Where does D2S, Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), D2S, Inc. ranks #5,353 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does D2S, Inc. hold?

D2S, Inc. holds 64 US utility patents granted between 2015 and 2025, spanning 15 technology areas.

What is D2S, Inc.'s Innovation Score?

D2S, Inc. has an Innovation Score of 46.1 out of 100 (top 22% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is D2S, Inc.'s patent grant rate increasing or decreasing?

D2S, Inc.'s recent grant velocity is -44% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for D2S, Inc.'s patents?

D2S, Inc.'s patents average 15.8 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the D2S, Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView US Corporation

D2S, Inc.

Q: What technology areas does D2S, Inc. focus on?

D2S, Inc.'s top technology area is G03F (Photomechanical Production OF Textured OR Patterned Surfaces, e.g. FOR Printing, FOR Processing OF Semiconductor DEVICES; Materials THEREFOR; Originals THEREFOR; Apparatus Specially Adapted THEREFOR;) with 54 patents, ranking #38 of 595 assignees active in that subclass. Grants appear in 15 CPC subclasses total.

USPTO PatentsView assignee record - 64 granted patents across 15 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: G03F (Photomechanical Production OF Textured OR Patterned Surfaces, e.g. FOR Printing, FOR Processing OF Semiconductor DEVICES; Materials THEREFOR; Originals THEREFOR; Apparatus Specially Adapted THEREFOR;).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, D2S ranks #5,353 of 49,997 tracked US assignees by granted-patent volume, with 64 patents across 15 technology areas.

#5,353
of 49,997 US assignees by volume: Top 22%
by Innovation Score (46.1/100): 15.8
avg claims per patent: -44%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R5353 · US Corporation #5,353 · 64 grants

GRANTS-SMALL · UPPER-Q · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-RICH · TYPE-USCORP · VEL-DROP · BOOK-FULL

GRANTS-SMALL 64 grants
UPPER-Q #5,353/49,997
PHOTO-FINISH CalAmp
CPC-FOCUS G03F · 15 areas
INNOV-PAR 46.1/100
CLAIMS-RICH 15.8 claims/avg
TYPE-USCORP US Corporation
VEL-DROP -44% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: CalAmp Corp (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How D2S’s 46.1 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 14.4 pts (31%) Velocity 8.5 pts (18%) Breadth 13.7 pts (30%) Claim depth 9.5 pts (21%)

Qualcomm Incorporated · highest

85
D2S · this assignee

46
Polygroup Macau (BVI) · near

46
Sapien Semiconductors · near

46
Superior Industries · near

46
Trisa Holding · near

46
3D Lighting… · lowest

7

What this shows D2S's Innovation Score is 46.1/100 (top 22% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for D2S?

Each dot is one of D2S’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). D2S’s own 15.8 claims/patent is ABOVE the 11.3 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

D2S vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where D2S's grants concentrate

D2S, Inc. is a focused PatentsView assignee: 15 CPC subclasses with 84.4% of grants classified under G03F (Photomechanical Production OF Textured OR Patterned Surfaces, e.g. FOR Printing, FOR Processing OF Semiconductor DEVICES; Materials THEREFOR; Originals THEREFOR; Apparatus Specially Adapted THEREFOR;). Peak complete grant year is 2016 (14 grants) versus a trough of 2 in 2020. By volume, D2S sits between CalAmp Corp and Fast IP, LLC.

D2S's three-year grant acceleration

D2S, Inc. shows 14 grants in 2022–2024 against only 11 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Calamp

64
Canopy Growth

64
Capsugel Belgium

64
Continental Auton…

64
Detnet South Afri…

64
Dowa Metaltech

64
Danco

64
Fast IP

64
D2S ◀

64

What this shows D2S holds 64 patents at rank #5,353, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near D2S

By rank, the assignees closest to #5,353 in granted patent volume.

Leaders in G03F (Photomechanical Production OF Textured OR Patterned Surfaces)

Other assignees with the most granted patents in D2S's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for D2S, neither rank-band nor same-CPC leaders (those blocks stay above). In G03F (Photomechanical Production OF Textured OR Patterned Surfaces), D2S ranks #38 of 595 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (46 here).

Superior Industries, Inc. 46 Polygroup Macau Limited (BVI) 46 Trisa Holding AG 46 Sapien Semiconductors Inc. 46

Similar claim depth

Nearest assignees by average claims per patent (15.8 here).

Hydac Technology GMBH 15.8 avg Adient Luxembourg Holding S.a.r.l. 15.8 avg The University of Melbourne 15.8 avg Akzo Nobel Coatings International B.V. 15.8 avg

D2S's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

46 Top 22% higher than 78% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

D2S, Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	11	17.2%
2016	14	21.9%
2017	3	4.7%
2018	3	4.7%
2019	5	7.8%
2020	2	3.1%
2021	4	6.3%
2022	3	4.7%
2023	6	9.4%
2024	5	7.8%
2025partial year	8	12.5%

Which technologies does D2S, Inc. patent most?

G03F - Photomechanical Production OF Textured OR Patterned Surfaces, e.g. FOR Printing, FOR Processing OF Semiconductor DEVICES; Materials THEREFOR; Originals THEREFOR; Apparatus Specially Adapted THEREFOR; 54

H01J - Electric Discharge Tubes OR Discharge Lamps 41

G06F - Electric Digital Data Processing 39

B82Y - Specific Uses OR Applications OF NANOSTRUCTURES; Measurement OR Analysis OF NANOSTRUCTURES; Manufacture OR Treatment OF Nanostructures 8

Y10S - Technical Subjects Covered BY Former Uspc Cross-reference ART Collections [XRACs] AND Digests 7

G06N - Computing Arrangements Based ON Specific Computational Models 5

G05B - Control OR Regulating Systems IN GENERAL; Functional Elements OF Such SYSTEMS; Monitoring OR Testing Arrangements FOR Such Systems OR Elements 4

G06T - Image Data Processing OR Generation, IN General 4

H01L - Semiconductor Devices NOT Covered BY Class H10 3

G21K - Techniques FOR Handling Particles OR Ionising Radiation NOT Otherwise Provided FOR; Irradiation DEVICES; Gamma RAY OR X-ray Microscopes 2

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 2

H10D - Inorganic Electric Semiconductor Devices 2

Y10T - Technical Subjects Covered BY Former US Classification 1

H10B - Electronic Memory Devices 1

G06V - Image OR Video Recognition OR Understanding 1

Top 15 of 15 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

D2S, Inc.'s patent record in context - here's where to go next.

D2S, Inc.'s lead technology class is G03F (Photomechanical Production OF Textured OR Patterned Surfaces, e.g. FOR Printing, FOR Processing OF Semiconductor DEVICES; Materials THEREFOR; Originals THEREFOR; Apparatus Specially Adapted THEREFOR;), 84.4% of its portfolio - see every assignee active in that class. Explore G03F
Ranked #5,353 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare D2S, Inc. against CalAmp Corp, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 46.1/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.