Where does Elkem Silicones Shanghai Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Elkem Silicones Shanghai Co., Ltd. ranks #39,999 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Elkem Silicones Shanghai Co., Ltd. hold?

Elkem Silicones Shanghai Co., Ltd. holds 6 US utility patents granted between 2019 and 2025, spanning 15 technology areas.

What is Elkem Silicones Shanghai Co., Ltd.'s Innovation Score?

Elkem Silicones Shanghai Co., Ltd. has an Innovation Score of 39.4 out of 100 (top 38% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Elkem Silicones Shanghai Co., Ltd. focus on?

Elkem Silicones Shanghai Co., Ltd.'s top technology area is C08K (Use of inorganic or non-macromolecular organic substances as compounding ingredients) with 5 patents, ranking #547 of 1,963 assignees active in that subclass. Grants appear in 15 CPC subclasses total.

Is Elkem Silicones Shanghai Co., Ltd.'s patent grant rate increasing or decreasing?

Elkem Silicones Shanghai Co., Ltd.'s recent grant velocity is +300% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Elkem Silicones Shanghai Co., Ltd.'s patents?

Elkem Silicones Shanghai Co., Ltd.'s patents average 24.2 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Elkem Silicones Shanghai Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Elkem Silicones Shanghai Co., Ltd.

USPTO PatentsView assignee record - 6 granted patents across 15 technology areas, recorded in grant years 2019–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: C08K (Use of inorganic or non-macromolecular organic substances as compounding ingredients).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Elkem ranks #39,999 of 49,997 tracked US assignees by granted-patent volume, with 6 patents across 15 technology areas.

#39,999
of 49,997 US assignees by volume: Top 38%
by Innovation Score (39.4/100): 24.2
avg claims per patent: +300%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R39999 · Foreign Corporation #39,999 · 6 grants

GRANTS-MICRO · LOWER-Q · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-DENSE · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 6 grants
LOWER-Q #39,999/49,997
PHOTO-FINISH Electrovaya
CPC-FOCUS C08K · 15 areas
INNOV-THIN 39.4/100
CLAIMS-DENSE 24.2 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +300% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Electrovaya Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Elkem’s 39.4 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 6.7 pts (17%) Velocity 4.4 pts (11%) Breadth 13.7 pts (35%) Claim depth 14.5 pts (37%)

Qualcomm Incorporated · highest

85
Elkem Silicones… · this assignee

39
3D Lighting… · lowest

7

What this shows Elkem's Innovation Score is 39.4/100 (top 38% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Elkem?

Each dot is one of Elkem’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Elkem’s own 24.2 claims/patent is ABOVE the 9.7 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Elkem vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Elkem's grants concentrate

Elkem Silicones Shanghai Co., Ltd. is a focused PatentsView assignee: 15 CPC subclasses with 83.3% of grants classified under C08K (Use of inorganic or non-macromolecular organic substances as compounding ingredients). By volume, Elkem sits between Electrovaya Inc. and Emergent Product Development Gaithersburg Inc..

Elkem's three-year grant acceleration

Elkem Silicones Shanghai Co., Ltd. shows 2 grants in 2022–2024 against only 3 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Electrovaya

6
Elfi-tech

6
Elifeconnection

6
ELK

6
Elvy

6
EM Coretech

6
Emanate Wireless

6
Emergent Product…

6
Elkem Silicones S… ◀

6

What this shows Elkem holds 6 patents at rank #39,966, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Elkem

By rank, the assignees closest to #39,966 in granted patent volume.

Leaders in C08K (Use of inorganic or non-macromolecular organic substances…)

Other assignees with the most granted patents in Elkem's primary technology class.

Elkem's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

39 Top 38% higher than 62% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2019–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2019–2019 baseline. Full figures in the table below.

View data table

Elkem Silicones Shanghai Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2019	1	16.7%
2020	1	16.7%
2021	1	16.7%
2022	1	16.7%
2024	1	16.7%
2025partial year	1	16.7%

Which technologies does Elkem Silicones Shanghai Co., Ltd. patent most?

C08K - Use of inorganic or non-macromolecular organic substances as compounding ingredients 5

C08G - Macromolecular Compounds Obtained Otherwise Than BY Reactions Only Involving Unsaturated Carbon-to-carbon Bonds 5

C08L - Compositions OF Macromolecular Compounds 5

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 2

B60R - Vehicles, Vehicle Fittings, OR Vehicle Parts, NOT Otherwise Provided FOR 1

C09D - Coating Compositions, e.g. Paints, Varnishes OR LACQUERS; Filling PASTES; Chemical Paint OR INK REMOVERS; INKS; Correcting FLUIDS; WOODSTAINS; Pastes OR Solids FOR Colouring OR PRINTING; USE OF Materials Therefor 1

D10B - Indexing Scheme Associated With Sublasses OF Section D, Relating TO Textiles 1

D06N - Wall, Floor, OR Like Covering Materials, e.g. Linoleum, Oilcloth, Artificial Leather, Roofing Felt, Consisting OF A Fibrous WEB Coated With A Layer OF Macromolecular MATERIAL; Flexible Sheet Material NOT Otherwise Provided FOR 1

H10H - Inorganic Light-emitting Semiconductor Devices Having Potential Barriers 1

C09J - ADHESIVES; Non-mechanical Aspects OF Adhesive Processes IN GENERAL; Adhesive Processes NOT Provided FOR ELSEWHERE; USE OF Materials AS Adhesives 1

C08J - WORKING-UP; General Processes OF COMPOUNDING; After-treatment NOT Covered BY Subclasses C08b, C08c, C08f, C08g or C08h 1

H01B - CABLES; CONDUCTORS; INSULATORS; Selection OF Materials FOR Their Conductive, Insulating OR Dielectric Properties 1

B33Y - Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective Laser Sintering 1

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 1

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 1

Top 15 of 15 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Elkem Silicones Shanghai Co., Ltd.'s patent record in context - here's where to go next.

Elkem Silicones Shanghai Co., Ltd.'s lead technology class is C08K (Use of inorganic or non-macromolecular organic substances as compounding ingredients), 83.3% of its portfolio - see every assignee active in that class. Explore C08K
Ranked #39,999 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Elkem Silicones Shanghai Co., Ltd. against Electrovaya Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 39.4/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.