Where does Senju Metal Industry Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Senju Metal Industry Co., Ltd. ranks #1,881 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Senju Metal Industry Co., Ltd. hold?

Senju Metal Industry Co., Ltd. holds 214 US utility patents granted between 2015 and 2025, spanning 58 technology areas.

What is Senju Metal Industry Co., Ltd.'s Innovation Score?

Senju Metal Industry Co., Ltd. has an Innovation Score of 55.3 out of 100 (top 7% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Senju Metal Industry Co., Ltd.'s patent grant rate increasing or decreasing?

Senju Metal Industry Co., Ltd.'s recent grant velocity is +12% compared to the prior five-year period (grant years, not application filing dates). The company is maintaining or growing its granted-patent output.

What does claim depth mean for Senju Metal Industry Co., Ltd.'s patents?

Senju Metal Industry Co., Ltd.'s patents average 9.7 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Senju Metal Industry Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Senju Metal Industry Co., Ltd.

Q: What technology areas does Senju Metal Industry Co., Ltd. focus on?

Senju Metal Industry Co., Ltd.'s top technology area is B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam) with 186 patents. Grants appear in 58 CPC subclasses total.

USPTO PatentsView assignee record - 214 granted patents across 58 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Senju ranks #1,881 of 49,997 tracked US assignees by granted-patent volume, with 214 patents across 58 technology areas.

#1,881
of 49,997 US assignees by volume: Top 7%
by Innovation Score (55.3/100): 9.7
avg claims per patent: +12%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R1881 · Foreign Corporation #1,881 · 214 grants

GRANTS-MID · TOP-DECILE · PHOTO-FINISH · CPC-WIDE · INNOV-PAR · CLAIMS-PAR · TYPE-FRNCORP · VEL-UP · BOOK-FULL

GRANTS-MID 214 grants
TOP-DECILE #1,881/49,997
PHOTO-FINISH Minebea
CPC-WIDE B23K · 58 areas
INNOV-PAR 55.3/100
CLAIMS-PAR 9.7 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-UP +12% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Minebea Co., Ltd. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
AAC Acoustic… · near

55
Beam Therapeutics · near

55
Crystal Lagoons · near

55
Senju Metal Industry · this assignee

55
Tobii AB · near

55
3D Lighting… · lowest

7

What this shows Senju's Innovation Score is 55.3/100 (top 7% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

How Senju's grant cadence moved

Between 2020–2024, Senju Metal Industry Co., Ltd. received 106 grants versus 95 in 2015–2019 (+12% equal-window velocity, above median growth). Across complete PatentsView years, output peaked in 2019 at 25 grants and bottomed in 2015 at 12. Lead class B23K accounts for 86.9% of the portfolio across 58 subclasses. Volume neighbours: MKS Instruments, Inc. (#1,877) and Clariant International Ltd (#1,885).

Senju's three-year grant acceleration

From 2019–2021 to 2022–2024, Senju Metal Industry Co., Ltd. moved from 69 to 62 grants (0.90x the prior three-year total, a multiple, not a CAGR). Among 3,296 tracked assignees with ≥100 grants and ≥20 prior-period grants, that multiple ranks #1,479. See the growth leaderboard.

MKS Instruments

214
Minebea

214
NEC Display Solut…

214
Nunhems B V

214
St-ericsson

214
Tosoh

214
Senju Metal Indus… ◀

214
Brown University

213
Clariant Internat…

213

What this shows Senju holds 214 patents at rank #1,881, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Senju

By rank, the assignees closest to #1,881 in granted patent volume.

Leaders in B23K (Soldering OR Unsoldering)

Other assignees with the most granted patents in Senju's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Senju, neither rank-band nor same-CPC leaders (those blocks stay above).

Similar innovation score

Nearest assignees by Innovation Score (55 here).

Tobii AB 55 Crystal Lagoons Technologies, Inc. 55 Beam Therapeutics Inc. 55 AAC Acoustic Technologies (SHENZHEN) Co., Ltd. 55

Similar claim depth

Nearest assignees by average claims per patent (9.7 here).

Magpul Industries Corp. 9.7 avg Sichuan University 9.7 avg Unimicron Technology Corp. 9.7 avg OJI Holdings Corporation 9.7 avg

Senju's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

55 Top 7% higher than 93% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Senju Metal Industry Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	12	5.6%
2016	14	6.5%
2017	22	10.3%
2018	22	10.3%
2019	25	11.7%
2020	22	10.3%
2021	22	10.3%
2022	20	9.3%
2023	21	9.8%
2024	21	9.8%
2025partial year	13	6.1%

Which technologies does Senju Metal Industry Co., Ltd. patent most?

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 186

C22C - Alloys 117

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 90

H01L - Semiconductor Devices NOT Covered BY Class H10 57

B22F - Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder 32

C23C - Coating Metallic MATERIAL; Coating Material With Metallic MATERIAL; Surface Treatment OF Metallic Material BY Diffusion Into THE Surface, BY Chemical Conversion OR SUBSTITUTION; Coating BY Vacuum Evaporation, BY Sputtering, BY ION Implantation OR BY Chemical Vapour Deposition, IN General 18

Y10T - Technical Subjects Covered BY Former US Classification 16

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 14

H01B - CABLES; CONDUCTORS; INSULATORS; Selection OF Materials FOR Their Conductive, Insulating OR Dielectric Properties 13

C08K - Use of inorganic or non-macromolecular organic substances as compounding ingredients 12

C25D - Processes FOR THE Electrolytic OR Electrophoretic Production OF COATINGS; ELECTROFORMING; Apparatus Therefor 10

C08L - Compositions OF Macromolecular Compounds 9

F16C - SHAFTS; Flexible SHAFTS; Elements OR Crankshaft MECHANISMS; Rotary Bodies Other Than Gearing ELEMENTS; Bearings 9

C22F - Changing THE Physical Structure OF Non-ferrous Metals AND Non-ferrous Alloys 7

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 6

Top 15 of 58 technology areas

Where it ranks

Overall rank by patents

#1,881

of 49,997 tracked assignees

Innovation Score

55.3 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Senju Metal Industry Co., Ltd.'s patent record in context - here's where to go next.

Senju Metal Industry Co., Ltd.'s lead technology class is B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam), 86.9% of its portfolio - see every assignee active in that class. Explore B23K
Ranked #1,881 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Senju Metal Industry Co., Ltd. against MKS Instruments, Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 55.3/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.