Where does 3D PLUS rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), 3D PLUS ranks #25,617 of 50,000 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does 3D PLUS hold?

3D PLUS holds 10 US utility patents granted between 2015 and 2023, spanning 12 technology areas.

What is 3D PLUS's Innovation Score?

3D PLUS has an Innovation Score of 28.2 out of 100 (top 73% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does 3D PLUS focus on?

3D PLUS's top technology area is H01L (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10) with 6 patents. Grants appear in 12 CPC subclasses total.

Is 3D PLUS's patent grant rate increasing or decreasing?

3D PLUS's recent grant velocity is -33% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for 3D PLUS's patents?

3D PLUS's patents average 7.3 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the 3D PLUS patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

3D PLUS

USPTO PatentsView assignee record - 10 granted patents across 12 technology areas, recorded in grant years 2015–2023. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01L (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10).

Compiled by PlainPatent · May 15, 2026

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, 3D ranks #25,617 of 50,000 tracked US assignees by granted-patent volume, with 10 patents across 12 technology areas.

#25,617
of 50,000 US assignees by volume: Top 73%
by Innovation Score (28.2/100): 7.3
avg claims per patent: -33%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R25617 · Foreign Corporation #25,617 · 10 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-SPARSE · TYPE-FRNCORP · VEL-DOWN · BOOK-FULL

GRANTS-MICRO 10 grants
MID-PACK #25,617/50,000
PHOTO-FINISH 1Q
CPC-FOCUS H01L · 12 areas
INNOV-THIN 28.2/100
CLAIMS-SPARSE 7.3 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DOWN -33% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: 1Q, Llc (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
3D PLUS · this assignee

28
3D Lighting Innovati… · lowest

7

What this shows 3D's Innovation Score is 28.2/100 (top 73% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where 3D's grants concentrate

3D PLUS is a focused PatentsView assignee: 12 CPC subclasses with 60% of grants classified under H01L (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10). Peak complete grant year is 2018 (2 grants) versus a trough of 1 in 2015. By volume, 3D sits between 1Q, Llc and 80 Percent Arms Inc..

3D's three-year grant acceleration

3D PLUS shows 2 grants in 2022–2024 against only 4 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

1Q

10
1ST Biotherapeuti…

10
1st Defence Indus…

10
2nd Skull

10
410 Medical

10
4DS Memory

10
7tunnels

10
80 Percent Arms

10
3D PLUS ◀

10

What this shows 3D holds 10 patents at rank #25,617, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near 3D

By rank, the assignees closest to #25,617 in granted patent volume.

Leaders in H01L (Semiconductor Devices NOT Covered BY Class H10)

Other assignees with the most granted patents in 3D's primary technology class.

3D's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

28 Top 73% higher than 27% of 50,000 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2023

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

3D PLUS patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	1	10.0%
2017	1	10.0%
2018	2	20.0%
2019	2	20.0%
2020	1	10.0%
2021	1	10.0%
2023	2	20.0%

Which technologies does 3D PLUS patent most?

H01L - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10 6

H05K - PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 3

H02M - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF 2

Y02B - CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS 2

B05D - PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL 1

H01G - CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE 1

C23C - COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1

G01R - MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 1

G11C - STATIC STORES 1

H04N - PICTORIAL COMMUNICATION, e.g. TELEVISION 1

H10F - INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION 1

G01J - MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY 1

Top 12 of 12 technology areas

Where it ranks

Overall rank by patents

#25,617

of 50,000 tracked assignees

Innovation Score

28.2 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.