Where does Chipbond Technology Corporation rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Chipbond Technology Corporation ranks #6,634 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Chipbond Technology Corporation hold?

Chipbond Technology Corporation holds 50 US utility patents granted between 2015 and 2025, spanning 15 technology areas.

What is Chipbond Technology Corporation's Innovation Score?

Chipbond Technology Corporation has an Innovation Score of 40.2 out of 100 (top 36% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Chipbond Technology Corporation focus on?

Chipbond Technology Corporation's top technology area is H01L (Semiconductor Devices NOT Covered BY Class H10) with 28 patents, ranking #469 of 3,373 assignees active in that subclass. Grants appear in 15 CPC subclasses total.

Is Chipbond Technology Corporation's patent grant rate increasing or decreasing?

Chipbond Technology Corporation's recent grant velocity is +44% compared to the prior five-year period (grant years, not application filing dates). The company is maintaining or growing its granted-patent output.

What does claim depth mean for Chipbond Technology Corporation's patents?

Chipbond Technology Corporation's patents average 12.4 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Chipbond Technology Corporation patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Chipbond Technology Corporation

USPTO PatentsView assignee record - 50 granted patents across 15 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01L (Semiconductor Devices NOT Covered BY Class H10).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Chipbond ranks #6,634 of 49,997 tracked US assignees by granted-patent volume, with 50 patents across 15 technology areas.

#6,634
of 49,997 US assignees by volume: Top 36%
by Innovation Score (40.2/100): 12.4
avg claims per patent: +44%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R6634 · Foreign Corporation #6,634 · 50 grants

GRANTS-SMALL · UPPER-Q · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-RICH · TYPE-FRNCORP · VEL-UP · BOOK-FULL

GRANTS-SMALL 50 grants
UPPER-Q #6,634/49,997
PHOTO-FINISH British Columbia…
CPC-FOCUS H01L · 15 areas
INNOV-PAR 40.2/100
CLAIMS-RICH 12.4 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-UP +44% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: British Columbia Cancer Agency Branch (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Chipbond’s 40.2 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 13.6 pts (34%) Velocity 5.5 pts (14%) Breadth 13.7 pts (34%) Claim depth 7.5 pts (19%)

Qualcomm Incorporated · highest

85
Showa Denko Packaging · near

40
Alpvision · near

40
Chipbond Technology · this assignee

40
Pacific Scientific… · near

40
Applied Micro Circuits · near

40
3D Lighting… · lowest

7

What this shows Chipbond's Innovation Score is 40.2/100 (top 36% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Chipbond?

Each dot is one of Chipbond’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Chipbond’s own 12.4 claims/patent is at or below the 12.8 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Chipbond vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Chipbond's grants concentrate

Chipbond Technology Corporation is a focused PatentsView assignee: 15 CPC subclasses with 56% of grants classified under H01L (Semiconductor Devices NOT Covered BY Class H10). Peak complete grant year is 2021 (8 grants) versus a trough of 1 in 2017. By volume, Chipbond sits between British Columbia Cancer Agency Branch and Cascade Corporation.

Chipbond's three-year grant acceleration

Chipbond Technology Corporation shows 14 grants in 2022–2024 against only 17 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

British Columbia…

50
Central Garden &…

50
Chdi Foundation

50
Chinese Research…

50
Coavis

50
CSIR

50
Capstan Systems

50
Cascade

50
Chipbond Technolo… ◀

50

What this shows Chipbond holds 50 patents at rank #6,632, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Chipbond

By rank, the assignees closest to #6,632 in granted patent volume.

Leaders in H01L (Semiconductor Devices NOT Covered BY Class H10)

Other assignees with the most granted patents in Chipbond's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Chipbond, neither rank-band nor same-CPC leaders (those blocks stay above). In H01L (Semiconductor Devices NOT Covered BY Class H10), Chipbond ranks #469 of 3,373 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (40 here).

Pacific Scientific Energetic Materials Company 40 Alpvision S.A. 40 Applied Micro Circuits Corporation 40 Showa Denko Packaging Co., Ltd. 40

Similar claim depth

Nearest assignees by average claims per patent (12.4 here).

MTU Friedrichshafen GMBH 12.4 avg Yamaguchi University 12.4 avg Morehouse School OF Medicine 12.4 avg Haworth, Inc. 12.4 avg

Chipbond's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

40 Top 36% higher than 64% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Chipbond Technology Corporation patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	6	12.0%
2016	4	8.0%
2017	1	2.0%
2018	2	4.0%
2019	5	10.0%
2020	4	8.0%
2021	8	16.0%
2022	6	12.0%
2023	7	14.0%
2024	1	2.0%
2025partial year	6	12.0%

Which technologies does Chipbond Technology Corporation patent most?

H01L - Semiconductor Devices NOT Covered BY Class H10 28

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 21

H10N - Electric Solid-state Devices NOT Otherwise Provided FOR 2

H03H - Impedance Networks, e.g. Resonant CIRCUITS; Resonators 2

C25D - Processes FOR THE Electrolytic OR Electrophoretic Production OF COATINGS; ELECTROFORMING; Apparatus Therefor 2

H01F - MAGNETS; INDUCTANCES; TRANSFORMERS; Selection OF Materials FOR Their Magnetic Properties 2

B65H - Handling Thin OR Filamentary Material, e.g. Sheets, Webs, Cables 1

F28F - Details OF Heat-exchange AND Heat-transfer Apparatus, OF General Application 1

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 1

C23C - Coating Metallic MATERIAL; Coating Material With Metallic MATERIAL; Surface Treatment OF Metallic Material BY Diffusion Into THE Surface, BY Chemical Conversion OR SUBSTITUTION; Coating BY Vacuum Evaporation, BY Sputtering, BY ION Implantation OR BY Chemical Vapour Deposition, IN General 1

B65D - Containers FOR Storage OR Transport OF Articles OR Materials, e.g. Bags, Barrels, Bottles, Boxes, Cans, Cartons, Crates, Drums, Jars, Tanks, Hoppers, Forwarding CONTAINERS; Accessories, Closures, OR Fittings THEREFOR; Packaging ELEMENTS; Packages 1

G02F - Optical Devices OR Arrangements FOR THE Control OF Light BY Modification OF THE Optical Properties OF THE Media OF THE Elements Involved THEREIN; Non-linear OPTICS; Frequency-changing OF LIGHT; Optical Logic ELEMENTS; Optical ANALOGUE/DIGITAL Converters 1

Y10T - Technical Subjects Covered BY Former US Classification 1

H10D - Inorganic Electric Semiconductor Devices 1

H10H - Inorganic Light-emitting Semiconductor Devices Having Potential Barriers 1

Top 15 of 15 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Chipbond Technology Corporation's patent record in context - here's where to go next.

Chipbond Technology Corporation's lead technology class is H01L (Semiconductor Devices NOT Covered BY Class H10), 56% of its portfolio - see every assignee active in that class. Explore H01L
Ranked #6,634 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Chipbond Technology Corporation against British Columbia Cancer Agency Branch, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 40.2/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.