Where does Dai-ichi Seiko Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Dai-ichi Seiko Co., Ltd. ranks #1,777 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Dai-ichi Seiko Co., Ltd. hold?

Dai-ichi Seiko Co., Ltd. holds 229 US utility patents granted between 2015 and 2025, spanning 20 technology areas.

What is Dai-ichi Seiko Co., Ltd.'s Innovation Score?

Dai-ichi Seiko Co., Ltd. has an Innovation Score of 39.5 out of 100 (top 38% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Dai-ichi Seiko Co., Ltd.'s patent grant rate increasing or decreasing?

Dai-ichi Seiko Co., Ltd.'s recent grant velocity is -89% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Dai-ichi Seiko Co., Ltd.'s patents?

Dai-ichi Seiko Co., Ltd.'s patents average 6.9 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Dai-ichi Seiko Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Dai-ichi Seiko Co., Ltd.

Q: What technology areas does Dai-ichi Seiko Co., Ltd. focus on?

Dai-ichi Seiko Co., Ltd.'s top technology area is H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors) with 146 patents. Grants appear in 20 CPC subclasses total.

USPTO PatentsView assignee record - 229 granted patents across 20 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Dai-ichi ranks #1,777 of 49,997 tracked US assignees by granted-patent volume, with 229 patents across 20 technology areas.

#1,777
of 49,997 US assignees by volume: Top 38%
by Innovation Score (39.5/100): 6.9
avg claims per patent: -89%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R1777 · Foreign Corporation #1,777 · 229 grants

GRANTS-MID · TOP-DECILE · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-SPARSE · TYPE-FRNCORP · VEL-DROP · BOOK-FULL

GRANTS-MID 229 grants
TOP-DECILE #1,777/49,997
PHOTO-FINISH ABB Research
CPC-FOCUS H01R · 20 areas
INNOV-THIN 39.5/100
CLAIMS-SPARSE 6.9 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DROP -89% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: ABB Research Ltd. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Coravin · near

39
Dai-ichi Seiko · this assignee

39
iPEK International · near

39
Overstock com · near

39
Sirigen II · near

39
3D Lighting… · lowest

7

What this shows Dai-ichi's Innovation Score is 39.5/100 (top 38% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Dai-ichi's grants concentrate

Dai-ichi Seiko Co., Ltd. is a focused PatentsView assignee: 20 CPC subclasses with 63.8% of grants classified under H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors). Peak complete grant year is 2016 (75 grants) versus a trough of 2 in 2023. By volume, Dai-ichi sits between Washington State University and Siemens Industry Software Ltd..

Dai-ichi's three-year grant acceleration

From 2019–2021 to 2022–2024, Dai-ichi Seiko Co., Ltd. moved from 56 to 6 grants (0.11x the prior three-year total, a multiple, not a CAGR). Among 3,296 tracked assignees with ≥100 grants and ≥20 prior-period grants, that multiple ranks #3,167. See the growth leaderboard.

Washington State…

230
Wake Forest Unive…

230
ABB Research

229
British American…

229
Global Graphene G…

229
Hirose Electric

229
Intercontinental…

229
Siemens Industry…

229
Dai-ichi Seiko ◀

229

What this shows Dai-ichi holds 229 patents at rank #1,777, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Dai-ichi

By rank, the assignees closest to #1,777 in granted patent volume.

Leaders in H01R (Electrically-conductive Connections)

Other assignees with the most granted patents in Dai-ichi's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Dai-ichi, neither rank-band nor same-CPC leaders (those blocks stay above).

Similar innovation score

Nearest assignees by Innovation Score (39 here).

Coravin, Inc. 39 Overstock.com, Inc. 39 Sirigen II Limited 39 iPEK International GmbH 39

Similar claim depth

Nearest assignees by average claims per patent (6.9 here).

Toyo Tire Corporation 6.9 avg Spectrum Brands, Inc. 6.9 avg Fujikoki Corporation 6.9 avg Nitta Corporation 6.9 avg

Dai-ichi's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

39 Top 38% higher than 62% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Dai-ichi Seiko Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	37	16.2%
2016	75	32.8%
2017	30	13.1%
2018	24	10.5%
2019	39	17.0%
2020	7	3.1%
2021	10	4.4%
2022	4	1.7%
2023	2	0.9%
2025partial year	1	0.4%

Which technologies does Dai-ichi Seiko Co., Ltd. patent most?

H01R - Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors 146

Y10T - Technical Subjects Covered BY Former US Classification 15

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 9

H04R - Loudspeakers, Microphones, Gramophone Pick-ups OR Like Acoustic Electromechanical TRANSDUCERS; Deaf-aid SETS; Public Address Systems 7

B81B - Microstructural Devices OR Systems, e.g. Micromechanical Devices 5

H10N - Electric Solid-state Devices NOT Otherwise Provided FOR 5

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 4

G02B - Optical Elements, Systems OR Apparatus 3

G01L - Measuring Force, Stress, Torque, Work, Mechanical Power, Mechanical Efficiency, OR Fluid Pressure 2

B25J - MANIPULATORS; Chambers Provided With Manipulation Devices 2

H01L - Semiconductor Devices NOT Covered BY Class H10 2

G01N - Investigating OR Analysing Materials BY Determining Their Chemical OR Physical Properties 2

B29L - Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles 2

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 2

B81C - Processes OR Apparatus Specially Adapted FOR THE Manufacture OR Treatment OF Microstructural Devices OR Systems 1

Top 15 of 20 technology areas

Where it ranks

Overall rank by patents

#1,777

of 49,997 tracked assignees

Innovation Score

39.5 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Dai-ichi Seiko Co., Ltd.'s patent record in context - here's where to go next.

Dai-ichi Seiko Co., Ltd.'s lead technology class is H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors), 63.8% of its portfolio - see every assignee active in that class. Explore H01R
Ranked #1,777 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Dai-ichi Seiko Co., Ltd. against Washington State University, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 39.5/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.