Where does Wenzhou Hongfeng Electrical Alloy Co., Ltd rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Wenzhou Hongfeng Electrical Alloy Co., Ltd ranks #38,304 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Wenzhou Hongfeng Electrical Alloy Co., Ltd hold?

Wenzhou Hongfeng Electrical Alloy Co., Ltd holds 7 US utility patents granted between 2016 and 2021, spanning 10 technology areas.

What is Wenzhou Hongfeng Electrical Alloy Co., Ltd's Innovation Score?

Wenzhou Hongfeng Electrical Alloy Co., Ltd has an Innovation Score of 25.4 out of 100 (17th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Wenzhou Hongfeng Electrical Alloy Co., Ltd's patent grant rate increasing or decreasing?

Wenzhou Hongfeng Electrical Alloy Co., Ltd's recent grant velocity is -60% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Wenzhou Hongfeng Electrical Alloy Co., Ltd's patents?

Wenzhou Hongfeng Electrical Alloy Co., Ltd's patents average 11.7 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Wenzhou Hongfeng Electrical Alloy Co., Ltd patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Wenzhou Hongfeng Electrical Alloy Co., Ltd

Q: What technology areas does Wenzhou Hongfeng Electrical Alloy Co., Ltd focus on?

Wenzhou Hongfeng Electrical Alloy Co., Ltd's top technology area is B22F (Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder) with 4 patents, ranking #291 of 926 assignees active in that subclass. Grants appear in 10 CPC subclasses total.

USPTO PatentsView assignee record - 7 granted patents across 10 technology areas, recorded in grant years 2016–2021. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B22F (Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Wenzhou ranks #38,304 of 49,997 tracked US assignees by granted-patent volume, with 7 patents across 10 technology areas.

#38,304
of 49,997 US assignees by volume: 17th percentile
by Innovation Score (25.4/100): 11.7
avg claims per patent: -60%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R38304 · Foreign Corporation #38,304 · 7 grants

GRANTS-MICRO · LOWER-Q · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-PAR · TYPE-FRNCORP · VEL-DROP · BOOK-FULL

GRANTS-MICRO 7 grants
LOWER-Q #38,304/49,997
PHOTO-FINISH Weinmann Emergency…
CPC-FOCUS B22F · 10 areas
INNOV-THIN 25.4/100
CLAIMS-PAR 11.7 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DROP -60% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Weinmann Emergency Medical Technology GMBH & Co. KG (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Wenzhou’s 25.4 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 7.2 pts (28%) Velocity 0.0 pts (0%) Breadth 11.2 pts (44%) Claim depth 7.0 pts (28%)

Qualcomm Incorporated · highest

85
Wenzhou Hongfeng… · this assignee

25
3D Lighting… · lowest

7

What this shows Wenzhou's Innovation Score is 25.4/100 (17th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Wenzhou?

Each dot is one of Wenzhou’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Wenzhou’s own 11.7 claims/patent is at or below the 11.7 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Wenzhou vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Wenzhou's grants concentrate

Wenzhou Hongfeng Electrical Alloy Co., Ltd is a focused PatentsView assignee: 10 CPC subclasses with 57.1% of grants classified under B22F (Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder). Peak complete grant year is 2016 (3 grants) versus a trough of 1 in 2017. By volume, Wenzhou sits between Weinmann Emergency Medical Technology GMBH & Co. KG and WHEEL.ME AS.

Weinmann Emergenc…

7
Welco

7
Welcon

7
Welland Medical

7
Wepower

7
Westco Scientific…

7
Wexco Incorporated

7
Wheel ME AS

7
Wenzhou Hongfeng… ◀

7

What this shows Wenzhou holds 7 patents at rank #38,258, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Wenzhou

By rank, the assignees closest to #38,258 in granted patent volume.

Leaders in B22F (Working Metallic Powder)

Other assignees with the most granted patents in Wenzhou's primary technology class.

Wenzhou's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

25 17th percentile higher than 17% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2016–2021

Grants by year

Teal-shaded recent years (2020–present) versus the 2016–2019 baseline. Full figures in the table below.

View data table

Wenzhou Hongfeng Electrical Alloy Co., Ltd patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2016	3	42.9%
2017	1	14.3%
2018	1	14.3%
2020	1	14.3%
2021	1	14.3%

Which technologies does Wenzhou Hongfeng Electrical Alloy Co., Ltd patent most?

B22F - Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder 4

H01H - Electric SWITCHES; RELAYS; SELECTORS; Emergency Protective Devices 4

C22C - Alloys 4

H01B - CABLES; CONDUCTORS; INSULATORS; Selection OF Materials FOR Their Conductive, Insulating OR Dielectric Properties 3

C23C - Coating Metallic MATERIAL; Coating Material With Metallic MATERIAL; Surface Treatment OF Metallic Material BY Diffusion Into THE Surface, BY Chemical Conversion OR SUBSTITUTION; Coating BY Vacuum Evaporation, BY Sputtering, BY ION Implantation OR BY Chemical Vapour Deposition, IN General 2

Y10T - Technical Subjects Covered BY Former US Classification 2

B21B - Rolling OF Metal 1

C22F - Changing THE Physical Structure OF Non-ferrous Metals AND Non-ferrous Alloys 1

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 1

H01R - Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors 1

Top 10 of 10 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Wenzhou Hongfeng Electrical Alloy Co., Ltd's patent record in context - here's where to go next.

Wenzhou Hongfeng Electrical Alloy Co., Ltd's lead technology class is B22F (Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder), 57.1% of its portfolio - see every assignee active in that class. Explore B22F
Ranked #38,304 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Wenzhou Hongfeng Electrical Alloy Co., Ltd against Weinmann Emergency Medical Technology GMBH & Co. KG, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 25.4/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.