Where does Leister Technologies AG rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Leister Technologies AG ranks #7,875 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Leister Technologies AG hold?

Leister Technologies AG holds 41 US utility patents granted between 2015 and 2025, spanning 11 technology areas.

What is Leister Technologies AG's Innovation Score?

Leister Technologies AG has an Innovation Score of 30.2 out of 100 (34th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Leister Technologies AG's patent grant rate increasing or decreasing?

Leister Technologies AG's recent grant velocity is -23% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Leister Technologies AG's patents?

Leister Technologies AG's patents average 4.6 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Leister Technologies AG patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Leister Technologies AG

Q: What technology areas does Leister Technologies AG focus on?

Leister Technologies AG's top technology area is B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing) with 11 patents, ranking #557 of 4,378 assignees active in that subclass. Grants appear in 11 CPC subclasses total.

USPTO PatentsView assignee record - 41 granted patents across 11 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Leister ranks #7,875 of 49,997 tracked US assignees by granted-patent volume, with 41 patents across 11 technology areas.

#7,875
of 49,997 US assignees by volume: 34th percentile
by Innovation Score (30.2/100): 4.6
avg claims per patent: -23%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R7875 · Foreign Corporation #7,875 · 41 grants

GRANTS-SMALL · UPPER-Q · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-SPARSE · TYPE-FRNCORP · VEL-DOWN · BOOK-FULL

GRANTS-SMALL 41 grants
UPPER-Q #7,875/49,997
PHOTO-FINISH Katmai Tech
CPC-FOCUS B29C · 11 areas
INNOV-THIN 30.2/100
CLAIMS-SPARSE 4.6 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DOWN -23% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Katmai Tech Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Leister’s 30.2 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 12.9 pts (43%) Velocity 2.9 pts (10%) Breadth 11.7 pts (39%) Claim depth 2.7 pts (9%)

Qualcomm Incorporated · highest

85
Citizen Systems Japan · near

30
Code Systems · near

30
ColorTokens · near

30
Leister · this assignee

30
Mobotix · near

30
3D Lighting… · lowest

7

What this shows Leister's Innovation Score is 30.2/100 (34th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Leister?

Each dot is one of Leister’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Leister’s own 4.6 claims/patent is at or below the 11.8 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Leister vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Leister's grants concentrate

Leister Technologies AG is a focused PatentsView assignee: 11 CPC subclasses with 26.8% of grants classified under B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing). Peak complete grant year is 2021 (10 grants) versus a trough of 1 in 2020. By volume, Leister sits between Katmai Tech Inc. and LexisNexis, a division of Reed Elsevier Inc..

Leister's three-year grant acceleration

Leister Technologies AG shows 6 grants in 2022–2024 against only 14 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Katmai Tech

41
Korea Food Resear…

41
KYE Systems

41
Keyssa Systems

41
Lifi Labs

41
Lite-on Singapore…

41
Little Giant Ladd…

41
Lexisnexis a divi…

41
Leister ◀

41

What this shows Leister holds 41 patents at rank #7,875, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Leister

By rank, the assignees closest to #7,875 in granted patent volume.

Leaders in B29C (Shaping OR Joining OF Plastics)

Other assignees with the most granted patents in Leister's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Leister, neither rank-band nor same-CPC leaders (those blocks stay above). In B29C (Shaping OR Joining OF Plastics), Leister ranks #557 of 4,378 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (30 here).

Mobotix AG 30 Code Systems Corporation 30 ColorTokens Inc. 30 Citizen Systems Japan Co., Ltd. 30

Leister's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

30 34th percentile higher than 34% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Leister Technologies AG patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	7	17.1%
2016	3	7.3%
2017	2	4.9%
2018	7	17.1%
2019	3	7.3%
2020	1	2.4%
2021	10	24.4%
2022	2	4.9%
2023	2	4.9%
2024	2	4.9%
2025partial year	2	4.9%

Which technologies does Leister Technologies AG patent most?

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 11

B29L - Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles 6

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 4

F24H - Fluid Heaters, e.g. Water OR AIR Heaters, Having Heat-generating Means, e.g. Heat Pumps, IN General 4

Y10T - Technical Subjects Covered BY Former US Classification 2

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 1

E04D - Roof COVERINGS; SKY-LIGHTS; GUTTERS; Roof-working Tools 1

H05B - Electric HEATING; Electric Light Sources NOT Otherwise Provided FOR; Circuit Arrangements FOR Electric Light Sources, IN General 1

C04B - Lime, MAGNESIA; SLAG; CEMENTS; Compositions Thereof, e.g. Mortars, Concrete OR Like Building MATERIALS; Artificial Stone ; Ceramics ; REFRACTORIES; Treatment OF Natural Stone 1

H01C - Resistors 1

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 1

Top 11 of 11 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Leister Technologies AG's patent record in context - here's where to go next.

Leister Technologies AG's lead technology class is B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing), 26.8% of its portfolio - see every assignee active in that class. Explore B29C
Ranked #7,875 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Leister Technologies AG against Katmai Tech Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 30.2/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.