USPTO 2015–2025 USPTO PatentsView Foreign Corporation

China Wafer Level CSP Co., Ltd.

USPTO PatentsView assignee record - 27 granted patents across 5 technology areas, recorded in grant years 2015–2021. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01L (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10).

27
Total patents granted
5
CPC technology areas
16.6
Avg claims per patent
-50%
5-year grant velocity

The verdict

According to USPTO PatentsView, China ranks #11,209 of 50,000 tracked US assignees by granted-patent volume, with 27 patents across 5 technology areas.

#11,209
of 50,000 US assignees by volume
Top 70%
by Innovation Score (29.4/100)
16.6
avg claims per patent
-50%
grant velocity, last 5 yrs

Portfolio overview

China Wafer Level CSP Co., Ltd. has been granted 27 US utility patents between 2015 and 2021, placing China Wafer Level CSP Co., Ltd. at #11,209 of 50,000 across all assignees tracked by PlainPatent. This portfolio spans 5 distinct Cooperative Patent Classification (CPC) subclasses, averaging 16.6 claims per patent with primary concentration in H01L (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10). As a Foreign Corporation, China Wafer Level CSP Co., Ltd. is one of the more focused assignees in the PatentsView dataset. By volume, China sits between Casper Sleep Inc. (27 patents, rank #11,210) and Clariant Corporation (27 patents, rank #11,218) - the closest US assignees by grant volume. The composite Innovation Score of 29.4/100 blends portfolio volume, grant velocity, technology breadth, and claim depth into a single comparable measure drawn directly from USPTO PatentsView records.

Grant cadence records the difference between two grant-year windows. Between 2020 and 2024 the company received 9 grants, compared with 18 in the 2015–2019 window, a -50% shift in five-year grant velocity. Both windows cover five complete grant years; the latest PatentsView year is a partial release and is excluded from this comparison, though it still appears in the yearly table and chart below. Grant timing can lag the related application by years, so this comparison does not establish current R&D spending, strategic intent, or a company’s application activity. The Foreign Corporation classification provides context for the assignee record, not a conclusion about its business strategy.

Claim depth and technology breadth describe this aggregate record. China Wafer Level CSP Co., Ltd.'s 16.6 average claims per patent is an average count, not a measure of claim scope, legal strength, enforceability, or design-around risk. The record spans 5 CPC subclasses. Combined with portfolio volume, these figures let readers compare the documented grant records of assignees in similar technology classes.

Who files at China's volume?

Granted US patents 2015–2025 versus its nearest-ranked assignees by volume, this company marked ◀

patents

What this shows China holds 27 patents at rank #11,214, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Source USPTO PatentsView, granted utility patents As of 2015–2025

Companies ranked near China

By rank, the assignees closest to #11,214 in granted patent volume.

Leaders in H01L (Semiconductor Devices NOT Covered BY Class H10)

Other assignees with the most granted patents in China's primary technology class.

China's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

29 Top 70% higher than 30% of 50,000 US assignees

0–10: 687 US assignees (1%). Below this entry. 10–20: 2,527 US assignees (5%). Below this entry. 20–30: 13,162 US assignees (26%). This entry sits in this band. 30–40: 15,294 US assignees (31%). Above this entry. 40–50: 11,491 US assignees (23%). Above this entry. 50–60: 5,058 US assignees (10%). Above this entry. 60–70: 1,537 US assignees (3%). Above this entry. 70–80: 234 US assignees (0%). Above this entry. 80–90: 10 US assignees (0%). Above this entry. 90–100: 0 US assignees (0%). Above this entry. This assignee 0 100 every tracked assignee, bucketed by value

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

0246810 2015201620172018201920202021 1
USPTO utility patent grants by year · 2015–2021

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table
China Wafer Level CSP Co., Ltd. patent grants by year, 2015–2025
Year Patents Granted Share of Period
2015 1 3.7%
2016 4 14.8%
2017 2 7.4%
2018 5 18.5%
2019 6 22.2%
2020 8 29.6%
2021 1 3.7%

Grant record at a glance

Portfolio Volume 27 grants
CPC subclasses 5
Avg. claims / grant 16.6
Velocity -50%

Historical grant data only; it does not rate legal strength or current strategy.

Where it ranks

Overall rank by patents

#11,209

of 50,000 tracked assignees

Innovation Score

29.4 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

Frequently Asked Questions

Where does China Wafer Level CSP Co., Ltd. rank among US patent assignees?
According to USPTO PatentsView (2015–2025 granted utility patents), China Wafer Level CSP Co., Ltd. ranks #11,209 of 50,000 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.
How many patents does China Wafer Level CSP Co., Ltd. hold?
China Wafer Level CSP Co., Ltd. holds 27 US utility patents granted between 2015 and 2021, spanning 5 technology areas.
What is China Wafer Level CSP Co., Ltd.'s Innovation Score?
China Wafer Level CSP Co., Ltd. has an Innovation Score of 29.4 out of 100 (top 70% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).
What technology areas does China Wafer Level CSP Co., Ltd. focus on?
China Wafer Level CSP Co., Ltd.'s top technology area is H01L (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10) with 25 patents. Grants appear in 5 CPC subclasses total.
Is China Wafer Level CSP Co., Ltd.'s patent grant rate increasing or decreasing?
China Wafer Level CSP Co., Ltd.'s recent grant velocity is -50% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.
What does claim depth mean for China Wafer Level CSP Co., Ltd.'s patents?
China Wafer Level CSP Co., Ltd.'s patents average 16.6 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.
How is the China Wafer Level CSP Co., Ltd. patent data sourced?
All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

How to use this portfolio

China's 27 grants land it in the top 70% by Innovation Score, but volume alone doesn't tell you where the strength sits.

  • Read that count against the largest US assignees before treating it as dominance - China ranks #11,209 of 50,000. Top 50 holders
  • Most of this portfolio concentrates in H01L - see who else leads that technology area. H01L leaders
  • Check what the four-part Innovation Score actually rewards before comparing it to another company. How the score works

Patent counts and the Innovation Score measure patenting activity, not commercial success or the legal strength of any patent. Many patents are filed defensively. Verify the status of an individual patent against official USPTO records.

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.