Where does Hieta Technologies Limited rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Hieta Technologies Limited ranks #28,975 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Hieta Technologies Limited hold?

Hieta Technologies Limited holds 9 US utility patents granted between 2018 and 2023, spanning 17 technology areas.

What is Hieta Technologies Limited's Innovation Score?

Hieta Technologies Limited has an Innovation Score of 52.6 out of 100 (top 10% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Hieta Technologies Limited's patent grant rate increasing or decreasing?

Hieta Technologies Limited's recent grant velocity is +700% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Hieta Technologies Limited's patents?

Hieta Technologies Limited's patents average 16.8 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Hieta Technologies Limited patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Hieta Technologies Limited

Q: What technology areas does Hieta Technologies Limited focus on?

Hieta Technologies Limited's top technology area is F28D (Heat-exchange Apparatus, NOT Provided FOR IN Another Subclass, IN Which THE Heat-exchange Media DO NOT Come Into Direct Contact) with 6 patents, ranking #133 of 801 assignees active in that subclass. Grants appear in 17 CPC subclasses total.

USPTO PatentsView assignee record - 9 granted patents across 17 technology areas, recorded in grant years 2018–2023. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: F28D (Heat-exchange Apparatus, NOT Provided FOR IN Another Subclass, IN Which THE Heat-exchange Media DO NOT Come Into Direct Contact).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Hieta ranks #28,975 of 49,997 tracked US assignees by granted-patent volume, with 9 patents across 17 technology areas.

#28,975
of 49,997 US assignees by volume: Top 10%
by Innovation Score (52.6/100): 16.8
avg claims per patent: +700%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R28975 · Foreign Corporation #28,975 · 9 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-RICH · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 9 grants
MID-PACK #28,975/49,997
PHOTO-FINISH Heys International
CPC-FOCUS F28D · 17 areas
INNOV-PAR 52.6/100
CLAIMS-RICH 16.8 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +700% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Heys International Ltd. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Hieta’s 52.6 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 8.0 pts (15%) Velocity 20.0 pts (38%) Breadth 14.6 pts (28%) Claim depth 10.1 pts (19%)

Qualcomm Incorporated · highest

85
Hieta · this assignee

53
3D Lighting… · lowest

7

What this shows Hieta's Innovation Score is 52.6/100 (top 10% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Hieta?

Each dot is one of Hieta’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Hieta’s own 16.8 claims/patent is ABOVE the 11.4 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Hieta vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Hieta's grants concentrate

Hieta Technologies Limited is a focused PatentsView assignee: 17 CPC subclasses with 66.7% of grants classified under F28D (Heat-exchange Apparatus, NOT Provided FOR IN Another Subclass, IN Which THE Heat-exchange Media DO NOT Come Into Direct Contact). Peak complete grant year is 2023 (4 grants) versus a trough of 1 in 2018. By volume, Hieta sits between Heys International Ltd. and Hitachi Automotive Systems Kyushu, Ltd..

Hieta's three-year grant acceleration

Hieta Technologies Limited shows 6 grants in 2022–2024 against only 2 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Heys International

9
HG Partners

9
Hickies

9
Hicon

9
Higgstec

9
Hisep Technology

9
Histologics

9
Hitachi Automotiv…

9
Hieta ◀

9

What this shows Hieta holds 9 patents at rank #28,938, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Hieta

By rank, the assignees closest to #28,938 in granted patent volume.

Leaders in F28D (Heat-exchange Apparatus)

Other assignees with the most granted patents in Hieta's primary technology class.

Hieta's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

53 Top 10% higher than 90% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2018–2023

Grants by year

Teal-shaded recent years (2020–present) versus the 2018–2019 baseline. Full figures in the table below.

View data table

Hieta Technologies Limited patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2018	1	11.1%
2020	1	11.1%
2021	1	11.1%
2022	2	22.2%
2023	4	44.4%

Which technologies does Hieta Technologies Limited patent most?

F28D - Heat-exchange Apparatus, NOT Provided FOR IN Another Subclass, IN Which THE Heat-exchange Media DO NOT Come Into Direct Contact 6

F28F - Details OF Heat-exchange AND Heat-transfer Apparatus, OF General Application 5

F02C - Gas-turbine PLANTS; AIR Intakes FOR Jet-propulsion PLANTS; Controlling Fuel Supply IN Air-breathing Jet-propulsion Plants 4

Y02T - Climate Change Mitigation Technologies Related TO Transportation 3

F05D - Indexing Scheme FOR Aspects Relating TO Non-positive-displacement Machines OR Engines, Gas-turbines OR Jet-propulsion Plants 3

F01N - Gas-flow Silencers OR Exhaust Apparatus FOR Machines OR Engines IN GENERAL; Gas-flow Silencers OR Exhaust Apparatus FOR Internal-combustion Engines 3

F02B - Internal-combustion Piston ENGINES; Combustion Engines IN General 2

F01K - Steam Engine PLANTS; Steam ACCUMULATORS; Engine Plants NOT Otherwise Provided FOR; Engines Using Special Working Fluids OR Cycles 2

B21D - Working OR Processing OF Sheet Metal OR Metal Tubes, Rods OR Profiles Without Essentially Removing MATERIAL; Punching Metal 2

B33Y - Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective Laser Sintering 2

B22F - Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder 2

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 2

F02G - HOT GAS OR Combustion-product Positive-displacement Engine Plants ; USE OF Waste Heat OF Combustion ENGINES; NOT Otherwise Provided FOR 2

F23R - Generating Combustion Products OF High Pressure OR High Velocity, e.g. Gas-turbine Combustion Chambers 1

F01D - Non-positive Displacement Machines OR Engines, e.g. Steam Turbines 1

Top 15 of 17 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Hieta Technologies Limited's patent record in context - here's where to go next.

Hieta Technologies Limited's lead technology class is F28D (Heat-exchange Apparatus, NOT Provided FOR IN Another Subclass, IN Which THE Heat-exchange Media DO NOT Come Into Direct Contact), 66.7% of its portfolio - see every assignee active in that class. Explore F28D
Ranked #28,975 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Hieta Technologies Limited against Heys International Ltd., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 52.6/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.