Where does Shinkawa Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Shinkawa Ltd. ranks #3,124 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Shinkawa Ltd. hold?

Shinkawa Ltd. holds 121 US utility patents granted between 2015 and 2025, spanning 35 technology areas.

What is Shinkawa Ltd.'s Innovation Score?

Shinkawa Ltd. has an Innovation Score of 51.0 out of 100 (top 12% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Shinkawa Ltd. focus on?

Shinkawa Ltd.'s top technology area is H01L (Semiconductor Devices NOT Covered BY Class H10) with 107 patents, ranking #169 of 3,373 assignees active in that subclass. Grants appear in 35 CPC subclasses total.

Is Shinkawa Ltd.'s patent grant rate increasing or decreasing?

Shinkawa Ltd.'s recent grant velocity is +109% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Shinkawa Ltd.'s patents?

Shinkawa Ltd.'s patents average 8.7 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Shinkawa Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Shinkawa Ltd.

USPTO PatentsView assignee record - 121 granted patents across 35 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01L (Semiconductor Devices NOT Covered BY Class H10).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Shinkawa ranks #3,124 of 49,997 tracked US assignees by granted-patent volume, with 121 patents across 35 technology areas.

#3,124
of 49,997 US assignees by volume: Top 12%
by Innovation Score (51.0/100): 8.7
avg claims per patent: +109%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R3124 · Foreign Corporation #3,124 · 121 grants

GRANTS-MID · TOP-DECILE · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-PAR · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-MID 121 grants
TOP-DECILE #3,124/49,997
PHOTO-FINISH Hefei BOE Display…
CPC-FOCUS H01L · 35 areas
INNOV-PAR 51.0/100
CLAIMS-PAR 8.7 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +109% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Hefei BOE Display Technology Co., Ltd. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Shinkawa’s 51.0 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 16.6 pts (33%) Velocity 8.3 pts (16%) Breadth 20.9 pts (41%) Claim depth 5.2 pts (10%)

Qualcomm Incorporated · highest

85
Aerojet Rocketdyne · near

51
BIOMÉRIEUX · near

51
MAN Energy Solutions… · near

51
Shinkawa · this assignee

51
University OF Miyazaki · near

51
3D Lighting… · lowest

7

What this shows Shinkawa's Innovation Score is 51.0/100 (top 12% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Shinkawa?

Each dot is one of Shinkawa’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Shinkawa’s own 8.7 claims/patent is at or below the 13.2 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Shinkawa vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Shinkawa's grants concentrate

Shinkawa Ltd. is a focused PatentsView assignee: 35 CPC subclasses with 88.4% of grants classified under H01L (Semiconductor Devices NOT Covered BY Class H10). Peak complete grant year is 2021 (19 grants) versus a trough of 2 in 2015. By volume, Shinkawa sits between Hefei BOE Display Technology Co., Ltd. and Toshiba Lighting & Technology Corporation.

Shinkawa's three-year grant acceleration

From 2019–2021 to 2022–2024, Shinkawa Ltd. moved from 37 to 46 grants (1.24x the prior three-year total, a multiple, not a CAGR). Among 3,296 tracked assignees with ≥100 grants and ≥20 prior-period grants, that multiple ranks #719. See the growth leaderboard.

Hefei BOE Display…

121
Institute of Auto…

121
Landscape Forms

121
Purac Biochem BV

121
Sunrise Memory

121
Shukla Medical

121
Shutterfly

121
Toshiba Lighting…

121
Shinkawa ◀

121

What this shows Shinkawa holds 121 patents at rank #3,124, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Shinkawa

By rank, the assignees closest to #3,124 in granted patent volume.

Leaders in H01L (Semiconductor Devices NOT Covered BY Class H10)

Other assignees with the most granted patents in Shinkawa's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Shinkawa, neither rank-band nor same-CPC leaders (those blocks stay above). In H01L (Semiconductor Devices NOT Covered BY Class H10), Shinkawa ranks #169 of 3,373 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (51 here).

MAN Energy Solutions SE 51 Aerojet Rocketdyne, Inc. 51 BIOMÉRIEUX 51 University OF Miyazaki 51

Similar claim depth

Nearest assignees by average claims per patent (8.7 here).

Spin Master Ltd. 8.7 avg Vehicle Energy Japan Inc. 8.7 avg Kanzaki Kokyukoki MFG. Co., Ltd. 8.7 avg Sears Brands, L.L.C. 8.7 avg

Shinkawa's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

51 Top 12% higher than 88% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Shinkawa Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	2	1.7%
2016	9	7.4%
2017	5	4.1%
2018	9	7.4%
2019	10	8.3%
2020	8	6.6%
2021	19	15.7%
2022	19	15.7%
2023	11	9.1%
2024	16	13.2%
2025partial year	13	10.7%

Which technologies does Shinkawa Ltd. patent most?

H01L - Semiconductor Devices NOT Covered BY Class H10 107

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 41

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 22

Y10T - Technical Subjects Covered BY Former US Classification 6

G01B - Measuring Length, Thickness OR Similar Linear DIMENSIONS; Measuring ANGLES; Measuring AREAS; Measuring Irregularities OF Surfaces OR Contours 5

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 4

B06B - Methods OR Apparatus FOR Generating OR Transmitting Mechanical Vibrations OF Infrasonic, Sonic, OR Ultrasonic Frequency, ; e.g.; FOR Performing Mechanical Work IN General 4

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 3

G06T - Image Data Processing OR Generation, IN General 3

B65H - Handling Thin OR Filamentary Material, e.g. Sheets, Webs, Cables 3

B65G - Transport OR Storage Devices, e.g. Conveyors FOR Loading OR Tipping, Shop Conveyor Systems OR Pneumatic Tube Conveyors 2

B25J - MANIPULATORS; Chambers Provided With Manipulation Devices 2

G02B - Optical Elements, Systems OR Apparatus 2

H04N - Pictorial Communication, e.g. Television 2

G01R - Measuring Electric VARIABLES; Measuring Magnetic Variables 2

Top 15 of 35 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Shinkawa Ltd.'s patent record in context - here's where to go next.

Shinkawa Ltd.'s lead technology class is H01L (Semiconductor Devices NOT Covered BY Class H10), 88.4% of its portfolio - see every assignee active in that class. Explore H01L
Ranked #3,124 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Shinkawa Ltd. against Hefei BOE Display Technology Co., Ltd., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 51.0/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.