Where does Nippon Micrometal Corporation rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Nippon Micrometal Corporation ranks #6,932 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Nippon Micrometal Corporation hold?

Nippon Micrometal Corporation holds 48 US utility patents granted between 2015 and 2025, spanning 16 technology areas.

What is Nippon Micrometal Corporation's Innovation Score?

Nippon Micrometal Corporation has an Innovation Score of 37.2 out of 100 (top 44% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Nippon Micrometal Corporation focus on?

Nippon Micrometal Corporation's top technology area is H01L (Semiconductor Devices NOT Covered BY Class H10) with 44 patents, ranking #341 of 3,373 assignees active in that subclass. Grants appear in 16 CPC subclasses total.

Is Nippon Micrometal Corporation's patent grant rate increasing or decreasing?

Nippon Micrometal Corporation's recent grant velocity is +0% compared to the prior five-year period (grant years, not application filing dates). The company is maintaining or growing its granted-patent output.

What does claim depth mean for Nippon Micrometal Corporation's patents?

Nippon Micrometal Corporation's patents average 10.5 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Nippon Micrometal Corporation patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Nippon Micrometal Corporation

USPTO PatentsView assignee record - 48 granted patents across 16 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01L (Semiconductor Devices NOT Covered BY Class H10).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Nippon ranks #6,932 of 49,997 tracked US assignees by granted-patent volume, with 48 patents across 16 technology areas.

#6,932
of 49,997 US assignees by volume: Top 44%
by Innovation Score (37.2/100): 10.5
avg claims per patent: +0%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R6932 · Foreign Corporation #6,932 · 48 grants

GRANTS-SMALL · UPPER-Q · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-PAR · TYPE-FRNCORP · VEL-FLAT · BOOK-FULL

GRANTS-SMALL 48 grants
UPPER-Q #6,932/49,997
PHOTO-FINISH Nagoya Institute OF…
CPC-FOCUS H01L · 16 areas
INNOV-THIN 37.2/100
CLAIMS-PAR 10.5 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-FLAT +0% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Nagoya Institute OF Technology (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Nippon’s 37.2 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 13.4 pts (36%) Velocity 3.3 pts (9%) Breadth 14.1 pts (38%) Claim depth 6.3 pts (17%)

Qualcomm Incorporated · highest

85
Bosch Mahle Turbo… · near

37
Duravit Aktiengesell… · near

37
Mitsubishi Shindoh · near

37
Nippon Micrometal · this assignee

37
SAFILO—SOCIETÀ… · near

37
3D Lighting… · lowest

7

What this shows Nippon's Innovation Score is 37.2/100 (top 44% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Nippon?

Each dot is one of Nippon’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Nippon’s own 10.5 claims/patent is at or below the 14.1 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Nippon vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Nippon's grants concentrate

Nippon Micrometal Corporation is a focused PatentsView assignee: 16 CPC subclasses with 91.7% of grants classified under H01L (Semiconductor Devices NOT Covered BY Class H10). Peak complete grant year is 2020 (7 grants) versus a trough of 2 in 2022. By volume, Nippon sits between Nagoya Institute OF Technology and Netsia, Inc..

Nippon's three-year grant acceleration

Nippon Micrometal Corporation shows 9 grants in 2022–2024 against only 18 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Nagoya Institute…

48
Nakanishi Metal W…

48
Naver Labs

48
Nippon Chemical I…

48
Noblis

48
Novozymes Bioag A…

48
Neapco Intellectu…

48
Netsia

48
Nippon Micrometal ◀

48

What this shows Nippon holds 48 patents at rank #6,926, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Nippon

By rank, the assignees closest to #6,926 in granted patent volume.

Leaders in H01L (Semiconductor Devices NOT Covered BY Class H10)

Other assignees with the most granted patents in Nippon's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Nippon, neither rank-band nor same-CPC leaders (those blocks stay above). In H01L (Semiconductor Devices NOT Covered BY Class H10), Nippon ranks #341 of 3,373 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (37 here).

SAFILO—SOCIETÀ Azionaria Fabbrica Italiana Lavorazione Occhiali S.P.A. 37 Duravit Aktiengesellschaft 37 Mitsubishi Shindoh Co., Ltd. 37 Bosch Mahle Turbo Systems GMBH & GO. KG 37

Nippon's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

37 Top 44% higher than 56% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Nippon Micrometal Corporation patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	3	6.3%
2016	3	6.3%
2017	4	8.3%
2018	5	10.4%
2019	6	12.5%
2020	7	14.6%
2021	5	10.4%
2022	2	4.2%
2023	2	4.2%
2024	5	10.4%
2025partial year	6	12.5%

Which technologies does Nippon Micrometal Corporation patent most?

H01L - Semiconductor Devices NOT Covered BY Class H10 44

C22C - Alloys 41

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 25

C22F - Changing THE Physical Structure OF Non-ferrous Metals AND Non-ferrous Alloys 14

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 13

C23C - Coating Metallic MATERIAL; Coating Material With Metallic MATERIAL; Surface Treatment OF Metallic Material BY Diffusion Into THE Surface, BY Chemical Conversion OR SUBSTITUTION; Coating BY Vacuum Evaporation, BY Sputtering, BY ION Implantation OR BY Chemical Vapour Deposition, IN General 8

Y10T - Technical Subjects Covered BY Former US Classification 6

B21C - Manufacture OF Metal Sheets, Wire, Rods, Tubes, Profiles OR Like Semi-manufactured Products Otherwise Than BY ROLLING; Auxiliary Operations Used IN Connection With Metal-working Without Essentially Removing Material 5

C25D - Processes FOR THE Electrolytic OR Electrophoretic Production OF COATINGS; ELECTROFORMING; Apparatus Therefor 5

H01B - CABLES; CONDUCTORS; INSULATORS; Selection OF Materials FOR Their Conductive, Insulating OR Dielectric Properties 4

B22F - Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder 3

C21D - Modifying THE Physical Structure OF Ferrous METALS; General Devices FOR Heat Treatment OF Ferrous OR Non-ferrous Metals OR ALLOYS; Making Metal Malleable, e.g. BY Decarburisation OR Tempering 2

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 2

G01N - Investigating OR Analysing Materials BY Determining Their Chemical OR Physical Properties 2

B22D - Casting OF METALS; Casting OF Other Substances BY THE Same Processes OR Devices 1

Top 15 of 16 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Nippon Micrometal Corporation's patent record in context - here's where to go next.

Nippon Micrometal Corporation's lead technology class is H01L (Semiconductor Devices NOT Covered BY Class H10), 91.7% of its portfolio - see every assignee active in that class. Explore H01L
Ranked #6,932 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Nippon Micrometal Corporation against Nagoya Institute OF Technology, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 37.2/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.