Where does Ehwa Diamond Industrial Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Ehwa Diamond Industrial Co., Ltd. ranks #18,568 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Ehwa Diamond Industrial Co., Ltd. hold?

Ehwa Diamond Industrial Co., Ltd. holds 15 US utility patents granted between 2015 and 2023, spanning 15 technology areas.

What is Ehwa Diamond Industrial Co., Ltd.'s Innovation Score?

Ehwa Diamond Industrial Co., Ltd. has an Innovation Score of 29.7 out of 100 (32nd percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Ehwa Diamond Industrial Co., Ltd.'s patent grant rate increasing or decreasing?

Ehwa Diamond Industrial Co., Ltd.'s recent grant velocity is -50% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Ehwa Diamond Industrial Co., Ltd.'s patents?

Ehwa Diamond Industrial Co., Ltd.'s patents average 8.9 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Ehwa Diamond Industrial Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Ehwa Diamond Industrial Co., Ltd.

Q: What technology areas does Ehwa Diamond Industrial Co., Ltd. focus on?

Ehwa Diamond Industrial Co., Ltd.'s top technology area is B24B (Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents) with 5 patents, ranking #104 of 468 assignees active in that subclass. Grants appear in 15 CPC subclasses total.

USPTO PatentsView assignee record - 15 granted patents across 15 technology areas, recorded in grant years 2015–2023. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B24B (Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Ehwa ranks #18,568 of 49,997 tracked US assignees by granted-patent volume, with 15 patents across 15 technology areas.

#18,568
of 49,997 US assignees by volume: 32nd percentile
by Innovation Score (29.7/100): 8.9
avg claims per patent: -50%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R18568 · Foreign Corporation #18,568 · 15 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-PAR · TYPE-FRNCORP · VEL-DROP · BOOK-FULL

GRANTS-MICRO 15 grants
MID-PACK #18,568/49,997
PHOTO-FINISH ECR Software
CPC-FOCUS B24B · 15 areas
INNOV-THIN 29.7/100
CLAIMS-PAR 8.9 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DROP -50% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: ECR Software Corporation (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Ehwa’s 29.7 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 9.6 pts (32%) Velocity 1.1 pts (4%) Breadth 13.7 pts (46%) Claim depth 5.3 pts (18%)

Qualcomm Incorporated · highest

85
Ehwa Diamond… · this assignee

30
3D Lighting… · lowest

7

What this shows Ehwa's Innovation Score is 29.7/100 (32nd percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Ehwa?

Each dot is one of Ehwa’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Ehwa’s own 8.9 claims/patent is at or below the 13.6 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Ehwa vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Ehwa's grants concentrate

Ehwa Diamond Industrial Co., Ltd. is a focused PatentsView assignee: 15 CPC subclasses with 33.3% of grants classified under B24B (Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents). Peak complete grant year is 2015 (3 grants) versus a trough of 1 in 2018. By volume, Ehwa sits between ECR Software Corporation and Embodyvr, Inc..

Ehwa's three-year grant acceleration

Ehwa Diamond Industrial Co., Ltd. shows 1 grants in 2022–2024 against only 6 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

ECR Software

15
Edge Technology

15
Edgecraft

15
Efinix

15
Eitan Medical

15
Eltek AS

15
Emak S P A

15
Embodyvr

15
Ehwa Diamond Indu… ◀

15

What this shows Ehwa holds 15 patents at rank #18,562, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Ehwa

By rank, the assignees closest to #18,562 in granted patent volume.

Leaders in B24B (Machines)

Other assignees with the most granted patents in Ehwa's primary technology class.

Ehwa's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

30 32nd percentile higher than 32% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2023

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Ehwa Diamond Industrial Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	3	20.0%
2016	2	13.3%
2017	2	13.3%
2018	1	6.7%
2019	2	13.3%
2020	3	20.0%
2021	1	6.7%
2023	1	6.7%

Which technologies does Ehwa Diamond Industrial Co., Ltd. patent most?

B24B - Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents 5

B24D - Tools FOR Grinding, Buffing OR Sharpening 4

E21B - Earth OR Rock DRILLING; Obtaining OIL, GAS, Water, Soluble OR Meltable Materials OR A Slurry OF Minerals From Wells 4

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 3

B28D - Working Stone OR Stone-like Materials 3

C21D - Modifying THE Physical Structure OF Ferrous METALS; General Devices FOR Heat Treatment OF Ferrous OR Non-ferrous Metals OR ALLOYS; Making Metal Malleable, e.g. BY Decarburisation OR Tempering 2

C22C - Alloys 2

B23P - Metal-working NOT Otherwise Provided FOR; Combined OPERATIONS; Universal Machine Tools 2

B23D - PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; Like Operations FOR Working Metal BY Removing Material, NOT Otherwise Provided FOR 2

Y10T - Technical Subjects Covered BY Former US Classification 2

H01L - Semiconductor Devices NOT Covered BY Class H10 1

B22F - Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder 1

C03B - Manufacture, Shaping, OR Supplementary Processes 1

B26D - CUTTING; Details Common TO Machines FOR Perforating, Punching, Cutting-out, Stamping-out OR Severing 1

C25D - Processes FOR THE Electrolytic OR Electrophoretic Production OF COATINGS; ELECTROFORMING; Apparatus Therefor 1

Top 15 of 15 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Ehwa Diamond Industrial Co., Ltd.'s patent record in context - here's where to go next.

Ehwa Diamond Industrial Co., Ltd.'s lead technology class is B24B (Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents), 33.3% of its portfolio - see every assignee active in that class. Explore B24B
Ranked #18,568 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Ehwa Diamond Industrial Co., Ltd. against ECR Software Corporation, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 29.7/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.