Where does Toho Engineering Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Toho Engineering Co., Ltd. ranks #43,690 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Toho Engineering Co., Ltd. hold?

Toho Engineering Co., Ltd. holds 6 US utility patents granted between 2015 and 2020, spanning 4 technology areas.

What is Toho Engineering Co., Ltd.'s Innovation Score?

Toho Engineering Co., Ltd. has an Innovation Score of 22.5 out of 100 (10th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Toho Engineering Co., Ltd.'s patent grant rate increasing or decreasing?

Toho Engineering Co., Ltd.'s recent grant velocity is -50% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Toho Engineering Co., Ltd.'s patents?

Toho Engineering Co., Ltd.'s patents average 14.5 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Toho Engineering Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Toho Engineering Co., Ltd.

Q: What technology areas does Toho Engineering Co., Ltd. focus on?

Toho Engineering Co., Ltd.'s top technology area is H01L (Semiconductor Devices NOT Covered BY Class H10) with 5 patents. Grants appear in 4 CPC subclasses total.

USPTO PatentsView assignee record - 6 granted patents across 4 technology areas, recorded in grant years 2015–2020. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01L (Semiconductor Devices NOT Covered BY Class H10).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Toho ranks #43,690 of 49,997 tracked US assignees by granted-patent volume, with 6 patents across 4 technology areas.

#43,690
of 49,997 US assignees by volume: 10th percentile
by Innovation Score (22.5/100): 14.5
avg claims per patent: -50%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R43690 · Foreign Corporation #43,690 · 6 grants

GRANTS-MICRO · LOWER-Q · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-RICH · TYPE-FRNCORP · VEL-DROP · BOOK-FULL

GRANTS-MICRO 6 grants
LOWER-Q #43,690/49,997
PHOTO-FINISH TMA Capital…
CPC-NARROW H01L · 4 areas
INNOV-THIN 22.5/100
CLAIMS-RICH 14.5 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DROP -50% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: TMA Capital Australia PTY Ltd (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Toho Engineering · this assignee

22
3D Lighting… · lowest

7

What this shows Toho's Innovation Score is 22.5/100 (10th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Toho's grants concentrate

Toho Engineering Co., Ltd. is a focused PatentsView assignee: 4 CPC subclasses with 83.3% of grants classified under H01L (Semiconductor Devices NOT Covered BY Class H10). Peak complete grant year is 2015 (2 grants) versus a trough of 1 in 2018. By volume, Toho sits between TMA Capital Australia PTY Ltd and Tonix Pharmaceuticals Holding Corp.

TMA Capital Austr…

6
TN Americas

6
TOA Industries

6
Tobesoft

6
Tokai Rubber Indu…

6
Tokaikogyo Mishin

6
Tone

6
Tonix Pharmaceuti…

6
Toho Engineering ◀

6

What this shows Toho holds 6 patents at rank #43,560, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Toho

By rank, the assignees closest to #43,560 in granted patent volume.

Leaders in H01L (Semiconductor Devices NOT Covered BY Class H10)

Other assignees with the most granted patents in Toho's primary technology class.

Toho's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

22 10th percentile higher than 10% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2020

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Toho Engineering Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	2	33.3%
2018	1	16.7%
2019	1	16.7%
2020	2	33.3%

Which technologies does Toho Engineering Co., Ltd. patent most?

H01L - Semiconductor Devices NOT Covered BY Class H10 5

H10D - Inorganic Electric Semiconductor Devices 3

B24B - Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents 3

B01J - Chemical OR Physical Processes, e.g. Catalysis OR Colloid CHEMISTRY; Their Relevant Apparatus 2

Top 4 of 4 technology areas

Where it ranks

Overall rank by patents

#43,690

of 49,997 tracked assignees

Innovation Score

22.5 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Toho Engineering Co., Ltd.'s patent record in context - here's where to go next.

Toho Engineering Co., Ltd.'s lead technology class is H01L (Semiconductor Devices NOT Covered BY Class H10), 83.3% of its portfolio - see every assignee active in that class. Explore H01L
Ranked #43,690 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Toho Engineering Co., Ltd. against TMA Capital Australia PTY Ltd, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 22.5/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.