Where does Hangzhou Sizone Electronic Technology Inc rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Hangzhou Sizone Electronic Technology Inc ranks #35,628 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Hangzhou Sizone Electronic Technology Inc hold?

Hangzhou Sizone Electronic Technology Inc holds 7 US utility patents granted between 2023 and 2025, spanning 5 technology areas.

What is Hangzhou Sizone Electronic Technology Inc's Innovation Score?

Hangzhou Sizone Electronic Technology Inc has an Innovation Score of 41.4 out of 100 (top 33% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Hangzhou Sizone Electronic Technology Inc's patent grant rate increasing or decreasing?

Insufficient historical data is available to calculate a velocity trend for Hangzhou Sizone Electronic Technology Inc.

What does claim depth mean for Hangzhou Sizone Electronic Technology Inc's patents?

Hangzhou Sizone Electronic Technology Inc's patents average 10.6 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Hangzhou Sizone Electronic Technology Inc

Q: What technology areas does Hangzhou Sizone Electronic Technology Inc focus on?

Hangzhou Sizone Electronic Technology Inc's top technology area is B24B (Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents) with 6 patents. Grants appear in 5 CPC subclasses total.

Q: How is the Hangzhou Sizone Electronic Technology Inc patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO PatentsView assignee record - 7 granted patents across 5 technology areas, recorded in grant years 2023–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B24B (Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Hangzhou ranks #35,628 of 49,997 tracked US assignees by granted-patent volume, with 7 patents across 5 technology areas.

#35,628
of 49,997 US assignees by volume: Top 33%
by Innovation Score (41.4/100): 10.6
avg claims per patent

USPTO PatentsView assignee plate

Corpus R35628 · Foreign Corporation #35,628 · 7 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-PAR · CLAIMS-PAR · TYPE-FRNCORP · SPAN-YRS · BOOK-RICH

GRANTS-MICRO 7 grants
MID-PACK #35,628/49,997
PHOTO-FINISH Hamaton Automotive…
CPC-NARROW B24B · 5 areas
INNOV-PAR 41.4/100
CLAIMS-PAR 10.6 claims/avg
TYPE-FRNCORP Foreign Corp
SPAN-YRS 2023–2025 · 3y
BOOK-RICH 9/10 fields

Nearest grant-volume peer: Hamaton Automotive Technology Co., Ltd. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Hangzhou Sizone… · this assignee

41
3D Lighting… · lowest

7

What this shows Hangzhou's Innovation Score is 41.4/100 (top 33% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Hangzhou's grants concentrate

Hangzhou Sizone Electronic Technology Inc is a focused PatentsView assignee: 5 CPC subclasses with 85.7% of grants classified under B24B (Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents). Peak complete grant year is 2024 (3 grants) versus a trough of 1 in 2023. By volume, Hangzhou sits between Hamaton Automotive Technology Co., Ltd. and Hanwha Advanced Materials Corporation.

Hangzhou's three-year grant acceleration

Hangzhou Sizone Electronic Technology Inc shows 4 grants in 2022–2024 against only 0 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Hamaton Automotiv…

7
Hamlin (Suzhou)

7
Hands

7
Hangzhou Converd

7
Hangzhou Weiying…

7
Hansa Biopharma AB

7
Hanseo University…

7
Hanwha Advanced M…

7
Hangzhou Sizone T… ◀

7

What this shows Hangzhou holds 7 patents at rank #35,608, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Hangzhou

By rank, the assignees closest to #35,608 in granted patent volume.

Leaders in B24B (Machines)

Other assignees with the most granted patents in Hangzhou's primary technology class.

Hangzhou's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

41 Top 33% higher than 67% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2023–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2023–2019 baseline. Full figures in the table below.

View data table

Hangzhou Sizone Electronic Technology Inc patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2023	1	14.3%
2024	3	42.9%
2025partial year	3	42.9%

Which technologies does Hangzhou Sizone Electronic Technology Inc patent most?

B24B - Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents 6

H01L - Semiconductor Devices NOT Covered BY Class H10 6

B23H - Working OF Metal BY THE Action OF A High Concentration OF Electric Current ON A Workpiece Using AN Electrode Which Takes THE Place OF A TOOL; Such Working Combined With Other Forms OF Working OF Metal 1

G01B - Measuring Length, Thickness OR Similar Linear DIMENSIONS; Measuring ANGLES; Measuring AREAS; Measuring Irregularities OF Surfaces OR Contours 1

B08B - Cleaning IN GENERAL; Prevention OF Fouling IN General 1

Top 5 of 5 technology areas

Where it ranks

Overall rank by patents

#35,628

of 49,997 tracked assignees

Innovation Score

41.4 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Hangzhou Sizone Electronic Technology Inc's patent record in context - here's where to go next.

Hangzhou Sizone Electronic Technology Inc's lead technology class is B24B (Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents), 85.7% of its portfolio - see every assignee active in that class. Explore B24B
Ranked #35,628 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Hangzhou Sizone Electronic Technology Inc against Hamaton Automotive Technology Co., Ltd., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 41.4/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.