Where does Hosei University rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Hosei University ranks #21,239 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Hosei University hold?

Hosei University holds 13 US utility patents granted between 2019 and 2024, spanning 25 technology areas.

What is Hosei University's Innovation Score?

Hosei University has an Innovation Score of 38.3 out of 100 (top 41% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Hosei University focus on?

Hosei University's top technology area is H01L (Semiconductor Devices NOT Covered BY Class H10) with 5 patents, ranking #1,398 of 3,373 assignees active in that subclass. Grants appear in 25 CPC subclasses total.

Is Hosei University's patent grant rate increasing or decreasing?

Hosei University's recent grant velocity is +450% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Hosei University's patents?

Hosei University's patents average 12.2 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Hosei University patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Hosei University

USPTO PatentsView assignee record - 13 granted patents across 25 technology areas, recorded in grant years 2019–2024. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01L (Semiconductor Devices NOT Covered BY Class H10).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Hosei ranks #21,239 of 49,997 tracked US assignees by granted-patent volume, with 13 patents across 25 technology areas.

#21,239
of 49,997 US assignees by volume: Top 41%
by Innovation Score (38.3/100): 12.2
avg claims per patent: +450%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R21239 · Foreign Corporation #21,239 · 13 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-RICH · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 13 grants
MID-PACK #21,239/49,997
PHOTO-FINISH Highview Enterprises
CPC-FOCUS H01L · 25 areas
INNOV-THIN 38.3/100
CLAIMS-RICH 12.2 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +450% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Highview Enterprises Limited (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Hosei’s 38.3 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 9.1 pts (24%) Velocity 4.2 pts (11%) Breadth 17.7 pts (46%) Claim depth 7.3 pts (19%)

Qualcomm Incorporated · highest

85
Hosei University · this assignee

38
3D Lighting… · lowest

7

What this shows Hosei's Innovation Score is 38.3/100 (top 41% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Hosei?

Each dot is one of Hosei’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Hosei’s own 12.2 claims/patent is at or below the 15.8 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Hosei vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Hosei's grants concentrate

Hosei University is a focused PatentsView assignee: 25 CPC subclasses with 38.5% of grants classified under H01L (Semiconductor Devices NOT Covered BY Class H10). Peak complete grant year is 2021 (4 grants) versus a trough of 1 in 2023. By volume, Hosei sits between Highview Enterprises Limited and Hydromecanique et Frottement.

Hosei's three-year grant acceleration

Hosei University shows 5 grants in 2022–2024 against only 8 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Highview Enterpri…

13
Hirevue

13
Hoerbiger Wien

13
Hole-in-one Media

13
Hothead Games

13
Hottinger Baldwin…

13
Hummingbird Diagn…

13
Hydromecanique et…

13
Hosei University ◀

13

What this shows Hosei holds 13 patents at rank #21,239, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Hosei

By rank, the assignees closest to #21,239 in granted patent volume.

Leaders in H01L (Semiconductor Devices NOT Covered BY Class H10)

Other assignees with the most granted patents in Hosei's primary technology class.

Hosei's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

38 Top 41% higher than 59% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2019–2024

Grants by year

Teal-shaded recent years (2020–present) versus the 2019–2019 baseline. Full figures in the table below.

View data table

Hosei University patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2019	2	15.4%
2020	2	15.4%
2021	4	30.8%
2023	1	7.7%
2024	4	30.8%

Which technologies does Hosei University patent most?

H01L - Semiconductor Devices NOT Covered BY Class H10 5

H10D - Inorganic Electric Semiconductor Devices 4

G01R - Measuring Electric VARIABLES; Measuring Magnetic Variables 3

C01B - Non-metallic ELEMENTS; Compounds THEREOF; ; Metalloids OR Compounds Thereof NOT Covered BY Subclass C01c 2

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 2

C30B - Single-crystal Growth ; Unidirectional Solidification OF Eutectic Material OR Unidirectional Demixing OF Eutectoid MATERIAL; Refining BY Zone-melting OF Material ; Production OF A Homogeneous Polycrystalline Material With Defined Structure ; Single Crystals OR Homogeneous Polycrystalline Material WI 2

Y02E - Reduction OF Greenhouse GAS [GHG] Emissions, Related TO Energy Generation, Transmission OR Distribution 1

F17C - Vessels FOR Containing OR Storing Compressed, Liquefied OR Solidified GASES; Fixed-capacity GAS-HOLDERS; Filling Vessels With, OR Discharging From Vessels, Compressed, Liquefied, OR Solidified Gases 1

B01D - Separation 1

H01S - Devices Using THE Process OF Light Amplification BY Stimulated Emission OF Radiation [LASER] TO Amplify OR Generate LIGHT; Devices Using Stimulated Emission OF Electromagnetic Radiation IN Wave Ranges Other Than Optical 1

G02F - Optical Devices OR Arrangements FOR THE Control OF Light BY Modification OF THE Optical Properties OF THE Media OF THE Elements Involved THEREIN; Non-linear OPTICS; Frequency-changing OF LIGHT; Optical Logic ELEMENTS; Optical ANALOGUE/DIGITAL Converters 1

H10H - Inorganic Light-emitting Semiconductor Devices Having Potential Barriers 1

C23C - Coating Metallic MATERIAL; Coating Material With Metallic MATERIAL; Surface Treatment OF Metallic Material BY Diffusion Into THE Surface, BY Chemical Conversion OR SUBSTITUTION; Coating BY Vacuum Evaporation, BY Sputtering, BY ION Implantation OR BY Chemical Vapour Deposition, IN General 1

H04B - Transmission 1

B33Y - Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective Laser Sintering 1

Top 15 of 25 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Hosei University's patent record in context - here's where to go next.

Hosei University's lead technology class is H01L (Semiconductor Devices NOT Covered BY Class H10), 38.5% of its portfolio - see every assignee active in that class. Explore H01L
Ranked #21,239 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Hosei University against Highview Enterprises Limited, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 38.3/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.