against its company-wide average claims per patent (vertical) - a read on whether the class is led by broad-but-shallow filers or focused deep-claim players.
Top 14 H01L assignees by class footprint. Bubble size = patents in H01L. Source: USPTO PatentsView (claim depth is company-wide across all classes).
Frequently Asked Questions
What is CPC class H01L?
How many patents have been filed in H01L?
Which company holds the most patents in H01L?
How is patent data for H01L collected?
What is the difference between CPC class and subclass?
Read our methodology - how this data is sourced, computed, and verified.
Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error.