Where does CIG Photonics Japan Limited rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), CIG Photonics Japan Limited ranks #15,903 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does CIG Photonics Japan Limited hold?

CIG Photonics Japan Limited holds 18 US utility patents granted between 2021 and 2025, spanning 13 technology areas.

What is CIG Photonics Japan Limited's Innovation Score?

CIG Photonics Japan Limited has an Innovation Score of 48.8 out of 100 (top 16% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is CIG Photonics Japan Limited's patent grant rate increasing or decreasing?

Insufficient historical data is available to calculate a velocity trend for CIG Photonics Japan Limited.

What does claim depth mean for CIG Photonics Japan Limited's patents?

CIG Photonics Japan Limited's patents average 12.6 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the CIG Photonics Japan Limited patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

CIG Photonics Japan Limited

Q: What technology areas does CIG Photonics Japan Limited focus on?

CIG Photonics Japan Limited's top technology area is H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components) with 11 patents, ranking #549 of 3,545 assignees active in that subclass. Grants appear in 13 CPC subclasses total.

USPTO PatentsView assignee record - 18 granted patents across 13 technology areas, recorded in grant years 2021–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, CIG ranks #15,903 of 49,997 tracked US assignees by granted-patent volume, with 18 patents across 13 technology areas.

#15,903
of 49,997 US assignees by volume: Top 16%
by Innovation Score (48.8/100): 12.6
avg claims per patent

USPTO PatentsView assignee plate

Corpus R15903 · Foreign Corporation #15,903 · 18 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-RICH · TYPE-FRNCORP · SPAN-YRS · BOOK-RICH

GRANTS-MICRO 18 grants
MID-PACK #15,903/49,997
PHOTO-FINISH Centre DE Recherche…
CPC-FOCUS H05K · 13 areas
INNOV-PAR 48.8/100
CLAIMS-RICH 12.6 claims/avg
TYPE-FRNCORP Foreign Corp
SPAN-YRS 2021–2025 · 5y
BOOK-RICH 9/10 fields

Nearest grant-volume peer: Centre DE Recherche Industrielle DU Quebec (CRIQ) (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How CIG’s 48.8 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 10.2 pts (21%) Velocity 18.3 pts (38%) Breadth 12.7 pts (26%) Claim depth 7.5 pts (15%)

Qualcomm Incorporated · highest

85
CIG Photonics Japan · this assignee

49
3D Lighting… · lowest

7

What this shows CIG's Innovation Score is 48.8/100 (top 16% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for CIG?

Each dot is one of CIG’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). CIG’s own 12.6 claims/patent is at or below the 14.6 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

CIG vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where CIG's grants concentrate

CIG Photonics Japan Limited is a focused PatentsView assignee: 13 CPC subclasses with 61.1% of grants classified under H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components). Peak complete grant year is 2022 (6 grants) versus a trough of 1 in 2024. By volume, CIG sits between Centre DE Recherche Industrielle DU Quebec (CRIQ) and Clermon ET Associes.

CIG's three-year grant acceleration

CIG Photonics Japan Limited shows 11 grants in 2022–2024 against only 4 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Centre DE Recherc…

18
Chirp Microsystems

18
Chryso

18
Chung HUA Univers…

18
Circor Pumps Nort…

18
CJD

18
Cleaveland/Price

18
Clermon ET Associ…

18
CIG Photonics Jap… ◀

18

What this shows CIG holds 18 patents at rank #15,889, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near CIG

By rank, the assignees closest to #15,889 in granted patent volume.

Leaders in H05K (Printed Circuits)

Other assignees with the most granted patents in CIG's primary technology class.

CIG's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

49 Top 16% higher than 84% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2021–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2021–2019 baseline. Full figures in the table below.

View data table

CIG Photonics Japan Limited patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2021	4	22.2%
2022	6	33.3%
2023	4	22.2%
2024	1	5.6%
2025partial year	3	16.7%

Which technologies does CIG Photonics Japan Limited patent most?

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 11

H01S - Devices Using THE Process OF Light Amplification BY Stimulated Emission OF Radiation [LASER] TO Amplify OR Generate LIGHT; Devices Using Stimulated Emission OF Electromagnetic Radiation IN Wave Ranges Other Than Optical 10

G02B - Optical Elements, Systems OR Apparatus 6

H04B - Transmission 5

H01L - Semiconductor Devices NOT Covered BY Class H10 4

H01P - WAVEGUIDES; Resonators, Lines, OR Other Devices OF THE Waveguide Type 2

H10F - Inorganic Semiconductor Devices Sensitive TO Infrared Radiation, Light, Electromagnetic Radiation OF Shorter Wavelength OR Corpuscular Radiation 2

H10N - Electric Solid-state Devices NOT Otherwise Provided FOR 1

G02F - Optical Devices OR Arrangements FOR THE Control OF Light BY Modification OF THE Optical Properties OF THE Media OF THE Elements Involved THEREIN; Non-linear OPTICS; Frequency-changing OF LIGHT; Optical Logic ELEMENTS; Optical ANALOGUE/DIGITAL Converters 1

H10H - Inorganic Light-emitting Semiconductor Devices Having Potential Barriers 1

H01R - Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors 1

H04Q - Selecting 1

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 1

Top 13 of 13 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

CIG Photonics Japan Limited's patent record in context - here's where to go next.

CIG Photonics Japan Limited's lead technology class is H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components), 61.1% of its portfolio - see every assignee active in that class. Explore H05K
Ranked #15,903 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare CIG Photonics Japan Limited against Centre DE Recherche Industrielle DU Quebec (CRIQ), an assignee filing at a similar volume. Compare portfolios
Innovation Score of 48.8/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.