Where does Daewon Semiconductor Packaging Industrial Company rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Daewon Semiconductor Packaging Industrial Company ranks #39,737 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

What is Daewon Semiconductor Packaging Industrial Company's Innovation Score?

Daewon Semiconductor Packaging Industrial Company has an Innovation Score of 44.7 out of 100 (top 25% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Daewon Semiconductor Packaging Industrial Company focus on?

Daewon Semiconductor Packaging Industrial Company's top technology area is H01L (Semiconductor Devices NOT Covered BY Class H10) with 6 patents. Grants appear in 6 CPC subclasses total.

Is Daewon Semiconductor Packaging Industrial Company's patent grant rate increasing or decreasing?

Insufficient historical data is available to calculate a velocity trend for Daewon Semiconductor Packaging Industrial Company.

What does claim depth mean for Daewon Semiconductor Packaging Industrial Company's patents?

Daewon Semiconductor Packaging Industrial Company's patents average 15.5 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

USPTO 2015–2025 USPTO PatentsView US Corporation

Daewon Semiconductor Packaging Industrial Company

Q: How many patents does Daewon Semiconductor Packaging Industrial Company hold?

Daewon Semiconductor Packaging Industrial Company holds 6 US utility patents granted between 2022 and 2025, spanning 6 technology areas.

Q: How is the Daewon Semiconductor Packaging Industrial Company patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO PatentsView assignee record - 6 granted patents across 6 technology areas, recorded in grant years 2022–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01L (Semiconductor Devices NOT Covered BY Class H10).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Daewon ranks #39,737 of 49,997 tracked US assignees by granted-patent volume, with 6 patents across 6 technology areas.

#39,737
of 49,997 US assignees by volume: Top 25%
by Innovation Score (44.7/100): 15.5
avg claims per patent

USPTO PatentsView assignee plate

Corpus R39737 · US Corporation #39,737 · 6 grants

GRANTS-MICRO · LOWER-Q · PHOTO-FINISH · CPC-NARROW · INNOV-PAR · CLAIMS-RICH · TYPE-USCORP · SPAN-YRS · BOOK-RICH

GRANTS-MICRO 6 grants
LOWER-Q #39,737/49,997
PHOTO-FINISH Da Volterra
CPC-NARROW H01L · 6 areas
INNOV-PAR 44.7/100
CLAIMS-RICH 15.5 claims/avg
TYPE-USCORP US Corporation
SPAN-YRS 2022–2025 · 4y
BOOK-RICH 9/10 fields

Nearest grant-volume peer: Da Volterra (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Daewon Semiconductor… · this assignee

45
3D Lighting… · lowest

7

What this shows Daewon's Innovation Score is 44.7/100 (top 25% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Daewon's grants concentrate

Daewon Semiconductor Packaging Industrial Company is a focused PatentsView assignee: 6 CPC subclasses with 100% of grants classified under H01L (Semiconductor Devices NOT Covered BY Class H10). Peak complete grant year is 2022 (2 grants) versus a trough of 1 in 2023. By volume, Daewon sits between Dynamic Controls and Damoatech Co.,Ltd..

Daewon's three-year grant acceleration

Daewon Semiconductor Packaging Industrial Company shows 5 grants in 2022–2024 against only 0 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Dynamic Controls

6
Da Volterra

6
Daca Design

6
Daetwyler Sealing…

6
Daewoo

6
Dairy Australia

6
Daisy Intelligence

6
Damoatech

6
Daewon Semiconduc… ◀

6

What this shows Daewon holds 6 patents at rank #39,819, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Daewon

By rank, the assignees closest to #39,819 in granted patent volume.

Leaders in H01L (Semiconductor Devices NOT Covered BY Class H10)

Other assignees with the most granted patents in Daewon's primary technology class.

Daewon's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

45 Top 25% higher than 75% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2022–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2022–2019 baseline. Full figures in the table below.

View data table

Daewon Semiconductor Packaging Industrial Company patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2022	2	33.3%
2023	1	16.7%
2024	2	33.3%
2025partial year	1	16.7%

Which technologies does Daewon Semiconductor Packaging Industrial Company patent most?

H01L - Semiconductor Devices NOT Covered BY Class H10 6

B29L - Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles 3

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 3

Y10T - Technical Subjects Covered BY Former US Classification 2

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 1

B65D - Containers FOR Storage OR Transport OF Articles OR Materials, e.g. Bags, Barrels, Bottles, Boxes, Cans, Cartons, Crates, Drums, Jars, Tanks, Hoppers, Forwarding CONTAINERS; Accessories, Closures, OR Fittings THEREFOR; Packaging ELEMENTS; Packages 1

Top 6 of 6 technology areas

Where it ranks

Overall rank by patents

#39,737

of 49,997 tracked assignees

Innovation Score

44.7 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Daewon Semiconductor Packaging Industrial Company's patent record in context - here's where to go next.

Daewon Semiconductor Packaging Industrial Company's lead technology class is H01L (Semiconductor Devices NOT Covered BY Class H10), 100% of its portfolio - see every assignee active in that class. Explore H01L
Ranked #39,737 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Daewon Semiconductor Packaging Industrial Company against Dynamic Controls, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 44.7/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.