Where does Hakko Corporation rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Hakko Corporation ranks #5,363 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Hakko Corporation hold?

Hakko Corporation holds 64 US utility patents granted between 2015 and 2025, spanning 20 technology areas.

What is Hakko Corporation's Innovation Score?

Hakko Corporation has an Innovation Score of 39.7 out of 100 (top 37% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Hakko Corporation's patent grant rate increasing or decreasing?

Hakko Corporation's recent grant velocity is +10% compared to the prior five-year period (grant years, not application filing dates). The company is maintaining or growing its granted-patent output.

What does claim depth mean for Hakko Corporation's patents?

Hakko Corporation's patents average 9.2 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Hakko Corporation patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Hakko Corporation

Q: What technology areas does Hakko Corporation focus on?

Hakko Corporation's top technology area is B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam) with 30 patents, ranking #62 of 1,623 assignees active in that subclass. Grants appear in 20 CPC subclasses total.

USPTO PatentsView assignee record - 64 granted patents across 20 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Hakko ranks #5,363 of 49,997 tracked US assignees by granted-patent volume, with 64 patents across 20 technology areas.

#5,363
of 49,997 US assignees by volume: Top 37%
by Innovation Score (39.7/100): 9.2
avg claims per patent: +10%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R5363 · Foreign Corporation #5,363 · 64 grants

GRANTS-SMALL · UPPER-Q · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-PAR · TYPE-FRNCORP · VEL-UP · BOOK-FULL

GRANTS-SMALL 64 grants
UPPER-Q #5,363/49,997
PHOTO-FINISH Federal Signal
CPC-FOCUS B23K · 20 areas
INNOV-THIN 39.7/100
CLAIMS-PAR 9.2 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-UP +10% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Federal Signal Corporation (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Hakko’s 39.7 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 14.4 pts (36%) Velocity 3.9 pts (10%) Breadth 15.8 pts (40%) Claim depth 5.5 pts (14%)

Qualcomm Incorporated · highest

85
Hakko · this assignee

40
Kony · near

40
Link Labs · near

40
OIL States Energy… · near

40
Wolf Tooth Components · near

40
3D Lighting… · lowest

7

What this shows Hakko's Innovation Score is 39.7/100 (top 37% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Hakko?

Each dot is one of Hakko’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Hakko’s own 9.2 claims/patent is at or below the 15.3 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Hakko vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Hakko's grants concentrate

Hakko Corporation is a focused PatentsView assignee: 20 CPC subclasses with 46.9% of grants classified under B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam). Peak complete grant year is 2020 (14 grants) versus a trough of 3 in 2019. By volume, Hakko sits between Federal Signal Corporation and Innovative Sonic Corporation.

Hakko's three-year grant acceleration

From 2019–2021 to 2022–2024, Hakko Corporation moved from 22 to 13 grants (0.59x the prior three-year total, a multiple, not a CAGR). See the growth leaderboard.

Federal Signal

64
Ferro

64
Gecko Robotics

64
Haikou Lili Inves…

64
Honda Access

64
Heathco

64
ICT Integrated Ci…

64
Innovative Sonic

64
Hakko ◀

64

What this shows Hakko holds 64 patents at rank #5,363, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Hakko

By rank, the assignees closest to #5,363 in granted patent volume.

Leaders in B23K (Soldering OR Unsoldering)

Other assignees with the most granted patents in Hakko's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Hakko, neither rank-band nor same-CPC leaders (those blocks stay above). In B23K (Soldering OR Unsoldering), Hakko ranks #62 of 1,623 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (40 here).

OIL States Energy Services, L.L.C. 40 Link Labs, Inc. 40 Wolf Tooth Components, LLC 40 Kony, Inc. 40

Similar claim depth

Nearest assignees by average claims per patent (9.2 here).

Fidlock GMBH 9.2 avg Chang Gung University 9.2 avg Vatech Co., Ltd. 9.2 avg Dyaco International Inc. 9.2 avg

Hakko's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

40 Top 37% higher than 63% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Hakko Corporation patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	7	10.9%
2016	7	10.9%
2017	7	10.9%
2018	5	7.8%
2019	3	4.7%
2020	14	21.9%
2021	5	7.8%
2022	7	10.9%
2023	3	4.7%
2024	3	4.7%
2025partial year	3	4.7%

Which technologies does Hakko Corporation patent most?

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 30

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 7

G05B - Control OR Regulating Systems IN GENERAL; Functional Elements OF Such SYSTEMS; Monitoring OR Testing Arrangements FOR Such Systems OR Elements 5

G01K - Measuring TEMPERATURE; Measuring Quantity OF HEAT; Thermally-sensitive Elements NOT Otherwise Provided FOR 3

H02G - Installation OF Electric Cables OR Lines, OR OF Combined Optical AND Electric Cables OR Lines 2

A61B - DIAGNOSIS; SURGERY; Identification 2

H05B - Electric HEATING; Electric Light Sources NOT Otherwise Provided FOR; Circuit Arrangements FOR Electric Light Sources, IN General 2

G06F - Electric Digital Data Processing 2

H10N - Electric Solid-state Devices NOT Otherwise Provided FOR 1

F27D - Details OR Accessories OF Furnaces, Kilns, Ovens OR Retorts, IN SO FAR AS They ARE OF Kinds Occurring IN More Than ONE Kind OF Furnace 1

Y10T - Technical Subjects Covered BY Former US Classification 1

Y02E - Reduction OF Greenhouse GAS [GHG] Emissions, Related TO Energy Generation, Transmission OR Distribution 1

B25B - Tools OR Bench Devices NOT Otherwise Provided FOR, FOR Fastening, Connecting, Disengaging OR Holding 1

H04B - Transmission 1

B25J - MANIPULATORS; Chambers Provided With Manipulation Devices 1

Top 15 of 20 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Hakko Corporation's patent record in context - here's where to go next.

Hakko Corporation's lead technology class is B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam), 46.9% of its portfolio - see every assignee active in that class. Explore B23K
Ranked #5,363 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Hakko Corporation against Federal Signal Corporation, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 39.7/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.