Where does SK Enpulse Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), SK Enpulse Co., Ltd. ranks #12,671 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does SK Enpulse Co., Ltd. hold?

SK Enpulse Co., Ltd. holds 24 US utility patents granted between 2023 and 2025, spanning 15 technology areas.

What is SK Enpulse Co., Ltd.'s Innovation Score?

SK Enpulse Co., Ltd. has an Innovation Score of 52.8 out of 100 (top 10% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is SK Enpulse Co., Ltd.'s patent grant rate increasing or decreasing?

Insufficient historical data is available to calculate a velocity trend for SK Enpulse Co., Ltd..

What does claim depth mean for SK Enpulse Co., Ltd.'s patents?

SK Enpulse Co., Ltd.'s patents average 13.3 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the SK Enpulse Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

SK Enpulse Co., Ltd.

Q: What technology areas does SK Enpulse Co., Ltd. focus on?

SK Enpulse Co., Ltd.'s top technology area is B24B (Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents) with 18 patents. Grants appear in 15 CPC subclasses total.

USPTO PatentsView assignee record - 24 granted patents across 15 technology areas, recorded in grant years 2023–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B24B (Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, SK ranks #12,671 of 49,997 tracked US assignees by granted-patent volume, with 24 patents across 15 technology areas.

#12,671
of 49,997 US assignees by volume: Top 10%
by Innovation Score (52.8/100): 13.3
avg claims per patent

USPTO PatentsView assignee plate

Corpus R12671 · Foreign Corporation #12,671 · 24 grants

GRANTS-SMALL · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-RICH · TYPE-FRNCORP · SPAN-YRS · BOOK-RICH

GRANTS-SMALL 24 grants
MID-PACK #12,671/49,997
PHOTO-FINISH Shenzhen NEW Degree…
CPC-FOCUS B24B · 15 areas
INNOV-PAR 52.8/100
CLAIMS-RICH 13.3 claims/avg
TYPE-FRNCORP Foreign Corp
SPAN-YRS 2023–2025 · 3y
BOOK-RICH 9/10 fields

Nearest grant-volume peer: Shenzhen NEW Degree Technology Co., Ltd. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
SK Enpulse · this assignee

53
3D Lighting… · lowest

7

What this shows SK's Innovation Score is 52.8/100 (top 10% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where SK's grants concentrate

SK Enpulse Co., Ltd. is a focused PatentsView assignee: 15 CPC subclasses with 75% of grants classified under B24B (Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents). Peak complete grant year is 2024 (13 grants) versus a trough of 7 in 2023. By volume, SK sits between Shenzhen NEW Degree Technology Co., Ltd. and Span Tech LLC.

SK's three-year grant acceleration

SK Enpulse Co., Ltd. shows 20 grants in 2022–2024 against only 0 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Shenzhen NEW Degr…

24
Shmuel UR Innovat…

24
Showa Aluminum CAN

24
Sightline Interac…

24
SNF Group

24
Somar

24
Sookmyung Women's…

24
Span Tech

24
SK Enpulse ◀

24

What this shows SK holds 24 patents at rank #12,661, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near SK

By rank, the assignees closest to #12,661 in granted patent volume.

Leaders in B24B (Machines)

Other assignees with the most granted patents in SK's primary technology class.

SK's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

53 Top 10% higher than 90% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2023–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2023–2019 baseline. Full figures in the table below.

View data table

SK Enpulse Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2023	7	29.2%
2024	13	54.2%
2025partial year	4	16.7%

Which technologies does SK Enpulse Co., Ltd. patent most?

B24B - Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents 18

H01L - Semiconductor Devices NOT Covered BY Class H10 17

B24D - Tools FOR Grinding, Buffing OR Sharpening 11

C08J - WORKING-UP; General Processes OF COMPOUNDING; After-treatment NOT Covered BY Subclasses C08b, C08c, C08f, C08g or C08h 8

C08G - Macromolecular Compounds Obtained Otherwise Than BY Reactions Only Involving Unsaturated Carbon-to-carbon Bonds 6

C09G - Polishing Compositions ; SKI Waxes 4

B25J - MANIPULATORS; Chambers Provided With Manipulation Devices 2

C09K - Materials FOR Miscellaneous Applications, NOT Provided FOR Elsewhere 2

C09D - Coating Compositions, e.g. Paints, Varnishes OR LACQUERS; Filling PASTES; Chemical Paint OR INK REMOVERS; INKS; Correcting FLUIDS; WOODSTAINS; Pastes OR Solids FOR Colouring OR PRINTING; USE OF Materials Therefor 2

C23C - Coating Metallic MATERIAL; Coating Material With Metallic MATERIAL; Surface Treatment OF Metallic Material BY Diffusion Into THE Surface, BY Chemical Conversion OR SUBSTITUTION; Coating BY Vacuum Evaporation, BY Sputtering, BY ION Implantation OR BY Chemical Vapour Deposition, IN General 1

H01J - Electric Discharge Tubes OR Discharge Lamps 1

H02P - Control OR Regulation OF Electric Motors, Electric Generators OR Dynamo-electric CONVERTERS; Controlling Transformers, Reactors OR Choke Coils 1

G03F - Photomechanical Production OF Textured OR Patterned Surfaces, e.g. FOR Printing, FOR Processing OF Semiconductor DEVICES; Materials THEREFOR; Originals THEREFOR; Apparatus Specially Adapted THEREFOR; 1

C08L - Compositions OF Macromolecular Compounds 1

C08K - Use of inorganic or non-macromolecular organic substances as compounding ingredients 1

Top 15 of 15 technology areas

Where it ranks

Overall rank by patents

#12,671

of 49,997 tracked assignees

Innovation Score

52.8 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

SK Enpulse Co., Ltd.'s patent record in context - here's where to go next.

SK Enpulse Co., Ltd.'s lead technology class is B24B (Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents), 75% of its portfolio - see every assignee active in that class. Explore B24B
Ranked #12,671 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare SK Enpulse Co., Ltd. against Shenzhen NEW Degree Technology Co., Ltd., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 52.8/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.