Where does Yield Engineering Systems, Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Yield Engineering Systems, Inc. ranks #13,264 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Yield Engineering Systems, Inc. hold?

Yield Engineering Systems, Inc. holds 23 US utility patents granted between 2018 and 2025, spanning 14 technology areas.

What is Yield Engineering Systems, Inc.'s Innovation Score?

Yield Engineering Systems, Inc. has an Innovation Score of 55.2 out of 100 (top 7% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Yield Engineering Systems, Inc. focus on?

Yield Engineering Systems, Inc.'s top technology area is H01L (Semiconductor Devices NOT Covered BY Class H10) with 18 patents, ranking #648 of 3,373 assignees active in that subclass. Grants appear in 14 CPC subclasses total.

Is Yield Engineering Systems, Inc.'s patent grant rate increasing or decreasing?

Yield Engineering Systems, Inc.'s recent grant velocity is +400% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Yield Engineering Systems, Inc.'s patents?

Yield Engineering Systems, Inc.'s patents average 18.4 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Yield Engineering Systems, Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView US Corporation

Yield Engineering Systems, Inc.

USPTO PatentsView assignee record - 23 granted patents across 14 technology areas, recorded in grant years 2018–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01L (Semiconductor Devices NOT Covered BY Class H10).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Yield ranks #13,264 of 49,997 tracked US assignees by granted-patent volume, with 23 patents across 14 technology areas.

#13,264
of 49,997 US assignees by volume: Top 7%
by Innovation Score (55.2/100): 18.4
avg claims per patent: +400%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R13264 · US Corporation #13,264 · 23 grants

GRANTS-SMALL · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-RICH · TYPE-USCORP · VEL-SURGE · BOOK-FULL

GRANTS-SMALL 23 grants
MID-PACK #13,264/49,997
PHOTO-FINISH Xi'an University of…
CPC-FOCUS H01L · 14 areas
INNOV-PAR 55.2/100
CLAIMS-RICH 18.4 claims/avg
TYPE-USCORP US Corporation
VEL-SURGE +400% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Xi'an University of Technology (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Yield’s 55.2 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 11.0 pts (20%) Velocity 20.0 pts (36%) Breadth 13.2 pts (24%) Claim depth 11.0 pts (20%)

Qualcomm Incorporated · highest

85
Yield Engineering… · this assignee

55
3D Lighting… · lowest

7

What this shows Yield's Innovation Score is 55.2/100 (top 7% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Yield?

Each dot is one of Yield’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Yield’s own 18.4 claims/patent is ABOVE the 10.5 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Yield vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Yield's grants concentrate

Yield Engineering Systems, Inc. is a focused PatentsView assignee: 14 CPC subclasses with 78.3% of grants classified under H01L (Semiconductor Devices NOT Covered BY Class H10). Peak complete grant year is 2022 (6 grants) versus a trough of 1 in 2018. By volume, Yield sits between Xiaomi EV Technology Co., Ltd. and Zenlabs Energy, Inc..

Yield's three-year grant acceleration

Yield Engineering Systems, Inc. shows 14 grants in 2022–2024 against only 3 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Xiaomi EV Technol…

23
Xi'an University…

23
Yunjing Intellige…

23
Yupoong

23
Zavation Medical…

23
Zhuzhou Times NEW…

23
Zippy Technology

23
Zenlabs Energy

23
Yield Engineering… ◀

23

What this shows Yield holds 23 patents at rank #13,260, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Yield

By rank, the assignees closest to #13,260 in granted patent volume.

Leaders in H01L (Semiconductor Devices NOT Covered BY Class H10)

Other assignees with the most granted patents in Yield's primary technology class.

Yield's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

55 Top 7% higher than 93% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2018–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2018–2019 baseline. Full figures in the table below.

View data table

Yield Engineering Systems, Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2018	1	4.3%
2019	2	8.7%
2020	1	4.3%
2022	6	26.1%
2023	3	13.0%
2024	5	21.7%
2025partial year	5	21.7%

Which technologies does Yield Engineering Systems, Inc. patent most?

H01L - Semiconductor Devices NOT Covered BY Class H10 18

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 8

B08B - Cleaning IN GENERAL; Prevention OF Fouling IN General 4

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 3

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 2

F27D - Details OR Accessories OF Furnaces, Kilns, Ovens OR Retorts, IN SO FAR AS They ARE OF Kinds Occurring IN More Than ONE Kind OF Furnace 2

B05B - Spraying APPARATUS; Atomising APPARATUS; Nozzles 2

B24C - Abrasive OR Related Blasting With Particulate Material 2

F27B - Furnaces, Kilns, Ovens OR Retorts IN GENERAL; Open Sintering OR Like Apparatus 2

Y10T - Technical Subjects Covered BY Former US Classification 2

F22B - Methods OF Steam GENERATION; Steam Boilers 1

H01J - Electric Discharge Tubes OR Discharge Lamps 1

C23C - Coating Metallic MATERIAL; Coating Material With Metallic MATERIAL; Surface Treatment OF Metallic Material BY Diffusion Into THE Surface, BY Chemical Conversion OR SUBSTITUTION; Coating BY Vacuum Evaporation, BY Sputtering, BY ION Implantation OR BY Chemical Vapour Deposition, IN General 1

B05D - Processes FOR Applying Fluent Materials TO Surfaces, IN General 1

Top 14 of 14 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Yield Engineering Systems, Inc.'s patent record in context - here's where to go next.

Yield Engineering Systems, Inc.'s lead technology class is H01L (Semiconductor Devices NOT Covered BY Class H10), 78.3% of its portfolio - see every assignee active in that class. Explore H01L
Ranked #13,264 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Yield Engineering Systems, Inc. against Xiaomi EV Technology Co., Ltd., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 55.2/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.