Where does Nippon Light Metal Company, Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Nippon Light Metal Company, Ltd. ranks #2,461 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Nippon Light Metal Company, Ltd. hold?

Nippon Light Metal Company, Ltd. holds 159 US utility patents granted between 2015 and 2025, spanning 69 technology areas.

What is Nippon Light Metal Company, Ltd.'s Innovation Score?

Nippon Light Metal Company, Ltd. has an Innovation Score of 54.5 out of 100 (top 8% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Nippon Light Metal Company, Ltd.'s patent grant rate increasing or decreasing?

Nippon Light Metal Company, Ltd.'s recent grant velocity is -35% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Nippon Light Metal Company, Ltd.'s patents?

Nippon Light Metal Company, Ltd.'s patents average 8.3 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Nippon Light Metal Company, Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Nippon Light Metal Company, Ltd.

Q: What technology areas does Nippon Light Metal Company, Ltd. focus on?

Nippon Light Metal Company, Ltd.'s top technology area is B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam) with 48 patents. Grants appear in 69 CPC subclasses total.

USPTO PatentsView assignee record - 159 granted patents across 69 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Nippon ranks #2,461 of 49,997 tracked US assignees by granted-patent volume, with 159 patents across 69 technology areas.

#2,461
of 49,997 US assignees by volume: Top 8%
by Innovation Score (54.5/100): 8.3
avg claims per patent: -35%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R2461 · Foreign Corporation #2,461 · 159 grants

GRANTS-MID · TOP-DECILE · PHOTO-FINISH · CPC-WIDE · INNOV-PAR · CLAIMS-PAR · TYPE-FRNCORP · VEL-DOWN · BOOK-FULL

GRANTS-MID 159 grants
TOP-DECILE #2,461/49,997
PHOTO-FINISH Insulet
CPC-WIDE B23K · 69 areas
INNOV-PAR 54.5/100
CLAIMS-PAR 8.3 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DOWN -35% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Insulet Corporation (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Amphenol · near

55
Fondazione Istituto… · near

55
Auradine · near

55
Ergotron · near

55
Nippon Light Metal · this assignee

55
3D Lighting… · lowest

7

What this shows Nippon's Innovation Score is 54.5/100 (top 8% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

How Nippon's grant cadence moved

Between 2020–2024, Nippon Light Metal Company, Ltd. received 56 grants versus 86 in 2015–2019 (-35% equal-window velocity, below median growth). Across complete PatentsView years, output peaked in 2017 at 25 grants and bottomed in 2020 at 6. Lead class B23K accounts for 30.2% of the portfolio across 69 subclasses. Volume neighbours: Insulet Corporation (#2,457) and THE Glad Products Company (#2,465).

Nippon's three-year grant acceleration

From 2019–2021 to 2022–2024, Nippon Light Metal Company, Ltd. moved from 36 to 38 grants (1.06x the prior three-year total, a multiple, not a CAGR). Among 3,296 tracked assignees with ≥100 grants and ≥20 prior-period grants, that multiple ranks #1,051. See the growth leaderboard.

Insulet

159
Keter Plastic

159
LG Household & He…

159
National SUN Yat-…

159
Shenzhen Xpectvis…

159
Sonicwall

159
Simmonds Precisio…

159
THE Glad Products

159
Nippon Light Metal ◀

159

What this shows Nippon holds 159 patents at rank #2,461, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Nippon

By rank, the assignees closest to #2,461 in granted patent volume.

Leaders in B23K (Soldering OR Unsoldering)

Other assignees with the most granted patents in Nippon's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Nippon, neither rank-band nor same-CPC leaders (those blocks stay above).

Similar innovation score

Nearest assignees by Innovation Score (55 here).

Ergotron, Inc. 55 Auradine, Inc. 55 Fondazione Istituto Italiano DI Tecnologia 55 Amphenol Corporation 55

Similar claim depth

Nearest assignees by average claims per patent (8.3 here).

Mitsubishi Heavy Industries Engineering, Ltd. 8.3 avg 3form, LLC 8.3 avg Jeol Ltd. 8.3 avg Alpha Corporation 8.3 avg

Nippon's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

55 Top 8% higher than 92% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Nippon Light Metal Company, Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	16	10.1%
2016	14	8.8%
2017	25	15.7%
2018	13	8.2%
2019	18	11.3%
2020	6	3.8%
2021	12	7.5%
2022	12	7.5%
2023	15	9.4%
2024	11	6.9%
2025partial year	17	10.7%

Which technologies does Nippon Light Metal Company, Ltd. patent most?

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 48

C22C - Alloys 43

C22F - Changing THE Physical Structure OF Non-ferrous Metals AND Non-ferrous Alloys 30

B22D - Casting OF METALS; Casting OF Other Substances BY THE Same Processes OR Devices 23

C25D - Processes FOR THE Electrolytic OR Electrophoretic Production OF COATINGS; ELECTROFORMING; Apparatus Therefor 17

Y10T - Technical Subjects Covered BY Former US Classification 14

F28F - Details OF Heat-exchange AND Heat-transfer Apparatus, OF General Application 14

Y02E - Reduction OF Greenhouse GAS [GHG] Emissions, Related TO Energy Generation, Transmission OR Distribution 13

G03F - Photomechanical Production OF Textured OR Patterned Surfaces, e.g. FOR Printing, FOR Processing OF Semiconductor DEVICES; Materials THEREFOR; Originals THEREFOR; Apparatus Specially Adapted THEREFOR; 12

H01L - Semiconductor Devices NOT Covered BY Class H10 11

H01M - Processes OR Means, e.g. Batteries, FOR THE Direct Conversion OF Chemical Energy Into Electrical Energy 8

H01G - CAPACITORS; Capacitors, Rectifiers, Detectors, Switching Devices, Light-sensitive OR Temperature-sensitive Devices OF THE Electrolytic Type 8

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 8

C23C - Coating Metallic MATERIAL; Coating Material With Metallic MATERIAL; Surface Treatment OF Metallic Material BY Diffusion Into THE Surface, BY Chemical Conversion OR SUBSTITUTION; Coating BY Vacuum Evaporation, BY Sputtering, BY ION Implantation OR BY Chemical Vapour Deposition, IN General 8

F28D - Heat-exchange Apparatus, NOT Provided FOR IN Another Subclass, IN Which THE Heat-exchange Media DO NOT Come Into Direct Contact 7

Top 15 of 69 technology areas

Where it ranks

Overall rank by patents

#2,461

of 49,997 tracked assignees

Innovation Score

54.5 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Nippon Light Metal Company, Ltd.'s patent record in context - here's where to go next.

Nippon Light Metal Company, Ltd.'s lead technology class is B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam), 30.2% of its portfolio - see every assignee active in that class. Explore B23K
Ranked #2,461 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Nippon Light Metal Company, Ltd. against Insulet Corporation, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 54.5/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.