Where does Material Concept, Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Material Concept, Inc. ranks #26,808 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Material Concept, Inc. hold?

Material Concept, Inc. holds 10 US utility patents granted between 2017 and 2025, spanning 15 technology areas.

What is Material Concept, Inc.'s Innovation Score?

Material Concept, Inc. has an Innovation Score of 37.2 out of 100 (top 44% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Material Concept, Inc.'s patent grant rate increasing or decreasing?

Material Concept, Inc.'s recent grant velocity is +25% compared to the prior five-year period (grant years, not application filing dates). The company is maintaining or growing its granted-patent output.

What does claim depth mean for Material Concept, Inc.'s patents?

Material Concept, Inc.'s patents average 10.6 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Material Concept, Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Material Concept, Inc.

Q: What technology areas does Material Concept, Inc. focus on?

Material Concept, Inc.'s top technology area is H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components) with 6 patents. Grants appear in 15 CPC subclasses total.

USPTO PatentsView assignee record - 10 granted patents across 15 technology areas, recorded in grant years 2017–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Material ranks #26,808 of 49,997 tracked US assignees by granted-patent volume, with 10 patents across 15 technology areas.

#26,808
of 49,997 US assignees by volume: Top 44%
by Innovation Score (37.2/100): 10.6
avg claims per patent: +25%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R26808 · Foreign Corporation #26,808 · 10 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-PAR · TYPE-FRNCORP · VEL-UP · BOOK-FULL

GRANTS-MICRO 10 grants
MID-PACK #26,808/49,997
PHOTO-FINISH Maruha Nichiro
CPC-FOCUS H05K · 15 areas
INNOV-THIN 37.2/100
CLAIMS-PAR 10.6 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-UP +25% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Maruha Nichiro Corporation (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Material Concept · this assignee

37
3D Lighting… · lowest

7

What this shows Material's Innovation Score is 37.2/100 (top 44% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Material's grants concentrate

Material Concept, Inc. is a focused PatentsView assignee: 15 CPC subclasses with 60% of grants classified under H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components). Peak complete grant year is 2019 (2 grants) versus a trough of 1 in 2017. By volume, Material sits between Maruha Nichiro Corporation and Mcpp Innovation LLC.

Material's three-year grant acceleration

Material Concept, Inc. shows 4 grants in 2022–2024 against only 3 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Maruha Nichiro

10
Master Dynamic

10
Masterbuilt Manuf…

10
Masterpiece Hardw…

10
Mavic S

10
Mayr-melnhof Kart…

10
MB

10
Mcpp Innovation

10
Material Concept ◀

10

What this shows Material holds 10 patents at rank #26,790, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Material

By rank, the assignees closest to #26,790 in granted patent volume.

Leaders in H05K (Printed Circuits)

Other assignees with the most granted patents in Material's primary technology class.

Material's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

37 Top 44% higher than 56% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2017–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2017–2019 baseline. Full figures in the table below.

View data table

Material Concept, Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2017	1	10.0%
2018	1	10.0%
2019	2	20.0%
2020	1	10.0%
2022	2	20.0%
2023	1	10.0%
2024	1	10.0%
2025partial year	1	10.0%

Which technologies does Material Concept, Inc. patent most?

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 6

H01L - Semiconductor Devices NOT Covered BY Class H10 5

Y02E - Reduction OF Greenhouse GAS [GHG] Emissions, Related TO Energy Generation, Transmission OR Distribution 4

H10F - Inorganic Semiconductor Devices Sensitive TO Infrared Radiation, Light, Electromagnetic Radiation OF Shorter Wavelength OR Corpuscular Radiation 4

B22F - Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder 3

H01B - CABLES; CONDUCTORS; INSULATORS; Selection OF Materials FOR Their Conductive, Insulating OR Dielectric Properties 2

C22C - Alloys 1

Y10T - Technical Subjects Covered BY Former US Classification 1

H01G - CAPACITORS; Capacitors, Rectifiers, Detectors, Switching Devices, Light-sensitive OR Temperature-sensitive Devices OF THE Electrolytic Type 1

H10N - Electric Solid-state Devices NOT Otherwise Provided FOR 1

H10K - Organic Electric Solid-state Devices 1

H10H - Inorganic Light-emitting Semiconductor Devices Having Potential Barriers 1

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 1

C04B - Lime, MAGNESIA; SLAG; CEMENTS; Compositions Thereof, e.g. Mortars, Concrete OR Like Building MATERIALS; Artificial Stone ; Ceramics ; REFRACTORIES; Treatment OF Natural Stone 1

B05D - Processes FOR Applying Fluent Materials TO Surfaces, IN General 1

Top 15 of 15 technology areas

Where it ranks

Overall rank by patents

#26,808

of 49,997 tracked assignees

Innovation Score

37.2 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Material Concept, Inc.'s patent record in context - here's where to go next.

Material Concept, Inc.'s lead technology class is H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components), 60% of its portfolio - see every assignee active in that class. Explore H05K
Ranked #26,808 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Material Concept, Inc. against Maruha Nichiro Corporation, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 37.2/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.