Adeia Semiconductor Bonding Technologies Inc.

Adeia Semiconductor Bonding Technologies Inc. has been granted 152 US utility patents between 2022 and 2025, placing Adeia Semiconductor Bonding Technologies Inc. at rank #2,553 across all assignees tracked by PlainPatent. This portfolio spans 27 distinct Cooperative Patent Classification (CPC) subclasses, averaging 23.1 claims per patent with primary concentration in H01L (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10). As a US Corporation, Adeia Semiconductor Bonding Technologies Inc. is one of the more focused assignees in the PatentsView dataset. The composite Innovation Score of 69.6/100 blends portfolio volume, filing velocity, technology breadth, and claim depth into a single comparable measure drawn directly from USPTO PatentsView records.

Filing cadence tells the strategic story. Historical data spans 2022 through 2025, with 152 total grants over that period. Velocity comparisons require five years of historical filings to calibrate. The US Corporation classification further shapes interpretation, since corporate, government, and individual filers pursue patents for materially different reasons.

Claim depth and technology breadth together indicate competitive posture. Adeia Semiconductor Bonding Technologies Inc.'s 23.1 average claims per patent reflects complex, broadly scoped inventions that are difficult for competitors to design around, while a multi-domain presence across 27 subclasses balances depth with breadth. Combined with portfolio volume, these signals let analysts, investors, and licensing professionals benchmark Adeia Semiconductor Bonding Technologies Inc. against peers pursuing similar technology classes.