CPC technology class · C25
C25D - Processes FOR THE Electrolytic OR Electrophoretic Product…
Processes for the electrolytic or electrophoretic production of coatings; electroforming; apparatus therefor. 6,127 US utility patents granted 2015–2025, with the leading assignees and year-by-year filing trajectory.
- 6,127
- US patents granted
- C25
- Parent CPC class
- 20
- Active assignees
- +11%
- 5-yr velocity
The verdict
Processes FOR THE Electrolytic OR Electrophoretic Product… ranks #232 of 670 CPC technology areas - 6,127 US patents granted since 2015, with filing up 11% over five years.
- #232
- of 670 CPC technology areas
- 6,127
- US patents granted, 2015–2025
- Ebara
- leading assignee (187)
- +11%
- filing velocity, last 5 yrs
CPC subclass C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - covers 6,127 US utility patents granted between 2015 and 2025 according to USPTO PatentsView records, within the broader CPC class C25 (ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR). See our CPC classification guide for how the system works.
The competitive landscape in C25D is shaped by 20 distinct companies actively filing in this space. Ebara Corporation leads with 187 patents, followed by Lam Research Corporation at 114 grants and Nippon Steel Corporation at 91.
Filing activity in C25D is up 11% over the past five years versus 2015-2019, a relatively steady filing pace. All counts come directly from USPTO PatentsView and reflect US granted utility patents only.
Is C25D innovation accelerating?
US utility-patent grants per year in C25D, 2015–2025 - recent five years are up 11% versus 2015–2019.
Who leads C25D?
The 12 most active assignees in PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - wider bars mean more grants
- Ebara
EBARA CORPORATION
187 patents
- Lam Research
Lam Research Corporation
114 patents
- Nippon Steel
NIPPON STEEL CORPORATION
91 patents
- Atotech Deutschland &…
Atotech Deutschland GmbH & Co. KG
89 patents
- Rohm and Haas Materia…
Rohm and Haas Electronic Materials LLC
86 patents
- Jfe Steel
JFE Steel Corporation
85 patents
- Novellus Systems 69
Novellus Systems, Inc.
69 patents
- Jx Nippon Mining & Me… 52
JX Nippon Mining & Metals Corporation
52 patents
- Ppg Industries Ohio 51
PPG Industries Ohio, Inc.
51 patents
- Nippon Steel & Sumito… 50
NIPPON STEEL & SUMITOMO METAL CORPORATION
50 patents
- Mitsubishi Materials 49
MITSUBISHI MATERIALS CORPORATION
49 patents
- Chang Chun Petrochemi… 43
CHANG CHUN PETROCHEMICAL CO., LTD.
43 patents
What this shows Ebara is the most active filer in C25D, holding 187 of the 6,127 patents in this class. Concentration at the top signals how contestable this technology area is for new entrants.
View data table
| Rank | Company | Patents in C25D |
|---|---|---|
| #1 | Ebara Corporation | 187 |
| #2 | Lam Research Corporation | 114 |
| #3 | Nippon Steel Corporation | 91 |
| #4 | Atotech Deutschland Gmbh & Co. KG | 89 |
| #5 | Rohm And Haas Electronic Materials Llc | 86 |
| #6 | JFE Steel Corporation | 85 |
| #7 | Novellus Systems, Inc. | 69 |
| #8 | JX Nippon Mining & Metals Corporation | 52 |
| #9 | PPG Industries Ohio, Inc. | 51 |
| #10 | Nippon Steel & Sumitomo Metal Corporation | 50 |
| #11 | Mitsubishi Materials Corporation | 49 |
| #12 | Chang CHUN Petrochemical Co., Ltd. | 43 |
| #13 | TOYO Kohan Co., Ltd. | 39 |
| #14 | Modumetal, Inc. | 33 |
| #15 | Macdermid Enthone Inc. | 32 |
| #16 | Fabric8labs, Inc. | 32 |
| #17 | Arcelormittal | 29 |
| #18 | DOWA Metaltech Co., Ltd. | 23 |
| #19 | C.uyemura & Co., Ltd. | 22 |
| #20 | Mitsui Mining & Smelting Co., Ltd. | 21 |
About This Class
CPC subclass C25D belongs to class C25.
6,127 patents were granted in this class between 2015 and 2025.
20 companies actively patent in this space.
Classification System
Cooperative Patent Classification (CPC) is a hierarchical patent classification system used by the USPTO and EPO.
Footprint here vs. claim strategy
Each dot is a leading C25D assignee, placed by how many patents it holds in this class (horizontal) against its company-wide average claims per patent (vertical) - a read on whether the class is led by broad-but-shallow filers or focused deep-claim players.
Top 14 C25D assignees by class footprint. Bubble size = patents in C25D. Source: USPTO PatentsView (claim depth is company-wide across all classes).
Frequently Asked Questions
What is CPC class C25D?
How many patents have been filed in C25D?
Which company holds the most patents in C25D?
How is patent data for C25D collected?
What is the difference between CPC class and subclass?
Read our methodology - how this data is sourced, computed, and verified.
Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error.