Where does Mitsui High-tec, Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Mitsui High-tec, Inc. ranks #3,454 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Mitsui High-tec, Inc. hold?

Mitsui High-tec, Inc. holds 107 US utility patents granted between 2015 and 2025, spanning 29 technology areas.

What is Mitsui High-tec, Inc.'s Innovation Score?

Mitsui High-tec, Inc. has an Innovation Score of 44.2 out of 100 (top 26% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Mitsui High-tec, Inc. focus on?

Mitsui High-tec, Inc.'s top technology area is H02K (Dynamo-electric Machines) with 92 patents, ranking #33 of 1,724 assignees active in that subclass. Grants appear in 29 CPC subclasses total.

Is Mitsui High-tec, Inc.'s patent grant rate increasing or decreasing?

Mitsui High-tec, Inc.'s recent grant velocity is -46% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Mitsui High-tec, Inc.'s patents?

Mitsui High-tec, Inc.'s patents average 9.3 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Mitsui High-tec, Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Mitsui High-tec, Inc.

USPTO PatentsView assignee record - 107 granted patents across 29 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H02K (Dynamo-electric Machines).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Mitsui ranks #3,454 of 49,997 tracked US assignees by granted-patent volume, with 107 patents across 29 technology areas.

#3,454
of 49,997 US assignees by volume: Top 26%
by Innovation Score (44.2/100): 9.3
avg claims per patent: -46%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R3454 · Foreign Corporation #3,454 · 107 grants

GRANTS-MID · TOP-DECILE · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-PAR · TYPE-FRNCORP · VEL-DROP · BOOK-FULL

GRANTS-MID 107 grants
TOP-DECILE #3,454/49,997
PHOTO-FINISH Diebold Nixdorf…
CPC-FOCUS H02K · 29 areas
INNOV-PAR 44.2/100
CLAIMS-PAR 9.3 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DROP -46% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Diebold Nixdorf Incorporated (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Mitsui’s 44.2 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 16.2 pts (37%) Velocity 3.4 pts (8%) Breadth 19.0 pts (43%) Claim depth 5.6 pts (13%)

Qualcomm Incorporated · highest

85
Agenus · near

44
BeiGene · near

44
Genethon · near

44
Mitsui High-tec · this assignee

44
Sequenom · near

44
3D Lighting… · lowest

7

What this shows Mitsui's Innovation Score is 44.2/100 (top 26% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Mitsui?

Each dot is one of Mitsui’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Mitsui’s own 9.3 claims/patent is at or below the 15.8 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Mitsui vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Mitsui's grants concentrate

Mitsui High-tec, Inc. is a focused PatentsView assignee: 29 CPC subclasses with 86% of grants classified under H02K (Dynamo-electric Machines). Peak complete grant year is 2019 (19 grants) versus a trough of 3 in 2024. By volume, Mitsui sits between Diebold Nixdorf Incorporated and Reckitt Benckiser Finish B.V..

Mitsui's three-year grant acceleration

From 2019–2021 to 2022–2024, Mitsui High-tec, Inc. moved from 37 to 19 grants (0.51x the prior three-year total, a multiple, not a CAGR). Among 3,296 tracked assignees with ≥100 grants and ≥20 prior-period grants, that multiple ranks #2,655. See the growth leaderboard.

Diebold Nixdorf I…

107
Elbit Systems

107
Galderma Research…

107
Jilin University

107
Nxgen Partners IP

107
Ohio University

107
Persimmon

107
Reckitt Benckiser…

107
Mitsui High-tec ◀

107

What this shows Mitsui holds 107 patents at rank #3,454, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Mitsui

By rank, the assignees closest to #3,454 in granted patent volume.

Leaders in H02K (Dynamo-electric Machines)

Other assignees with the most granted patents in Mitsui's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Mitsui, neither rank-band nor same-CPC leaders (those blocks stay above). In H02K (Dynamo-electric Machines), Mitsui ranks #33 of 1,724 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (44 here).

Sequenom, Inc. 44 Genethon 44 Agenus Inc. 44 BeiGene, Ltd. 44

Similar claim depth

Nearest assignees by average claims per patent (9.3 here).

Sinfonia Technology Co., Ltd. 9.3 avg Institute For Basic Science 9.3 avg Avision Inc. 9.3 avg The Hershey Company 9.3 avg

Mitsui's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

44 Top 26% higher than 74% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Mitsui High-tec, Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	6	5.6%
2016	10	9.3%
2017	18	16.8%
2018	16	15.0%
2019	19	17.8%
2020	12	11.2%
2021	6	5.6%
2022	9	8.4%
2023	7	6.5%
2024	3	2.8%
2025partial year	1	0.9%

Which technologies does Mitsui High-tec, Inc. patent most?

H02K - Dynamo-electric Machines 92

Y10T - Technical Subjects Covered BY Former US Classification 43

B21D - Working OR Processing OF Sheet Metal OR Metal Tubes, Rods OR Profiles Without Essentially Removing MATERIAL; Punching Metal 28

H01F - MAGNETS; INDUCTANCES; TRANSFORMERS; Selection OF Materials FOR Their Magnetic Properties 19

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 13

B29L - Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles 10

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 7

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 6

H01L - Semiconductor Devices NOT Covered BY Class H10 6

C21D - Modifying THE Physical Structure OF Ferrous METALS; General Devices FOR Heat Treatment OF Ferrous OR Non-ferrous Metals OR ALLOYS; Making Metal Malleable, e.g. BY Decarburisation OR Tempering 3

G01N - Investigating OR Analysing Materials BY Determining Their Chemical OR Physical Properties 3

Y02E - Reduction OF Greenhouse GAS [GHG] Emissions, Related TO Energy Generation, Transmission OR Distribution 2

H01M - Processes OR Means, e.g. Batteries, FOR THE Direct Conversion OF Chemical Energy Into Electrical Energy 2

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 2

G01B - Measuring Length, Thickness OR Similar Linear DIMENSIONS; Measuring ANGLES; Measuring AREAS; Measuring Irregularities OF Surfaces OR Contours 2

Top 15 of 29 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Mitsui High-tec, Inc.'s patent record in context - here's where to go next.

Mitsui High-tec, Inc.'s lead technology class is H02K (Dynamo-electric Machines), 86% of its portfolio - see every assignee active in that class. Explore H02K
Ranked #3,454 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Mitsui High-tec, Inc. against Diebold Nixdorf Incorporated, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 44.2/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.