Where does Laser Systems Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Laser Systems Inc. ranks #36,199 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Laser Systems Inc. hold?

Laser Systems Inc. holds 7 US utility patents granted between 2021 and 2025, spanning 11 technology areas.

What is Laser Systems Inc.'s Innovation Score?

Laser Systems Inc. has an Innovation Score of 33.0 out of 100 (43rd percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Laser Systems Inc.'s patent grant rate increasing or decreasing?

Insufficient historical data is available to calculate a velocity trend for Laser Systems Inc..

What does claim depth mean for Laser Systems Inc.'s patents?

Laser Systems Inc.'s patents average 12.3 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Laser Systems Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Laser Systems Inc.

Q: What technology areas does Laser Systems Inc. focus on?

Laser Systems Inc.'s top technology area is B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam) with 3 patents, ranking #537 of 1,623 assignees active in that subclass. Grants appear in 11 CPC subclasses total.

USPTO PatentsView assignee record - 7 granted patents across 11 technology areas, recorded in grant years 2021–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Laser ranks #36,199 of 49,997 tracked US assignees by granted-patent volume, with 7 patents across 11 technology areas.

#36,199
of 49,997 US assignees by volume: 43rd percentile
by Innovation Score (33.0/100): 12.3
avg claims per patent

USPTO PatentsView assignee plate

Corpus R36199 · Foreign Corporation #36,199 · 7 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-RICH · TYPE-FRNCORP · SPAN-YRS · BOOK-RICH

GRANTS-MICRO 7 grants
MID-PACK #36,199/49,997
PHOTO-FINISH LA Siesta
CPC-FOCUS B23K · 11 areas
INNOV-THIN 33.0/100
CLAIMS-RICH 12.3 claims/avg
TYPE-FRNCORP Foreign Corp
SPAN-YRS 2021–2025 · 5y
BOOK-RICH 9/10 fields

Nearest grant-volume peer: LA Siesta GMBH (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Laser’s 33.0 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 7.2 pts (22%) Velocity 6.7 pts (20%) Breadth 11.7 pts (35%) Claim depth 7.4 pts (22%)

Qualcomm Incorporated · highest

85
Laser Systems · this assignee

33
3D Lighting… · lowest

7

What this shows Laser's Innovation Score is 33.0/100 (43rd percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Laser?

Each dot is one of Laser’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Laser’s own 12.3 claims/patent is at or below the 12.6 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Laser vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Laser's grants concentrate

Laser Systems Inc. is a focused PatentsView assignee: 11 CPC subclasses with 42.9% of grants classified under B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam). Peak complete grant year is 2021 (3 grants) versus a trough of 1 in 2024. By volume, Laser sits between LA Siesta GMBH and LBA Group, Inc..

Laser's three-year grant acceleration

Laser Systems Inc. shows 3 grants in 2022–2024 against only 3 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

LA Siesta

7
Laboratorios Lesv…

7
LAP IQ

7
Lappeenrannan Tek…

7
LAU Superconducto…

7
Laurastar Group

7
LB Pharmaceuticals

7
LBA Group

7
Laser Systems ◀

7

What this shows Laser holds 7 patents at rank #36,171, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Laser

By rank, the assignees closest to #36,171 in granted patent volume.

Leaders in B23K (Soldering OR Unsoldering)

Other assignees with the most granted patents in Laser's primary technology class.

Laser's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

33 43rd percentile higher than 43% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2021–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2021–2019 baseline. Full figures in the table below.

View data table

Laser Systems Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2021	3	42.9%
2022	2	28.6%
2024	1	14.3%
2025partial year	1	14.3%

Which technologies does Laser Systems Inc. patent most?

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 3

H02J - Circuit Arrangements OR Systems FOR Supplying OR Distributing Electric POWER; Systems FOR Storing Electric Energy 2

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 2

H02M - Apparatus FOR Conversion Between AC AND AC, Between AC AND DC, OR Between DC AND DC, AND FOR USE With Mains OR Similar Power Supply SYSTEMS; Conversion OF DC OR AC Input Power Into Surge Output POWER; Control OR Regulation Thereof 2

H01P - WAVEGUIDES; Resonators, Lines, OR Other Devices OF THE Waveguide Type 1

H04B - Transmission 1

H03H - Impedance Networks, e.g. Resonant CIRCUITS; Resonators 1

Y02B - Climate Change Mitigation Technologies Related TO Buildings, e.g. Housing, House Appliances OR Related End-user Applications 1

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 1

H10D - Inorganic Electric Semiconductor Devices 1

H01L - Semiconductor Devices NOT Covered BY Class H10 1

Top 11 of 11 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Laser Systems Inc.'s patent record in context - here's where to go next.

Laser Systems Inc.'s lead technology class is B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam), 42.9% of its portfolio - see every assignee active in that class. Explore B23K
Ranked #36,199 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Laser Systems Inc. against LA Siesta GMBH, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 33.0/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.