Where does Rohm and Haas Electronic Materials CMP Holdings, Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Rohm and Haas Electronic Materials CMP Holdings, Inc. ranks #2,664 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

What is Rohm and Haas Electronic Materials CMP Holdings, Inc.'s Innovation Score?

Rohm and Haas Electronic Materials CMP Holdings, Inc. has an Innovation Score of 46.7 out of 100 (top 20% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Rohm and Haas Electronic Materials CMP Holdings, Inc.'s patent grant rate increasing or decreasing?

Rohm and Haas Electronic Materials CMP Holdings, Inc.'s recent grant velocity is -25% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Rohm and Haas Electronic Materials CMP Holdings, Inc.'s patents?

Rohm and Haas Electronic Materials CMP Holdings, Inc.'s patents average 8.8 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

USPTO 2015–2025 USPTO PatentsView US Corporation

Rohm and Haas Electronic Materials CMP Holdings, Inc.

Q: How many patents does Rohm and Haas Electronic Materials CMP Holdings, Inc. hold?

Rohm and Haas Electronic Materials CMP Holdings, Inc. holds 146 US utility patents granted between 2015 and 2025, spanning 34 technology areas.

Q: What technology areas does Rohm and Haas Electronic Materials CMP Holdings, Inc. focus on?

Rohm and Haas Electronic Materials CMP Holdings, Inc.'s top technology area is B24B (Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents) with 110 patents. Grants appear in 34 CPC subclasses total.

Q: How is the Rohm and Haas Electronic Materials CMP Holdings, Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO PatentsView assignee record - 146 granted patents across 34 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B24B (Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Rohm ranks #2,664 of 49,997 tracked US assignees by granted-patent volume, with 146 patents across 34 technology areas.

#2,664
of 49,997 US assignees by volume: Top 20%
by Innovation Score (46.7/100): 8.8
avg claims per patent: -25%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R2664 · US Corporation #2,664 · 146 grants

GRANTS-MID · TOP-DECILE · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-PAR · TYPE-USCORP · VEL-DOWN · BOOK-FULL

GRANTS-MID 146 grants
TOP-DECILE #2,664/49,997
PHOTO-FINISH Joseph Voegele
CPC-FOCUS B24B · 34 areas
INNOV-PAR 46.7/100
CLAIMS-PAR 8.8 claims/avg
TYPE-USCORP US Corporation
VEL-DOWN -25% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Joseph Voegele AG (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
FMC Kongsberg… · near

47
Kanzaki Kokyukoki MFG · near

47
Miso Robotics · near

47
Rohm and Haas… · this assignee

47
Toyo Tanso · near

47
3D Lighting… · lowest

7

What this shows Rohm's Innovation Score is 46.7/100 (top 20% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Rohm's grants concentrate

Rohm and Haas Electronic Materials CMP Holdings, Inc. is a focused PatentsView assignee: 34 CPC subclasses with 75.3% of grants classified under B24B (Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents). Peak complete grant year is 2020 (27 grants) versus a trough of 4 in 2024. By volume, Rohm sits between Joseph Voegele AG and Spin Memory, Inc..

Rohm's three-year grant acceleration

From 2019–2021 to 2022–2024, Rohm and Haas Electronic Materials CMP Holdings, Inc. moved from 51 to 27 grants (0.53x the prior three-year total, a multiple, not a CAGR). Among 3,296 tracked assignees with ≥100 grants and ≥20 prior-period grants, that multiple ranks #2,623. See the growth leaderboard.

Joseph Voegele

146
Kardium

146
Kohler Mira

146
Reliance Industri…

146
Roquette Freres

146
Safran Transmissi…

146
Shenzhen Royole

146
Spin Memory

146
Rohm and Haas Mat… ◀

146

What this shows Rohm holds 146 patents at rank #2,664, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Rohm

By rank, the assignees closest to #2,664 in granted patent volume.

Leaders in B24B (Machines)

Other assignees with the most granted patents in Rohm's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Rohm, neither rank-band nor same-CPC leaders (those blocks stay above).

Similar innovation score

Nearest assignees by Innovation Score (47 here).

Kanzaki Kokyukoki MFG. Co., Ltd. 47 FMC Kongsberg Subsea AS 47 Toyo Tanso Co., Ltd. 47 Miso Robotics, Inc. 47

Similar claim depth

Nearest assignees by average claims per patent (8.8 here).

Nippon Steel & Sumitomo Metal Corporation 8.8 avg Sata GmbH & Co. KG 8.8 avg Kyocera Document Solutions Inc. 8.8 avg Kunming University of Science and Technology 8.8 avg

Rohm's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

47 Top 20% higher than 80% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Rohm and Haas Electronic Materials CMP Holdings, Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	13	8.9%
2016	20	13.7%
2017	17	11.6%
2018	14	9.6%
2019	17	11.6%
2020	27	18.5%
2021	7	4.8%
2022	11	7.5%
2023	12	8.2%
2024	4	2.7%
2025partial year	4	2.7%

Which technologies does Rohm and Haas Electronic Materials CMP Holdings, Inc. patent most?

B24B - Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents 110

H01L - Semiconductor Devices NOT Covered BY Class H10 89

C09G - Polishing Compositions ; SKI Waxes 65

C09K - Materials FOR Miscellaneous Applications, NOT Provided FOR Elsewhere 32

B24D - Tools FOR Grinding, Buffing OR Sharpening 30

C08G - Macromolecular Compounds Obtained Otherwise Than BY Reactions Only Involving Unsaturated Carbon-to-carbon Bonds 25

C08L - Compositions OF Macromolecular Compounds 8

C08J - WORKING-UP; General Processes OF COMPOUNDING; After-treatment NOT Covered BY Subclasses C08b, C08c, C08f, C08g or C08h 8

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 8

G02B - Optical Elements, Systems OR Apparatus 7

C23F - Non-mechanical Removal OF Metallic Material From Surface ; Inhibiting Corrosion OF Metallic Material OR Incrustation IN GENERAL; Multi-step Processes FOR Surface Treatment OF Metallic Material Involving AT Least ONE Process Provided FOR IN Class C23 AND AT Least ONE Process Covered BY Subclass C21d 7

B29L - Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles 5

H01F - MAGNETS; INDUCTANCES; TRANSFORMERS; Selection OF Materials FOR Their Magnetic Properties 4

C08F - Macromolecular Compounds Obtained BY Reactions Only Involving Carbon-to-carbon Unsaturated Bonds 4

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 4

Top 15 of 34 technology areas

Where it ranks

Overall rank by patents

#2,664

of 49,997 tracked assignees

Innovation Score

46.7 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Rohm and Haas Electronic Materials CMP Holdings, Inc.'s patent record in context - here's where to go next.

Rohm and Haas Electronic Materials CMP Holdings, Inc.'s lead technology class is B24B (Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents), 75.3% of its portfolio - see every assignee active in that class. Explore B24B
Ranked #2,664 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Rohm and Haas Electronic Materials CMP Holdings, Inc. against Joseph Voegele AG, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 46.7/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.