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CPC technology class ·

H10B - Electronic Memory Devices

Electronic memory devices. 31,904 US utility patents granted 2015–2025, with the leading assignees and year-by-year grant trajectory.

31,904
US patents granted
#1/1
in
100.0%
class share
+21%
5-yr velocity

The verdict

According to USPTO PatentsView, Electronic Memory Devices ranks #59 of 670 CPC technology areas - 31,904 US patents granted since 2015, with recorded grant volume up 21% over five years.

#59
of 670 CPC technology areas
31,904
US patents granted, 2015–2025
Samsung
leading assignee (3,987)
+21%
grant velocity, last 5 yrs

How H10B's grant cadence moved

Between 2020–2024, H10B recorded 15,524 grants versus 12,798 in 2015–2019 (+21% equal-window velocity). Across complete years, output peaked in 2024 at 3,299 grants and bottomed in 2018 at 2,348 (+41% peak-over-trough). Lead assignee Samsung Electronics Co., Ltd. holds 12.5% of the class ; the top three share 32.6%.

Leaderboard read

H10B concentration, lead at 12.5%

Samsung Electronics Co., Ltd. leads this historical grant record at 12.5% of H10B - foreign corporation assignees hold 68% of class grants (20,179 of 29,732). Figures describe granted US utility patents in this CPC subclass, not current investment or legal strength.

Leader's share
12.5%

3,987 of 31,904 grants

Top three share
32.6%

of the class's recorded grants

Lead over #2
618

more grants than Taiwan Semiconductor Manufacturing Company Ltd.

Rising assignees active in H10B

Company-wide grant multiples (2022–2024 vs 2019–2021) among assignees with ≥5 patents in this subclass. Growth is company-wide; class patent counts are subclass-specific.

  1. #1 Adeia Semiconductor Bonding Technologies Inc. 90x 0 → 90 company-wide · 10 in H10B
  2. #2 Changxin Memory Technologies, Inc. 63x 17 → 1,066 company-wide · 565 in H10B
  3. #3 Lodestar Licensing Group LLC 45x 0 → 45 company-wide · 21 in H10B
  4. #4 Tsmc Nanjing Company, Limited 21x 3 → 62 company-wide · 8 in H10B
  5. #5 Kepler Computing Inc. 18x 12 → 213 company-wide · 189 in H10B

H10B grants by year, peak 2024 (3,299)

US utility-patent grants per year in H10B, 2015–2025 - recent five years are up 21% versus 2015–2019.

2,0002,5003,0003,500 20152016201720182019202020212022202320242025 2,657

Who leads H10B?

The 12 most active assignees in Electronic Memory Devices - wider bars mean more grants

patents

What this shows Samsung is the most active filer in H10B, holding 3,987 of the 31,904 patents in this class. Concentration at the top signals how contestable this technology area is for new entrants.

Source USPTO PatentsView, granted utility patents As of 2015–2025 grant years
View data table
Top patent holders in CPC subclass H10B
Rank Company Patents in H10B
#1 Samsung Electronics Co., Ltd. 3,987
#2 Taiwan Semiconductor Manufacturing Company Ltd. 3,369
#3 Micron Technology, Inc. 3,035
#4 SK hynix Inc. 1,982
#5 Sandisk Technologies, Inc. 1,395
#6 International Business Machines Corporation 1,197
#7 United Microelectronics Corp. 1,112
#8 Toshiba Memory Corporation 1,090
#9 Kioxia Corporation 903
#10 Semiconductor Energy Laboratory Co., Ltd. 822
#11 Kabushiki Kaisha Toshiba 820
#12 Yangtze Memory Technologies Co., Ltd. 687
#13 Intel Corporation 682
#14 Changxin Memory Technologies, Inc. 565
#15 Macronix International Co., Ltd. 530
#16 Nanya Technology Corporation 463
#17 Renesas Electronics Corporation 435
#18 GlobalFoundries Inc. 320
#19 GlobalFoundries Singapore Pte. Ltd. 298
#20 Fujian Jinhua Integrated Circuit Co., Ltd. 285

Footprint here vs. claim strategy

Each dot is a leading H10B assignee, placed by how many patents it holds in this class (horizontal) against its company-wide average claims per patent (vertical) - a read on whether the class is led by broad-but-shallow filers or focused deep-claim players.

Top 14 H10B assignees by class footprint. Bubble size = patents in H10B. Source: USPTO PatentsView (claim depth is company-wide across all classes). Scatter plot of 14 data points (bubble-sized by third dimension). 10121416182022 010002000300040005000 Patents in H10B Avg claims / patent (company-wide) SamsungTaiwan Semiconductor…Micron TechnologySk hynixSandiskInternational…United Microelectronic…Toshiba MemoryKioxiaSemiconductor Energy…ToshibaYangtze MemoryIntelChangxin Memory
Top 14 H10B assignees by class footprint. Bubble size = patents in H10B. Source: USPTO PatentsView (claim depth is company-wide across all classes).

Classes near H10B's 31,904-grant footprint

Nationwide nearest neighbors for H10B (#59 of 670 by volume ; lead share 12.5%) - not the parent-class siblings above.

Nearest by grant volume

C12Q 32,189 G01C 32,360 Y02A 32,476 C07C 32,521

Nearest by lead-assignee share

D06B 12.5% B42C 12.5% A41C 12.6% F42C 12.4%

Questions about H10B

Which company holds the most patents in H10B?
Samsung Electronics Co., Ltd. leads H10B with 3,987 patents (12.5% of the subclass). By PatentsView assignee type, foreign corporations account for 68% of class grants.
Which H10B assignees grew fastest recently?
Among assignees with ≥5 grants in H10B, Adeia Semiconductor Bonding Technologies Inc. shows the highest company-wide grant multiple (90x: 0 grants in 2019–2021 → 90 in 2022–2024) while holding 10 patents in this subclass. Growth is company-wide, not class-only.

What to do with this data

H10B in context - here's where to go next.

Figures reflect USPTO PatentsView grant data through 2026-05-15; pending applications not yet granted are not counted.

Methodology - H10B figures are USPTO PatentsView granted-utility totals for this subclass (31,904 grants in the tracked window).

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error.