Where does Teijin Aramid B.V. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Teijin Aramid B.V. ranks #8,487 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Teijin Aramid B.V. hold?

Teijin Aramid B.V. holds 38 US utility patents granted between 2015 and 2025, spanning 40 technology areas.

What is Teijin Aramid B.V.'s Innovation Score?

Teijin Aramid B.V. has an Innovation Score of 47.8 out of 100 (top 18% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Teijin Aramid B.V.'s patent grant rate increasing or decreasing?

Teijin Aramid B.V.'s recent grant velocity is -15% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Teijin Aramid B.V.'s patents?

Teijin Aramid B.V.'s patents average 15.3 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Teijin Aramid B.V. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Teijin Aramid B.V.

Q: What technology areas does Teijin Aramid B.V. focus on?

Teijin Aramid B.V.'s top technology area is D21H (Pulp COMPOSITIONS; Preparation Thereof NOT Covered BY Subclasses D21c OR D21D; Impregnating OR Coating OF PAPER; Treatment OF Finished Paper NOT Covered BY Class B31 OR Subclass D21G; Paper NOT Otherwise Provided FOR) with 13 patents. Grants appear in 40 CPC subclasses total.

USPTO PatentsView assignee record - 38 granted patents across 40 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: D21H (Pulp COMPOSITIONS; Preparation Thereof NOT Covered BY Subclasses D21c OR D21D; Impregnating OR Coating OF PAPER; Treatment OF Finished Paper NOT Covered BY Class B31 OR Subclass D21G; Paper NOT Otherw).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Teijin ranks #8,487 of 49,997 tracked US assignees by granted-patent volume, with 38 patents across 40 technology areas.

#8,487
of 49,997 US assignees by volume: Top 18%
by Innovation Score (47.8/100): 15.3
avg claims per patent: -15%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R8487 · Foreign Corporation #8,487 · 38 grants

GRANTS-SMALL · UPPER-Q · PHOTO-FINISH · CPC-WIDE · INNOV-PAR · CLAIMS-RICH · TYPE-FRNCORP · VEL-DOWN · BOOK-FULL

GRANTS-SMALL 38 grants
UPPER-Q #8,487/49,997
PHOTO-FINISH Siluria
CPC-WIDE D21H · 40 areas
INNOV-PAR 47.8/100
CLAIMS-RICH 15.3 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DOWN -15% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Siluria Technologies, Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Alector · near

48
Arcelormittal… · near

48
Electric Mirror · near

48
HB Innovations · near

48
Teijin Aramid B V · this assignee

48
3D Lighting… · lowest

7

What this shows Teijin's Innovation Score is 47.8/100 (top 18% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Teijin's grants concentrate

Teijin Aramid B.V. is a focused PatentsView assignee: 40 CPC subclasses with 34.2% of grants classified under D21H (Pulp COMPOSITIONS; Preparation Thereof NOT Covered BY Subclasses D21c OR D21D; Impregnating OR Coating OF PAPER; Treatment OF Finished Paper NOT Covered BY Class B31 OR Subclass D21G; Paper NOT Otherw). Peak complete grant year is 2018 (7 grants) versus a trough of 1 in 2017. By volume, Teijin sits between Siluria Technologies, Inc. and Total SE.

Teijin's three-year grant acceleration

Teijin Aramid B.V. shows 7 grants in 2022–2024 against only 13 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Siluria

38
Sisvel Technology…

38
Speculative Produ…

38
TE Connectivity I…

38
Temasek Life Sice…

38
Tmaxsoft

38
Tmrw Foundation I…

38
Total SE

38
Teijin Aramid B V ◀

38

What this shows Teijin holds 38 patents at rank #8,486, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Teijin

By rank, the assignees closest to #8,486 in granted patent volume.

Leaders in D21H (Pulp Compositions)

Other assignees with the most granted patents in Teijin's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Teijin, neither rank-band nor same-CPC leaders (those blocks stay above).

Similar innovation score

Nearest assignees by Innovation Score (48 here).

Electric Mirror, LLC 48 Arcelormittal INVESTIGACIÓN Y Desarrollo, S.L. 48 HB Innovations, Inc. 48 Alector LLC 48

Teijin's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

48 Top 18% higher than 82% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Teijin Aramid B.V. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	6	15.8%
2016	3	7.9%
2017	1	2.6%
2018	7	18.4%
2019	3	7.9%
2020	4	10.5%
2021	6	15.8%
2022	2	5.3%
2023	4	10.5%
2024	1	2.6%
2025partial year	1	2.6%

Which technologies does Teijin Aramid B.V. patent most?

D21H - Pulp COMPOSITIONS; Preparation Thereof NOT Covered BY Subclasses D21c OR D21D; Impregnating OR Coating OF PAPER; Treatment OF Finished Paper NOT Covered BY Class B31 OR Subclass D21G; Paper NOT Otherwise Provided FOR 13

D01F - Chemical Features IN THE Manufacture OF Artificial Filaments, Threads, Fibres, Bristles OR RIBBONS; Apparatus Specially Adapted FOR THE Manufacture OF Carbon Filaments 9

F41H - ARMOUR; Armoured TURRETS; Armoured OR Armed VEHICLES; Means OF Attack OR Defence, e.g. Camouflage, IN General 8

D01D - Mechanical Methods OR Apparatus IN THE Manufacture OF Artificial Filaments, Threads, Fibres, Bristles OR Ribbons 7

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 6

Y10T - Technical Subjects Covered BY Former US Classification 6

D02G - Crimping OR Curling Fibres, Filaments, Threads, OR YARNS; Yarns OR Threads 5

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 5

D07B - Ropes OR Cables IN General 5

D04H - Making Textile Fabrics, e.g. From Fibres OR Filamentary Material ; Fabrics Made BY Such Processes OR Apparatus, e.g. Felts, Non-woven FABRICS; COTTON-WOOL; Wadding ; ; Non-woven Fabrics From Staple Fibres, Filaments OR Yarns, Bonded With AT Least ONE Web-like Material During Their Consolidation 4

D10B - Indexing Scheme Associated With Sublasses OF Section D, Relating TO Textiles 4

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 4

H01B - CABLES; CONDUCTORS; INSULATORS; Selection OF Materials FOR Their Conductive, Insulating OR Dielectric Properties 4

D06M - Treatment, NOT Provided FOR Elsewhere IN Class D06, OF Fibres, Threads, Yarns, Fabrics, Feathers OR Fibrous Goods Made From Such Materials 3

C08L - Compositions OF Macromolecular Compounds 3

Top 15 of 40 technology areas

Where it ranks

Overall rank by patents

#8,487

of 49,997 tracked assignees

Innovation Score

47.8 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Teijin Aramid B.V.'s patent record in context - here's where to go next.

Teijin Aramid B.V.'s lead technology class is D21H (Pulp COMPOSITIONS; Preparation Thereof NOT Covered BY Subclasses D21c OR D21D; Impregnating OR Coating OF PAPER; Treatment OF Finished Paper NOT Covered BY Class B31 OR Subclass D21G; Paper NOT Otherw), 34.2% of its portfolio - see every assignee active in that class. Explore D21H
Ranked #8,487 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Teijin Aramid B.V. against Siluria Technologies, Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 47.8/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.