Where does Nihon Superior Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Nihon Superior Co., Ltd. ranks #24,881 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Nihon Superior Co., Ltd. hold?

Nihon Superior Co., Ltd. holds 11 US utility patents granted between 2016 and 2025, spanning 8 technology areas.

What is Nihon Superior Co., Ltd.'s Innovation Score?

Nihon Superior Co., Ltd. has an Innovation Score of 29.3 out of 100 (30th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Nihon Superior Co., Ltd.'s patent grant rate increasing or decreasing?

Nihon Superior Co., Ltd.'s recent grant velocity is -57% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Nihon Superior Co., Ltd.'s patents?

Nihon Superior Co., Ltd.'s patents average 6.7 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Nihon Superior Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Nihon Superior Co., Ltd.

Q: What technology areas does Nihon Superior Co., Ltd. focus on?

Nihon Superior Co., Ltd.'s top technology area is B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam) with 10 patents, ranking #192 of 1,623 assignees active in that subclass. Grants appear in 8 CPC subclasses total.

USPTO PatentsView assignee record - 11 granted patents across 8 technology areas, recorded in grant years 2016–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Nihon ranks #24,881 of 49,997 tracked US assignees by granted-patent volume, with 11 patents across 8 technology areas.

#24,881
of 49,997 US assignees by volume: 30th percentile
by Innovation Score (29.3/100): 6.7
avg claims per patent: -57%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R24881 · Foreign Corporation #24,881 · 11 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-SPARSE · TYPE-FRNCORP · VEL-DROP · BOOK-FULL

GRANTS-MICRO 11 grants
MID-PACK #24,881/49,997
PHOTO-FINISH NEW Concepts…
CPC-NARROW B23K · 8 areas
INNOV-THIN 29.3/100
CLAIMS-SPARSE 6.7 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DROP -57% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: NEW Concepts Development Corporation (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Nihon’s 29.3 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 8.6 pts (29%) Velocity 6.7 pts (23%) Breadth 10.0 pts (34%) Claim depth 4.0 pts (14%)

Qualcomm Incorporated · highest

85
Nihon Superior · this assignee

29
3D Lighting… · lowest

7

What this shows Nihon's Innovation Score is 29.3/100 (30th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Nihon?

Each dot is one of Nihon’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Nihon’s own 6.7 claims/patent is at or below the 13.2 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Nihon vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Nihon's grants concentrate

Nihon Superior Co., Ltd. is a focused PatentsView assignee: 8 CPC subclasses with 90.9% of grants classified under B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam). Peak complete grant year is 2018 (3 grants) versus a trough of 1 in 2016. By volume, Nihon sits between NEW Concepts Development Corporation and Niles Werkzeugmaschinen GMBH.

Nihon's three-year grant acceleration

Nihon Superior Co., Ltd. shows 3 grants in 2022–2024 against only 3 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

NEW Concepts Deve…

11
Nextteq

11
Nexus Spine

11
Next-e Solutions

11
Nihon Video System

11
NII Northern Inte…

11
Nikon Research OF…

11
Niles Werkzeugmas…

11
Nihon Superior ◀

11

What this shows Nihon holds 11 patents at rank #24,851, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Nihon

By rank, the assignees closest to #24,851 in granted patent volume.

Leaders in B23K (Soldering OR Unsoldering)

Other assignees with the most granted patents in Nihon's primary technology class.

Nihon's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

29 30th percentile higher than 30% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2016–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2016–2019 baseline. Full figures in the table below.

View data table

Nihon Superior Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2016	1	9.1%
2018	3	27.3%
2019	3	27.3%
2023	1	9.1%
2024	2	18.2%
2025partial year	1	9.1%

Which technologies does Nihon Superior Co., Ltd. patent most?

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 10

C22C - Alloys 9

B22F - Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder 3

B82Y - Specific Uses OR Applications OF NANOSTRUCTURES; Measurement OR Analysis OF NANOSTRUCTURES; Manufacture OR Treatment OF Nanostructures 2

H01L - Semiconductor Devices NOT Covered BY Class H10 1

C09J - ADHESIVES; Non-mechanical Aspects OF Adhesive Processes IN GENERAL; Adhesive Processes NOT Provided FOR ELSEWHERE; USE OF Materials AS Adhesives 1

H01R - Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors 1

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 1

Top 8 of 8 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Nihon Superior Co., Ltd.'s patent record in context - here's where to go next.

Nihon Superior Co., Ltd.'s lead technology class is B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam), 90.9% of its portfolio - see every assignee active in that class. Explore B23K
Ranked #24,881 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Nihon Superior Co., Ltd. against NEW Concepts Development Corporation, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 29.3/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.