Where does Hypertherm, Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Hypertherm, Inc. ranks #2,359 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Hypertherm, Inc. hold?

Hypertherm, Inc. holds 166 US utility patents granted between 2015 and 2025, spanning 38 technology areas.

What is Hypertherm, Inc.'s Innovation Score?

Hypertherm, Inc. has an Innovation Score of 55.3 out of 100 (top 7% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Hypertherm, Inc.'s patent grant rate increasing or decreasing?

Hypertherm, Inc.'s recent grant velocity is +11% compared to the prior five-year period (grant years, not application filing dates). The company is maintaining or growing its granted-patent output.

What does claim depth mean for Hypertherm, Inc.'s patents?

Hypertherm, Inc.'s patents average 21.0 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Hypertherm, Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView US Corporation

Hypertherm, Inc.

Q: What technology areas does Hypertherm, Inc. focus on?

Hypertherm, Inc.'s top technology area is B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam) with 118 patents, ranking #12 of 1,623 assignees active in that subclass. Grants appear in 38 CPC subclasses total.

USPTO PatentsView assignee record - 166 granted patents across 38 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Hypertherm ranks #2,359 of 49,997 tracked US assignees by granted-patent volume, with 166 patents across 38 technology areas.

#2,359
of 49,997 US assignees by volume: Top 7%
by Innovation Score (55.3/100): 21.0
avg claims per patent: +11%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R2359 · US Corporation #2,359 · 166 grants

GRANTS-MID · TOP-DECILE · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-DENSE · TYPE-USCORP · VEL-UP · BOOK-FULL

GRANTS-MID 166 grants
TOP-DECILE #2,359/49,997
PHOTO-FINISH Canva Pty
CPC-FOCUS B23K · 38 areas
INNOV-PAR 55.3/100
CLAIMS-DENSE 21.0 claims/avg
TYPE-USCORP US Corporation
VEL-UP +11% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Canva Pty Ltd (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Hypertherm’s 55.3 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 17.7 pts (32%) Velocity 3.2 pts (6%) Breadth 21.8 pts (39%) Claim depth 12.6 pts (23%)

Qualcomm Incorporated · highest

85
NIO USA · near

55
Stryker European… · near

55
Hypertherm · this assignee

55
National University… · near

55
Finisar · near

55
3D Lighting… · lowest

7

What this shows Hypertherm's Innovation Score is 55.3/100 (top 7% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Hypertherm?

Each dot is one of Hypertherm’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Hypertherm’s own 21.0 claims/patent is ABOVE the 16.0 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Hypertherm vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Hypertherm's grants concentrate

Hypertherm, Inc. is a focused PatentsView assignee: 38 CPC subclasses with 71.1% of grants classified under B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam). Peak complete grant year is 2020 (37 grants) versus a trough of 9 in 2022. By volume, Hypertherm sits between Vivotek Inc. and RF Micro Devices, Inc..

Hypertherm's three-year grant acceleration

From 2019–2021 to 2022–2024, Hypertherm, Inc. moved from 67 to 32 grants (0.48x the prior three-year total, a multiple, not a CAGR). Among 3,296 tracked assignees with ≥100 grants and ≥20 prior-period grants, that multiple ranks #2,744. See the growth leaderboard.

Vivotek

167
Canva Pty

166
Concept Laser

166
Frito-lay North A…

166
Itrec B V

166
Massachusetts Eye…

166
Mcmaster Universi…

166
RF Micro Devices

166
Hypertherm ◀

166

What this shows Hypertherm holds 166 patents at rank #2,359, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Hypertherm

By rank, the assignees closest to #2,359 in granted patent volume.

Leaders in B23K (Soldering OR Unsoldering)

Other assignees with the most granted patents in Hypertherm's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Hypertherm, neither rank-band nor same-CPC leaders (those blocks stay above). In B23K (Soldering OR Unsoldering), Hypertherm ranks #12 of 1,623 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (55 here).

National University Corporation Kyoto Institute OF Technology 55 NIO USA, Inc. 55 Finisar Corporation 55 Stryker European Holdings, LLC 55

Similar claim depth

Nearest assignees by average claims per patent (21.0 here).

Muffin Incorporated 21.0 avg Brooks Automation GmbH 21.0 avg Amsted Rail Company, Inc. 21.0 avg Valtech Cardio Ltd. 21.0 avg

Hypertherm's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

55 Top 7% higher than 93% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Hypertherm, Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	10	6.0%
2016	15	9.0%
2017	17	10.2%
2018	17	10.2%
2019	16	9.6%
2020	37	22.3%
2021	14	8.4%
2022	9	5.4%
2023	13	7.8%
2024	10	6.0%
2025partial year	8	4.8%

Which technologies does Hypertherm, Inc. patent most?

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 118

H05H - Plasma Technique ; Production OF Accelerated Electrically-charged Particles OR OF NEUTRONS; Production OR Acceleration OF Neutral Molecular OR Atomic Beams 117

G05B - Control OR Regulating Systems IN GENERAL; Functional Elements OF Such SYSTEMS; Monitoring OR Testing Arrangements FOR Such Systems OR Elements 22

B26F - PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; Severing BY Means Other Than Cutting 21

B24C - Abrasive OR Related Blasting With Particulate Material 20

Y10T - Technical Subjects Covered BY Former US Classification 15

G06K - Graphical Data Reading ; Presentation OF DATA; Record CARRIERS; Handling Record Carriers 12

B26D - CUTTING; Details Common TO Machines FOR Perforating, Punching, Cutting-out, Stamping-out OR Severing 10

G05D - Systems FOR Controlling OR Regulating Non-electric Variables 7

B25J - MANIPULATORS; Chambers Provided With Manipulation Devices 6

F04B - Positive-displacement Machines FOR LIQUIDS; Pumps 6

G06Q - Information AND Communication Technology [ICT] Specially Adapted FOR Administrative, Commercial, Financial, Managerial OR Supervisory PURPOSES; Systems OR Methods Specially Adapted FOR Administrative, Commercial, Financial, Managerial OR Supervisory Purposes, NOT Otherwise Provided FOR 3

F16L - PIPES; Joints OR Fittings FOR PIPES; Supports FOR Pipes, Cables OR Protective TUBING; Means FOR Thermal Insulation IN General 3

F16K - VALVES; TAPS; COCKS; ACTUATING-FLOATS; Devices FOR Venting OR Aerating 3

F16J - Pistons ; CYLINDERS; Sealings 3

Top 15 of 38 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Hypertherm, Inc.'s patent record in context - here's where to go next.

Hypertherm, Inc.'s lead technology class is B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam), 71.1% of its portfolio - see every assignee active in that class. Explore B23K
Ranked #2,359 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Hypertherm, Inc. against Vivotek Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 55.3/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.