Where does Tyco Electronics (Shanghai) Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Tyco Electronics (Shanghai) Co., Ltd. ranks #913 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Tyco Electronics (Shanghai) Co., Ltd. hold?

Tyco Electronics (Shanghai) Co., Ltd. holds 489 US utility patents granted between 2015 and 2025, spanning 119 technology areas.

What is Tyco Electronics (Shanghai) Co., Ltd.'s Innovation Score?

Tyco Electronics (Shanghai) Co., Ltd. has an Innovation Score of 62.8 out of 100 (top 2% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Tyco Electronics (Shanghai) Co., Ltd.'s patent grant rate increasing or decreasing?

Tyco Electronics (Shanghai) Co., Ltd.'s recent grant velocity is +77% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Tyco Electronics (Shanghai) Co., Ltd.'s patents?

Tyco Electronics (Shanghai) Co., Ltd.'s patents average 18.2 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Tyco Electronics (Shanghai) Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Tyco Electronics (Shanghai) Co., Ltd.

Q: What technology areas does Tyco Electronics (Shanghai) Co., Ltd. focus on?

Tyco Electronics (Shanghai) Co., Ltd.'s top technology area is H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors) with 279 patents. Grants appear in 119 CPC subclasses total.

USPTO PatentsView assignee record - 489 granted patents across 119 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Tyco ranks #913 of 49,997 tracked US assignees by granted-patent volume, with 489 patents across 119 technology areas.

#913
of 49,997 US assignees by volume: Top 2%
by Innovation Score (62.8/100): 18.2
avg claims per patent: +77%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R913 · Foreign Corporation #913 · 489 grants

GRANTS-MID · TOP-DECILE · PHOTO-FINISH · CPC-WIDE · INNOV-STRONG · CLAIMS-RICH · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-MID 489 grants
TOP-DECILE #913/49,997
PHOTO-FINISH Wistron Neweb
CPC-WIDE H01R · 119 areas
INNOV-STRONG 62.8/100
CLAIMS-RICH 18.2 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +77% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Wistron Neweb Corp. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
AGC · near

63
Dow Silicones · near

63
Autoliv ASP · near

63
Tyco (Shanghai) · this assignee

63
Vanderbilt University · near

63
3D Lighting… · lowest

7

What this shows Tyco's Innovation Score is 62.8/100 (top 2% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

How Tyco's grant cadence moved

Between 2020–2024, Tyco Electronics (Shanghai) Co., Ltd. received 283 grants versus 160 in 2015–2019 (+77% equal-window velocity, above median growth). Across complete PatentsView years, output peaked in 2021 at 71 grants and bottomed in 2015 at 9. Lead class H01R accounts for 57.1% of the portfolio across 119 subclasses. Volume neighbours: Analog Devices Global Unlimited Company (#909) and Abbott Laboratories (#917).

Tyco's three-year grant acceleration

From 2019–2021 to 2022–2024, Tyco Electronics (Shanghai) Co., Ltd. moved from 184 to 150 grants (0.81x the prior three-year total, a multiple, not a CAGR). Among 3,296 tracked assignees with ≥100 grants and ≥20 prior-period grants, that multiple ranks #1,790. See the growth leaderboard.

Analog Devices Gl…

493
Fitbit

492
Inphi

491
Omachron Intellec…

491
Wistron Neweb

489
Tyco (Shanghai) ◀

489
Biomet Manufactur…

488
University-indust…

488
Abbott Laboratori…

485

What this shows Tyco holds 489 patents at rank #913, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Tyco

By rank, the assignees closest to #913 in granted patent volume.

Leaders in H01R (Electrically-conductive Connections)

Other assignees with the most granted patents in Tyco's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Tyco, neither rank-band nor same-CPC leaders (those blocks stay above).

Similar innovation score

Nearest assignees by Innovation Score (63 here).

Vanderbilt University 63 Autoliv ASP, Inc. 63 Dow Silicones Corporation 63 AGC Inc. 63

Similar claim depth

Nearest assignees by average claims per patent (18.2 here).

Taylor Made Golf Company, Inc. 18.2 avg Globalfoundries U.S. Inc. 18.2 avg Invista North America S.a.r.l. 18.2 avg Fidelity Information Services, LLC 18.2 avg

Tyco's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

63 Top 2% higher than 98% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Tyco Electronics (Shanghai) Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	9	1.8%
2016	14	2.9%
2017	44	9.0%
2018	42	8.6%
2019	51	10.4%
2020	62	12.7%
2021	71	14.5%
2022	42	8.6%
2023	53	10.8%
2024	55	11.2%
2025partial year	46	9.4%

Which technologies does Tyco Electronics (Shanghai) Co., Ltd. patent most?

H01R - Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors 279

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 67

G02B - Optical Elements, Systems OR Apparatus 40

H01B - CABLES; CONDUCTORS; INSULATORS; Selection OF Materials FOR Their Conductive, Insulating OR Dielectric Properties 26

H02G - Installation OF Electric Cables OR Lines, OR OF Combined Optical AND Electric Cables OR Lines 24

B25J - MANIPULATORS; Chambers Provided With Manipulation Devices 23

B65G - Transport OR Storage Devices, e.g. Conveyors FOR Loading OR Tipping, Shop Conveyor Systems OR Pneumatic Tube Conveyors 20

Y02E - Reduction OF Greenhouse GAS [GHG] Emissions, Related TO Energy Generation, Transmission OR Distribution 17

G01N - Investigating OR Analysing Materials BY Determining Their Chemical OR Physical Properties 17

G01K - Measuring TEMPERATURE; Measuring Quantity OF HEAT; Thermally-sensitive Elements NOT Otherwise Provided FOR 16

H01L - Semiconductor Devices NOT Covered BY Class H10 16

G01R - Measuring Electric VARIABLES; Measuring Magnetic Variables 13

H02J - Circuit Arrangements OR Systems FOR Supplying OR Distributing Electric POWER; Systems FOR Storing Electric Energy 13

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 12

Y10T - Technical Subjects Covered BY Former US Classification 12

Top 15 of 119 technology areas

Where it ranks

Overall rank by patents

#913

of 49,997 tracked assignees

Innovation Score

62.8 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Tyco Electronics (Shanghai) Co., Ltd.'s patent record in context - here's where to go next.

Tyco Electronics (Shanghai) Co., Ltd.'s lead technology class is H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors), 57.1% of its portfolio - see every assignee active in that class. Explore H01R
Ranked #913 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Tyco Electronics (Shanghai) Co., Ltd. against Analog Devices Global Unlimited Company, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 62.8/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.