Where does Invensas Bonding Technologies, Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Invensas Bonding Technologies, Inc. ranks #4,672 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Invensas Bonding Technologies, Inc. hold?

Invensas Bonding Technologies, Inc. holds 75 US utility patents granted between 2017 and 2022, spanning 18 technology areas.

What is Invensas Bonding Technologies, Inc.'s Innovation Score?

Invensas Bonding Technologies, Inc. has an Innovation Score of 45.4 out of 100 (top 23% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Invensas Bonding Technologies, Inc.'s patent grant rate increasing or decreasing?

Invensas Bonding Technologies, Inc.'s recent grant velocity is +195% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Invensas Bonding Technologies, Inc.'s patents?

Invensas Bonding Technologies, Inc.'s patents average 21.5 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Invensas Bonding Technologies, Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView US Corporation

Invensas Bonding Technologies, Inc.

Q: What technology areas does Invensas Bonding Technologies, Inc. focus on?

Invensas Bonding Technologies, Inc.'s top technology area is H01L (Semiconductor Devices NOT Covered BY Class H10) with 72 patents. Grants appear in 18 CPC subclasses total.

USPTO PatentsView assignee record - 75 granted patents across 18 technology areas, recorded in grant years 2017–2022. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01L (Semiconductor Devices NOT Covered BY Class H10).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Invensas ranks #4,672 of 49,997 tracked US assignees by granted-patent volume, with 75 patents across 18 technology areas.

#4,672
of 49,997 US assignees by volume: Top 23%
by Innovation Score (45.4/100): 21.5
avg claims per patent: +195%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R4672 · US Corporation #4,672 · 75 grants

GRANTS-SMALL · TOP-DECILE · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-DENSE · TYPE-USCORP · VEL-SURGE · BOOK-FULL

GRANTS-SMALL 75 grants
TOP-DECILE #4,672/49,997
PHOTO-FINISH Hefei Reliance Memory
CPC-FOCUS H01L · 18 areas
INNOV-PAR 45.4/100
CLAIMS-DENSE 21.5 claims/avg
TYPE-USCORP US Corporation
VEL-SURGE +195% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Hefei Reliance Memory Limited (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Nuvera Fuel Cells · near

45
Fette Compacting · near

45
Invensas Bonding · this assignee

45
THE Chugoku… · near

45
XConnect · near

45
3D Lighting… · lowest

7

What this shows Invensas's Innovation Score is 45.4/100 (top 23% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Invensas's grants concentrate

Invensas Bonding Technologies, Inc. is a focused PatentsView assignee: 18 CPC subclasses with 96% of grants classified under H01L (Semiconductor Devices NOT Covered BY Class H10). Peak complete grant year is 2021 (19 grants) versus a trough of 1 in 2017. By volume, Invensas sits between Hitachi-ge Nuclear Energy, Ltd. and MCS Industries, Inc..

Invensas's three-year grant acceleration

From 2019–2021 to 2022–2024, Invensas Bonding Technologies, Inc. moved from 51 to 19 grants (0.37x the prior three-year total, a multiple, not a CAGR). See the growth leaderboard.

Hitachi-ge Nuclea…

75
Hefei Reliance Me…

75
Hussmann

75
Hyundai Steel

75
Incept

75
LDR Medical

75
Lifenet Health

75
MCS Industries

75
Invensas Bonding ◀

75

What this shows Invensas holds 75 patents at rank #4,671, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Invensas

By rank, the assignees closest to #4,671 in granted patent volume.

Leaders in H01L (Semiconductor Devices NOT Covered BY Class H10)

Other assignees with the most granted patents in Invensas's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Invensas, neither rank-band nor same-CPC leaders (those blocks stay above).

Similar innovation score

Nearest assignees by Innovation Score (45 here).

Fette Compacting GmbH 45 THE Chugoku Electric Power Co., Inc. 45 XConnect, LLC 45 Nuvera Fuel Cells, LLC 45

Similar claim depth

Nearest assignees by average claims per patent (21.5 here).

The Babcock & Wilcox Company 21.5 avg Varian Medical Systems International AG 21.5 avg Built Robotics Inc. 21.5 avg Konami Gaming, Inc. 21.5 avg

Invensas's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

45 Top 23% higher than 77% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2017–2022

Grants by year

Teal-shaded recent years (2020–present) versus the 2017–2019 baseline. Full figures in the table below.

View data table

Invensas Bonding Technologies, Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2017	1	1.3%
2018	4	5.3%
2019	14	18.7%
2020	18	24.0%
2021	19	25.3%
2022	19	25.3%

Which technologies does Invensas Bonding Technologies, Inc. patent most?

H01L - Semiconductor Devices NOT Covered BY Class H10 72

B81C - Processes OR Apparatus Specially Adapted FOR THE Manufacture OR Treatment OF Microstructural Devices OR Systems 13

B81B - Microstructural Devices OR Systems, e.g. Micromechanical Devices 11

H10D - Inorganic Electric Semiconductor Devices 8

Y10T - Technical Subjects Covered BY Former US Classification 3

H03H - Impedance Networks, e.g. Resonant CIRCUITS; Resonators 3

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 3

B24B - Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents 2

C23F - Non-mechanical Removal OF Metallic Material From Surface ; Inhibiting Corrosion OF Metallic Material OR Incrustation IN GENERAL; Multi-step Processes FOR Surface Treatment OF Metallic Material Involving AT Least ONE Process Provided FOR IN Class C23 AND AT Least ONE Process Covered BY Subclass C21d 2

G02B - Optical Elements, Systems OR Apparatus 2

Y10S - Technical Subjects Covered BY Former Uspc Cross-reference ART Collections [XRACs] AND Digests 2

H10F - Inorganic Semiconductor Devices Sensitive TO Infrared Radiation, Light, Electromagnetic Radiation OF Shorter Wavelength OR Corpuscular Radiation 2

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 1

G01R - Measuring Electric VARIABLES; Measuring Magnetic Variables 1

H04L - Transmission OF Digital Information, e.g. Telegraphic Communication 1

Top 15 of 18 technology areas

Where it ranks

Overall rank by patents

#4,672

of 49,997 tracked assignees

Innovation Score

45.4 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Invensas Bonding Technologies, Inc.'s patent record in context - here's where to go next.

Invensas Bonding Technologies, Inc.'s lead technology class is H01L (Semiconductor Devices NOT Covered BY Class H10), 96% of its portfolio - see every assignee active in that class. Explore H01L
Ranked #4,672 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Invensas Bonding Technologies, Inc. against Hitachi-ge Nuclear Energy, Ltd., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 45.4/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.