Overall rank by patents
#2,179
Across all tracked assignees
USPTO 2015–2025 USPTO PatentsView Foreign Corporation
DOWA Electronics Materials Co., Ltd.
USPTO PatentsView assignee record — 180 granted patents across 48 technology areas, active 2015–2025. Filing-trend and competitive-moat analysis cross-referenced to USPTO Patent Public Search. Primary class: B22F (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER ; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER).
180
Total patents granted
48
CPC technology areas
8.2
Avg claims per patent
+7%
5-year filing velocity
Portfolio overview
DOWA Electronics Materials Co., Ltd. has been granted 180 US utility patents between 2015 and 2025, placing DOWA Electronics Materials Co., Ltd. at rank #2,179 across all assignees tracked by PlainPatent. This portfolio spans 48 distinct Cooperative Patent Classification (CPC) subclasses, averaging 8.2 claims per patent with primary concentration in B22F (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER ; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER). As a Foreign Corporation, DOWA Electronics Materials Co., Ltd. is one of the more focused assignees in the PatentsView dataset. The composite Innovation Score of 52.5/100 blends portfolio volume, filing velocity, technology breadth, and claim depth into a single comparable measure drawn directly from USPTO PatentsView records.
Filing cadence tells the strategic story. Between 2020 and 2025 the company received 93 grants, compared with 87 in the 2015–2019 window — a +7% shift in five-year velocity. Steady filing volume suggests sustained innovation without dramatic pivots. The Foreign Corporation classification further shapes interpretation, since corporate, government, and individual filers pursue patents for materially different reasons.
Claim depth and technology breadth together indicate competitive posture. DOWA Electronics Materials Co., Ltd.'s 8.2 average claims per patent suggests focused, narrowly drawn claims typical of single-invention filings, while a multi-domain presence across 48 subclasses balances depth with breadth. Combined with portfolio volume, these signals let analysts, investors, and licensing professionals benchmark DOWA Electronics Materials Co., Ltd. against peers pursuing similar technology classes.
How does DOWA compare?
Granted US patents 2015–2025 versus the largest corporate holders — this company marked ◀
- Samsung
SAMSUNG ELECTRONICS CO., LTD.
106,890 patents
- International Bus…
International Business Machines Corporation
72,926 patents
- Canon 34,378
Canon Kabushiki Kaisha
34,378 patents
- LG 32,607
LG ELECTRONICS INC.
32,607 patents
- Taiwan Semiconduc… 31,041
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
31,041 patents
- Apple 30,560
Apple Inc.
30,560 patents
- Qualcomm Incorpor… 30,354
QUALCOMM Incorporated
30,354 patents
- Intel 27,498
Intel Corporation
27,498 patents
- DOWA Materials ◀ 180
DOWA Electronics Materials Co., Ltd.
180 patents
What this shows DOWA holds 180 patents — placing it at rank #2,179 overall, well behind the volume leaders but ahead of the tens of thousands of smaller assignees in the dataset.
USPTO utility patent grants by year · 2015–2025
Grants by year
Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.
View data table
| Year | Patents Granted | Share of Period |
|---|---|---|
| 2015 | 19 | 10.6% |
| 2016 | 19 | 10.6% |
| 2017 | 15 | 8.3% |
| 2018 | 14 | 7.8% |
| 2019 | 20 | 11.1% |
| 2020 | 18 | 10.0% |
| 2021 | 19 | 10.6% |
| 2022 | 21 | 11.7% |
| 2023 | 8 | 4.4% |
| 2024 | 15 | 8.3% |
| 2025 | 12 | 6.7% |
Which technologies does DOWA Electronics Materials Co., Ltd. patent most?
C22C— ALLOYS 37
Top 15 of 48 technology areas
Patent Moat Analysis
Portfolio Volume Moderate
Tech Breadth Multi-domain
Claim Depth Simple
Velocity Growing
Frequently Asked Questions
How many patents does DOWA Electronics Materials Co., Ltd. hold?
DOWA Electronics Materials Co., Ltd. holds 180 US granted patents filed between 2015 and 2025, spanning 48 technology areas.
What is DOWA Electronics Materials Co., Ltd.'s Innovation Score?
DOWA Electronics Materials Co., Ltd. has an Innovation Score of 52.5 out of 100. This composite metric weighs portfolio volume (40%), filing velocity (20%), technology breadth (25%), and claim depth (15%).
What technology areas does DOWA Electronics Materials Co., Ltd. focus on?
DOWA Electronics Materials Co., Ltd.'s top technology area is B22F (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER ; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER) with 67 patents. The company has filed patents in 48 CPC subclasses total.
Is DOWA Electronics Materials Co., Ltd.'s patent filing rate increasing or decreasing?
DOWA Electronics Materials Co., Ltd.'s recent filing velocity is +7% compared to the prior five-year period. The company is maintaining or growing its patent output.
What does claim depth mean for DOWA Electronics Materials Co., Ltd.'s patents?
DOWA Electronics Materials Co., Ltd.'s patents average 8.2 claims each. This is relatively simple claim structure, typical for focused inventions.
How is the DOWA Electronics Materials Co., Ltd. patent data sourced?
All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.
Learn More
Explore the patent dataset
B22F technology
DOWA Electronics Materials Co., Ltd.'s primary CPC class — all holders and yearly trends
Top 50 patent holders
See where DOWA Electronics Materials Co., Ltd. ranks among the largest US patent assignees
All technology classes
Browse every CPC technology area by patent activity
How the score works
The four dimensions behind the Innovation Score
Related
Data sourced from USPTO PatentsView — official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent Editorial
Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.
Read our methodology — how this data is sourced, computed, and verified.
All federal data sources used on this page
- USPTO PatentsView — official U.S. Patent and Trademark Office bulk patent data. patentsview.org
- USPTO Patent Application Information Retrieval (PAIR) — application status and file history. uspto.gov/patents/pair
- USPTO Bulk Data Storage System — comprehensive patent text + claims dataset. bulkdata.uspto.gov
- USPTO CPC Classification — Cooperative Patent Classification scheme for technology categorization. uspto.gov/cpc
- SEC EDGAR — public filings cross-reference for assignee corporate entity matching. sec.gov/edgar
- WIPO PATENTSCOPE — international patent context (related international filings). wipo.int/patentscope
