Where does Component Re-engineering Company, Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Component Re-engineering Company, Inc. ranks #20,950 of 50,000 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Component Re-engineering Company, Inc. hold?

Component Re-engineering Company, Inc. holds 13 US utility patents granted between 2015 and 2020, spanning 9 technology areas.

What is Component Re-engineering Company, Inc.'s Innovation Score?

Component Re-engineering Company, Inc. has an Innovation Score of 29.1 out of 100 (top 70% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Component Re-engineering Company, Inc.'s patent grant rate increasing or decreasing?

Component Re-engineering Company, Inc.'s recent grant velocity is -82% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Component Re-engineering Company, Inc.'s patents?

Component Re-engineering Company, Inc.'s patents average 15.7 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Component Re-engineering Company, Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView US Corporation

Component Re-engineering Company, Inc.

Q: What technology areas does Component Re-engineering Company, Inc. focus on?

Component Re-engineering Company, Inc.'s top technology area is B23K (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM) with 12 patents. Grants appear in 9 CPC subclasses total.

USPTO PatentsView assignee record - 13 granted patents across 9 technology areas, recorded in grant years 2015–2020. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B23K (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM).

Compiled by PlainPatent · May 15, 2026

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Component ranks #20,950 of 50,000 tracked US assignees by granted-patent volume, with 13 patents across 9 technology areas.

#20,950
of 50,000 US assignees by volume: Top 70%
by Innovation Score (29.1/100): 15.7
avg claims per patent: -82%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R20950 · US Corporation #20,950 · 13 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-RICH · TYPE-USCORP · VEL-DROP · BOOK-FULL

GRANTS-MICRO 13 grants
MID-PACK #20,950/50,000
PHOTO-FINISH Collegium Pharmaceut…
CPC-NARROW B23K · 9 areas
INNOV-THIN 29.1/100
CLAIMS-RICH 15.7 claims/avg
TYPE-USCORP US Corporation
VEL-DROP -82% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Collegium Pharmaceutical, Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Component Re-enginee… · this assignee

29
3D Lighting Innovati… · lowest

7

What this shows Component's Innovation Score is 29.1/100 (top 70% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Component's grants concentrate

Component Re-engineering Company, Inc. is a focused PatentsView assignee: 9 CPC subclasses with 92.3% of grants classified under B23K (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM). Peak complete grant year is 2019 (4 grants) versus a trough of 1 in 2015. By volume, Component sits between Collegium Pharmaceutical, Inc. and Connected Intelligence Systems Ltd..

Collegium Pharmac…

13
Colossio

13
Compart Systems P…

13
Compass Electro O…

13
Composite Technol…

13
Compuverde AB

13
Comsero

13
Connected Intelli…

13
Component Re-engi… ◀

13

What this shows Component holds 13 patents at rank #20,963, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Component

By rank, the assignees closest to #20,963 in granted patent volume.

Leaders in B23K (Soldering OR Unsoldering)

Other assignees with the most granted patents in Component's primary technology class.

Component's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

29 Top 70% higher than 30% of 50,000 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2020

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Component Re-engineering Company, Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	1	7.7%
2016	1	7.7%
2017	2	15.4%
2018	3	23.1%
2019	4	30.8%
2020	2	15.4%

Which technologies does Component Re-engineering Company, Inc. patent most?

B23K - SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 12

H01L - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10 11

C04B - LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE ; CERAMICS ; REFRACTORIES; TREATMENT OF NATURAL STONE 10

Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION 8

B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 6

F16B - DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING 6

H05B - ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL 5

B23Q - DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING ; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT 1

B23P - METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 1

Top 9 of 9 technology areas

Where it ranks

Overall rank by patents

#20,950

of 50,000 tracked assignees

Innovation Score

29.1 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.