Where does Bondtech Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Bondtech Co., Ltd. ranks #18,449 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Bondtech Co., Ltd. hold?

Bondtech Co., Ltd. holds 15 US utility patents granted between 2015 and 2025, spanning 12 technology areas.

What is Bondtech Co., Ltd.'s Innovation Score?

Bondtech Co., Ltd. has an Innovation Score of 42.9 out of 100 (top 29% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Bondtech Co., Ltd. focus on?

Bondtech Co., Ltd.'s top technology area is H01L (Semiconductor Devices NOT Covered BY Class H10) with 15 patents, ranking #733 of 3,373 assignees active in that subclass. Grants appear in 12 CPC subclasses total.

Is Bondtech Co., Ltd.'s patent grant rate increasing or decreasing?

Bondtech Co., Ltd.'s recent grant velocity is -33% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Bondtech Co., Ltd.'s patents?

Bondtech Co., Ltd.'s patents average 18.5 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Bondtech Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Bondtech Co., Ltd.

USPTO PatentsView assignee record - 15 granted patents across 12 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01L (Semiconductor Devices NOT Covered BY Class H10).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Bondtech ranks #18,449 of 49,997 tracked US assignees by granted-patent volume, with 15 patents across 12 technology areas.

#18,449
of 49,997 US assignees by volume: Top 29%
by Innovation Score (42.9/100): 18.5
avg claims per patent: -33%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R18449 · Foreign Corporation #18,449 · 15 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-RICH · TYPE-FRNCORP · VEL-DOWN · BOOK-FULL

GRANTS-MICRO 15 grants
MID-PACK #18,449/49,997
PHOTO-FINISH Blatchford Products
CPC-FOCUS H01L · 12 areas
INNOV-PAR 42.9/100
CLAIMS-RICH 18.5 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DOWN -33% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Blatchford Products Limited (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Bondtech’s 42.9 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 9.6 pts (22%) Velocity 10.0 pts (23%) Breadth 12.2 pts (28%) Claim depth 11.1 pts (26%)

Qualcomm Incorporated · highest

85
Bondtech · this assignee

43
3D Lighting… · lowest

7

What this shows Bondtech's Innovation Score is 42.9/100 (top 29% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Bondtech?

Each dot is one of Bondtech’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Bondtech’s own 18.5 claims/patent is ABOVE the 14.2 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Bondtech vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Bondtech's grants concentrate

Bondtech Co., Ltd. is a focused PatentsView assignee: 12 CPC subclasses with 100% of grants classified under H01L (Semiconductor Devices NOT Covered BY Class H10). Peak complete grant year is 2016 (2 grants) versus a trough of 1 in 2015. By volume, Bondtech sits between Blatchford Products Limited and Brainsway Ltd..

Bondtech's three-year grant acceleration

Bondtech Co., Ltd. shows 3 grants in 2022–2024 against only 2 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Blatchford Produc…

15
Blue Vision Labs…

15
Blue World Holdin…

15
Bluewater Energy…

15
Bonumose

15
Bormioli Rocco S…

15
Botanic Experienc…

15
Brainsway

15
Bondtech ◀

15

What this shows Bondtech holds 15 patents at rank #18,435, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Bondtech

By rank, the assignees closest to #18,435 in granted patent volume.

Leaders in H01L (Semiconductor Devices NOT Covered BY Class H10)

Other assignees with the most granted patents in Bondtech's primary technology class.

Bondtech's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

43 Top 29% higher than 71% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Bondtech Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	1	6.7%
2016	2	13.3%
2017	1	6.7%
2018	1	6.7%
2019	1	6.7%
2020	1	6.7%
2023	2	13.3%
2024	1	6.7%
2025partial year	5	33.3%

Which technologies does Bondtech Co., Ltd. patent most?

H01L - Semiconductor Devices NOT Covered BY Class H10 15

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 6

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 5

H01J - Electric Discharge Tubes OR Discharge Lamps 4

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 2

G01B - Measuring Length, Thickness OR Similar Linear DIMENSIONS; Measuring ANGLES; Measuring AREAS; Measuring Irregularities OF Surfaces OR Contours 2

H05H - Plasma Technique ; Production OF Accelerated Electrically-charged Particles OR OF NEUTRONS; Production OR Acceleration OF Neutral Molecular OR Atomic Beams 2

B29L - Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles 2

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 2

B81C - Processes OR Apparatus Specially Adapted FOR THE Manufacture OR Treatment OF Microstructural Devices OR Systems 2

H10D - Inorganic Electric Semiconductor Devices 1

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 1

Top 12 of 12 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Bondtech Co., Ltd.'s patent record in context - here's where to go next.

Bondtech Co., Ltd.'s lead technology class is H01L (Semiconductor Devices NOT Covered BY Class H10), 100% of its portfolio - see every assignee active in that class. Explore H01L
Ranked #18,449 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Bondtech Co., Ltd. against Blatchford Products Limited, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 42.9/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.