Where does Technische Universität Wien rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Technische Universität Wien ranks #3,610 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Technische Universität Wien hold?

Technische Universität Wien holds 102 US utility patents granted between 2015 and 2025, spanning 121 technology areas.

What is Technische Universität Wien's Innovation Score?

Technische Universität Wien has an Innovation Score of 57.9 out of 100 (top 5% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Technische Universität Wien's patent grant rate increasing or decreasing?

Technische Universität Wien's recent grant velocity is +2% compared to the prior five-year period (grant years, not application filing dates). The company is maintaining or growing its granted-patent output.

What does claim depth mean for Technische Universität Wien's patents?

Technische Universität Wien's patents average 17.4 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Technische Universität Wien patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Technische Universität Wien

Q: What technology areas does Technische Universität Wien focus on?

Technische Universität Wien's top technology area is B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective Laser Sintering) with 13 patents, ranking #136 of 1,250 assignees active in that subclass. Grants appear in 121 CPC subclasses total.

USPTO PatentsView assignee record - 102 granted patents across 121 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective ).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Technische ranks #3,610 of 49,997 tracked US assignees by granted-patent volume, with 102 patents across 121 technology areas.

#3,610
of 49,997 US assignees by volume: Top 5%
by Innovation Score (57.9/100): 17.4
avg claims per patent: +2%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R3610 · Foreign Corporation #3,610 · 102 grants

GRANTS-MID · TOP-DECILE · PHOTO-FINISH · CPC-WIDE · INNOV-PAR · CLAIMS-RICH · TYPE-FRNCORP · VEL-FLAT · BOOK-FULL

GRANTS-MID 102 grants
TOP-DECILE #3,610/49,997
PHOTO-FINISH SHL Group AB
CPC-WIDE B33Y · 121 areas
INNOV-PAR 57.9/100
CLAIMS-RICH 17.4 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-FLAT +2% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: SHL Group AB (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Technische’s 57.9 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 16.0 pts (28%) Velocity 6.4 pts (11%) Breadth 25.0 pts (43%) Claim depth 10.4 pts (18%)

Qualcomm Incorporated · highest

85
IPG Photonics · near

58
Materion · near

58
Sensata · near

58
Technische Universit… · this assignee

58
Vertex Pharmaceutica… · near

58
3D Lighting… · lowest

7

What this shows Technische's Innovation Score is 57.9/100 (top 5% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Technische?

Each dot is one of Technische’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Technische’s own 17.4 claims/patent is ABOVE the 15.3 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Technische vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

How Technische's grant cadence moved

Between 2020–2024, Technische Universität Wien received 48 grants versus 47 in 2015–2019 (+2% equal-window velocity, above median growth). Across complete PatentsView years, output peaked in 2017 at 13 grants and bottomed in 2019 at 5. Lead class B33Y accounts for 12.7% of the portfolio across 121 subclasses. Volume neighbours: SHL Group AB (#3,607) and Wabash National, L.P. (#3,615).

Technische's three-year grant acceleration

From 2019–2021 to 2022–2024, Technische Universität Wien moved from 27 to 26 grants (0.96x the prior three-year total, a multiple, not a CAGR). Among 3,296 tracked assignees with ≥100 grants and ≥20 prior-period grants, that multiple ranks #1,284. See the growth leaderboard.

SHL Group AB

102
Sumitomo Dainippo…

102
Super Micro Compu…

102
Tonal Systems

102
VMI Holland B V

102
Veolia Water Solu…

102
Woojin Plastic

102
Wabash National

102
Technische Univer… ◀

102

What this shows Technische holds 102 patents at rank #3,611, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Technische

By rank, the assignees closest to #3,611 in granted patent volume.

Leaders in B33Y (Additive Manufacturing)

Other assignees with the most granted patents in Technische's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Technische, neither rank-band nor same-CPC leaders (those blocks stay above). In B33Y (Additive Manufacturing), Technische ranks #136 of 1,250 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (58 here).

IPG Photonics Corporation 58 Sensata Technologies, Inc. 58 Materion Corporation 58 Vertex Pharmaceuticals Incorporated 58

Similar claim depth

Nearest assignees by average claims per patent (17.4 here).

Walbro LLC 17.4 avg Teleflex Life Sciences LLC 17.4 avg Shanghai Bilibili Technology Co., Ltd. 17.4 avg Electronic Theatre Controls, Inc. 17.4 avg

Technische's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

58 Top 5% higher than 95% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Technische Universität Wien patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	11	10.8%
2016	12	11.8%
2017	13	12.7%
2018	6	5.9%
2019	5	4.9%
2020	13	12.7%
2021	9	8.8%
2022	9	8.8%
2023	8	7.8%
2024	9	8.8%
2025partial year	7	6.9%

Which technologies does Technische Universität Wien patent most?

B33Y - Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective Laser Sintering 13

G01N - Investigating OR Analysing Materials BY Determining Their Chemical OR Physical Properties 13

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 11

C08G - Macromolecular Compounds Obtained Otherwise Than BY Reactions Only Involving Unsaturated Carbon-to-carbon Bonds 10

C12N - Microorganisms OR ENZYMES; Compositions THEREOF; Propagating, Preserving, OR Maintaining MICROORGANISMS; Mutation OR Genetic ENGINEERING; Culture Media 9

A61K - Preparations FOR Medical, Dental OR Toiletry Purposes 9

C08L - Compositions OF Macromolecular Compounds 8

Y02E - Reduction OF Greenhouse GAS [GHG] Emissions, Related TO Energy Generation, Transmission OR Distribution 8

C07C - Acyclic OR Carbocyclic Compounds 6

C08F - Macromolecular Compounds Obtained BY Reactions Only Involving Carbon-to-carbon Unsaturated Bonds 6

C07D - Heterocyclic Compounds 6

G06F - Electric Digital Data Processing 6

A61L - Methods OR Apparatus FOR Sterilising Materials OR Objects IN GENERAL; Disinfection, Sterilisation OR Deodorisation OF AIR; Chemical Aspects OF Bandages, Dressings, Absorbent Pads OR Surgical ARTICLES; Materials FOR Bandages, Dressings, Absorbent Pads OR Surgical Articles 5

A61P - Specific Therapeutic Activity OF Chemical Compounds OR Medicinal Preparations 4

B23Q - Details, Components, OR Accessories FOR Machine Tools, e.g. Arrangements FOR Copying OR Controlling ; Machine Tools IN General Characterised BY THE Construction OF Particular Details OR COMPONENTS; Combinations OR Associations OF Metal-working Machines, NOT Directed TO A Particular Result 4

Top 15 of 121 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Technische Universität Wien's patent record in context - here's where to go next.

Technische Universität Wien's lead technology class is B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective ), 12.7% of its portfolio - see every assignee active in that class. Explore B33Y
Ranked #3,610 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Technische Universität Wien against SHL Group AB, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 57.9/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.