Where does Dowa Electronics Materials Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Dowa Electronics Materials Co., Ltd. ranks #2,180 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Dowa Electronics Materials Co., Ltd. hold?

Dowa Electronics Materials Co., Ltd. holds 180 US utility patents granted between 2015 and 2025, spanning 48 technology areas.

What is Dowa Electronics Materials Co., Ltd.'s Innovation Score?

Dowa Electronics Materials Co., Ltd. has an Innovation Score of 52.5 out of 100 (top 10% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Dowa Electronics Materials Co., Ltd.'s patent grant rate increasing or decreasing?

Dowa Electronics Materials Co., Ltd.'s recent grant velocity is -7% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Dowa Electronics Materials Co., Ltd.'s patents?

Dowa Electronics Materials Co., Ltd.'s patents average 8.2 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Dowa Electronics Materials Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Dowa Electronics Materials Co., Ltd.

Q: What technology areas does Dowa Electronics Materials Co., Ltd. focus on?

Dowa Electronics Materials Co., Ltd.'s top technology area is B22F (Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder) with 67 patents, ranking #15 of 926 assignees active in that subclass. Grants appear in 48 CPC subclasses total.

USPTO PatentsView assignee record - 180 granted patents across 48 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B22F (Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Dowa ranks #2,180 of 49,997 tracked US assignees by granted-patent volume, with 180 patents across 48 technology areas.

#2,180
of 49,997 US assignees by volume: Top 10%
by Innovation Score (52.5/100): 8.2
avg claims per patent: -7%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R2180 · Foreign Corporation #2,180 · 180 grants

GRANTS-MID · TOP-DECILE · PHOTO-FINISH · CPC-WIDE · INNOV-PAR · CLAIMS-PAR · TYPE-FRNCORP · VEL-FLAT · BOOK-FULL

GRANTS-MID 180 grants
TOP-DECILE #2,180/49,997
PHOTO-FINISH 3shape A/S
CPC-WIDE B22F · 48 areas
INNOV-PAR 52.5/100
CLAIMS-PAR 8.2 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-FLAT -7% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: 3shape A/S (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Dowa’s 52.5 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 18.0 pts (34%) Velocity 5.1 pts (10%) Breadth 24.5 pts (47%) Claim depth 4.9 pts (9%)

Qualcomm Incorporated · highest

85
Dowa Materials · this assignee

53
Drnc Holdings · near

53
GE Global Sourcing · near

53
Johnson Electric · near

53
MultiDimension… · near

53
3D Lighting… · lowest

7

What this shows Dowa's Innovation Score is 52.5/100 (top 10% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Dowa?

Each dot is one of Dowa’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Dowa’s own 8.2 claims/patent is at or below the 13.1 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Dowa vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Dowa's grants concentrate

Dowa Electronics Materials Co., Ltd. is a focused PatentsView assignee: 48 CPC subclasses with 37.2% of grants classified under B22F (Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder). Peak complete grant year is 2022 (21 grants) versus a trough of 8 in 2023. By volume, Dowa sits between Piaggio & C. SPA and Maplebear Inc..

Dowa's three-year grant acceleration

From 2019–2021 to 2022–2024, Dowa Electronics Materials Co., Ltd. moved from 57 to 44 grants (0.77x the prior three-year total, a multiple, not a CAGR). Among 3,296 tracked assignees with ≥100 grants and ≥20 prior-period grants, that multiple ranks #1,925. See the growth leaderboard.

Piaggio & C SPA

181
The Sherwin-willi…

181
3shape A/S

180
Bomag

180
DRÄGER Safety & K…

180
Delavan

180
Giesecke+Devrient…

180
Maplebear

180
Dowa Materials ◀

180

What this shows Dowa holds 180 patents at rank #2,179, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Dowa

By rank, the assignees closest to #2,179 in granted patent volume.

Leaders in B22F (Working Metallic Powder)

Other assignees with the most granted patents in Dowa's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Dowa, neither rank-band nor same-CPC leaders (those blocks stay above). In B22F (Working Metallic Powder), Dowa ranks #15 of 926 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (53 here).

GE Global Sourcing LLC 53 Johnson Electric S.A. 53 MultiDimension Technology Co., Ltd. 53 Drnc Holdings, Inc. 53

Similar claim depth

Nearest assignees by average claims per patent (8.2 here).

Lego A/S 8.2 avg NOF Corporation 8.2 avg Pouch Pac Innovations, LLC 8.2 avg Detnet South Africa (PTY) Ltd 8.2 avg

Dowa's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

53 Top 10% higher than 90% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Dowa Electronics Materials Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	19	10.6%
2016	19	10.6%
2017	15	8.3%
2018	14	7.8%
2019	20	11.1%
2020	18	10.0%
2021	19	10.6%
2022	21	11.7%
2023	8	4.4%
2024	15	8.3%
2025partial year	12	6.7%

Which technologies does Dowa Electronics Materials Co., Ltd. patent most?

B22F - Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder 67

H01B - CABLES; CONDUCTORS; INSULATORS; Selection OF Materials FOR Their Conductive, Insulating OR Dielectric Properties 52

H10H - Inorganic Light-emitting Semiconductor Devices Having Potential Barriers 48

C01P - Indexing Scheme Relating TO Structural AND Physical Aspects OF Solid Inorganic Compounds 37

C22C - Alloys 37

C01G - Compounds Containing Metals NOT Covered BY Subclasses C01d OR C01f 33

H01L - Semiconductor Devices NOT Covered BY Class H10 32

H01F - MAGNETS; INDUCTANCES; TRANSFORMERS; Selection OF Materials FOR Their Magnetic Properties 31

C09D - Coating Compositions, e.g. Paints, Varnishes OR LACQUERS; Filling PASTES; Chemical Paint OR INK REMOVERS; INKS; Correcting FLUIDS; WOODSTAINS; Pastes OR Solids FOR Colouring OR PRINTING; USE OF Materials Therefor 21

G03G - ELECTROGRAPHY; ELECTROPHOTOGRAPHY; Magnetography 16

B82Y - Specific Uses OR Applications OF NANOSTRUCTURES; Measurement OR Analysis OF NANOSTRUCTURES; Manufacture OR Treatment OF Nanostructures 16

G11B - Information Storage Based ON Relative Movement Between Record Carrier AND Transducer 15

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 15

Y02E - Reduction OF Greenhouse GAS [GHG] Emissions, Related TO Energy Generation, Transmission OR Distribution 13

C08K - Use of inorganic or non-macromolecular organic substances as compounding ingredients 12

Top 15 of 48 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Dowa Electronics Materials Co., Ltd.'s patent record in context - here's where to go next.

Dowa Electronics Materials Co., Ltd.'s lead technology class is B22F (Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder), 37.2% of its portfolio - see every assignee active in that class. Explore B22F
Ranked #2,180 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Dowa Electronics Materials Co., Ltd. against Piaggio & C. SPA, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 52.5/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.