TE Connectivity India Private Limited
USPTO PatentsView assignee record - 38 granted patents across 18 technology areas, recorded in grant years 2016–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors).
The verdict
According to USPTO PatentsView, TE ranks #8,486 of 49,997 tracked US assignees by granted-patent volume, with 38 patents across 18 technology areas.
- #8,486
- of 49,997 US assignees by volume
- Top 19%
- by Innovation Score (47.4/100)
- 17.5
- avg claims per patent
- +160%
- grant velocity, last 5 yrs
USPTO PatentsView assignee plate
Corpus R8486 · Foreign Corporation #8,486 · 38 grants
GRANTS-SMALL · UPPER-Q · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-RICH · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL
- GRANTS-SMALL 38 grants
- UPPER-Q #8,486/49,997
- PHOTO-FINISH Silicon Integrated…
- CPC-FOCUS H01R · 18 areas
- INNOV-PAR 47.4/100
- CLAIMS-RICH 17.5 claims/avg
- TYPE-FRNCORP Foreign Corp
- VEL-SURGE +160% vel
- BOOK-FULL 10/10 fields
Nearest grant-volume peer: Silicon Integrated Systems Corp. (±0 grants)
Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.
How TE’s 47.4 Innovation Score adds up
The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.
Innovation-score neighbourhood around TE
Lowest and highest poles plus nearest Innovation Score peers, not a full corpus board reprint.
- Qualcomm Incorporated · highest
Qualcomm Incorporated · highest
85 score
- Cleveland-Cliffs… · near
Cleveland-Cliffs… · near
47 score
- ContiTech USA · near
ContiTech USA · near
47 score
- Shya Hsin Packaging… · near
Shya Hsin Packaging… · near
47 score
- TE Connectivity… · this assignee
TE Connectivity… · this assignee
47 score
- The United States… · near
The United States… · near
47 score
- 3D Lighting… · lowest 7
3D Lighting… · lowest
7 score
What this shows TE's Innovation Score is 47.4/100 (top 19% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.
Does more volume mean deeper claims for TE?
Each dot is one of TE’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). TE’s own 17.5 claims/patent is ABOVE the 15.3 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.
Where TE's grants concentrate
TE Connectivity India Private Limited is a focused PatentsView assignee: 18 CPC subclasses with 78.9% of grants classified under H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors). Peak complete grant year is 2023 (7 grants) versus a trough of 1 in 2016. By volume, TE sits between Silicon Integrated Systems Corp. and Tmrw Foundation IP S.ÀR.L..
TE's three-year grant acceleration
TE Connectivity India Private Limited shows 18 grants in 2022–2024 against only 13 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.
Who files at TE's volume?
Granted US patents 2015–2025 versus its nearest-ranked assignees by volume, this company marked ◀
- Silicon Integrate…
Silicon Integrated Systems Corp.
38 patents
- Siluria
Siluria Technologies, Inc.
38 patents
- Sisvel Technology…
Sisvel Technology S.R.L.
38 patents
- Speculative Produ…
Speculative Product Design, LLC
38 patents
- Teijin Aramid B V
Teijin Aramid B.V.
38 patents
- Temasek Life Sice…
Temasek Life Sicences Laboratory Limited
38 patents
- Tmaxsoft
Tmaxsoft Co., Ltd.
38 patents
- Tmrw Foundation I…
Tmrw Foundation IP S.ÀR.L.
38 patents
- TE Connectivity I… ◀
TE Connectivity India Private Limited
38 patents
What this shows TE holds 38 patents at rank #8,485, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.
Companies ranked near TE
By rank, the assignees closest to #8,485 in granted patent volume.
- Silicon Integrated Systems Corp. #8,481 · 38 patents
- Siluria Technologies, Inc. #8,482 · 38 patents
- Sisvel Technology S.R.L. #8,483 · 38 patents
- Speculative Product Design, LLC #8,484 · 38 patents
- Teijin Aramid B.V. #8,486 · 38 patents
- Temasek Life Sicences Laboratory Limited #8,487 · 38 patents
- Tmaxsoft Co., Ltd. #8,488 · 38 patents
- Tmrw Foundation IP S.ÀR.L. #8,489 · 38 patents
Leaders in H01R (Electrically-conductive Connections)
Other assignees with the most granted patents in TE's primary technology class.
- Sumitomo Wiring Systems, Ltd. 1,543 in class
- Yazaki Corporation 1,482 in class
- Foxconn Interconnect Technology Limited 847 in class
- Sumitomo Electric Industries, Ltd. 729 in class
- Autonetworks Technologies, Ltd. 694 in class
- Molex, LLC 599 in class
- Japan Aviation Electronics Industry, Limited 523 in class
- TE Connectivity Co. Ltd. 459 in class
Assignees with similar portfolio profiles
Two PlainPatent-derived peer sets for TE, neither rank-band nor same-CPC leaders (those blocks stay above). In H01R (Electrically-conductive Connections), TE ranks #114 of 2,265 assignees by patent count in that subclass.
Similar innovation score
Nearest assignees by Innovation Score (47 here).
TE's Innovation Score vs. every tracked assignee
Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)
47 Top 19% higher than 81% of 49,997 US assignees
Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.
Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025
Grants by year
Teal-shaded recent years (2020–present) versus the 2016–2019 baseline. Full figures in the table below.
View data table
| Year | Patents Granted | Share of Period |
|---|---|---|
| 2016 | 1 | 2.6% |
| 2017 | 2 | 5.3% |
| 2018 | 2 | 5.3% |
| 2019 | 5 | 13.2% |
| 2020 | 4 | 10.5% |
| 2021 | 4 | 10.5% |
| 2022 | 4 | 10.5% |
| 2023 | 7 | 18.4% |
| 2024 | 7 | 18.4% |
| 2025partial year | 2 | 5.3% |
Which technologies does TE Connectivity India Private Limited patent most?
Top 15 of 18 technology areas
Data Source
USPTO PatentsView, US granted patents 2015–2025
What to do with this data
TE Connectivity India Private Limited's patent record in context - here's where to go next.
- TE Connectivity India Private Limited's lead technology class is H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors), 78.9% of its portfolio - see every assignee active in that class. Explore H01R
- Ranked #8,486 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
- Compare TE Connectivity India Private Limited against Silicon Integrated Systems Corp., an assignee filing at a similar volume. Compare portfolios
- Innovation Score of 47.4/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated
Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.
Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.