USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Tongfu Microelectronics Co., Ltd.

USPTO PatentsView assignee record - 29 granted patents across 3 technology areas, recorded in grant years 2017–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01L (Semiconductor Devices NOT Covered BY Class H10).

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The verdict

According to USPTO PatentsView, Tongfu ranks #10,795 of 49,997 tracked US assignees by granted-patent volume, with 29 patents across 3 technology areas.

#10,795
of 49,997 US assignees by volume
46th percentile
by Innovation Score (34.0/100)
14.4
avg claims per patent
+33%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R10795 · Foreign Corporation #10,795 · 29 grants

GRANTS-SMALL · UPPER-Q · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-RICH · TYPE-FRNCORP · VEL-UP · BOOK-FULL

  • GRANTS-SMALL 29 grants
  • UPPER-Q #10,795/49,997
  • PHOTO-FINISH Tenable
  • CPC-NARROW H01L · 3 areas
  • INNOV-THIN 34.0/100
  • CLAIMS-RICH 14.4 claims/avg
  • TYPE-FRNCORP Foreign Corp
  • VEL-UP +33% vel
  • BOOK-FULL 10/10 fields

Nearest grant-volume peer: Tenable, Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Tongfu’s 34.0 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Innovation-score neighbourhood around Tongfu

Lowest and highest poles plus nearest Innovation Score peers, not a full corpus board reprint.

score

What this shows Tongfu's Innovation Score is 34.0/100 (46th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Source USPTO PatentsView, PlainPatent Innovation Score As of 2015–2025

Does more volume mean deeper claims for Tongfu?

Each dot is one of Tongfu’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Tongfu’s own 14.4 claims/patent is ABOVE the 11.7 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Tongfu vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView. 2×2 strategic matrix plotting 9 entities by Granted patents (volume) (X) and Avg claims / patent (Y), with a crosshair dividing the plot into four quadrants. Volume + depthSelective & thoroughVolume over depthLean filer 28.92929.1 51015202530 Granted patents (volume) Avg claims / patent Tenable, Inc. - 29, 26.62TenableTHE Folger Coffee Company - 29, 7.59THE Folger CoffeeTHE Nippon Synthetic Chemical Industry Co., Ltd. - 29, 9.21THE Nippon Synthe…THE University OF Warwick - 29, 16.52THE University OF…TOP Victory Investments Limited - 29, 8.59TOP Victory Inves…Toray Battery Separator Film Co., Ltd. - 29, 11.72Toray Battery Sep…Trico Belgium S.A. - 29, 11.97Trico BelgiumTurck Holding GmbH - 29, 14.76Turck HoldingTongfu Microelectronics Co., Ltd. - 29, 14.41Tongfu Microelect…
Tongfu vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Tongfu's grants concentrate

Tongfu Microelectronics Co., Ltd. is a focused PatentsView assignee: 3 CPC subclasses with 75.9% of grants classified under H01L (Semiconductor Devices NOT Covered BY Class H10). Peak complete grant year is 2018 (7 grants) versus a trough of 1 in 2019. By volume, Tongfu sits between Tenable, Inc. and Turck Holding GmbH.

Tongfu's three-year grant acceleration

Tongfu Microelectronics Co., Ltd. shows 9 grants in 2022–2024 against only 8 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Who files at Tongfu's volume?

Granted US patents 2015–2025 versus its nearest-ranked assignees by volume, this company marked ◀

patents

What this shows Tongfu holds 29 patents at rank #10,784, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Source USPTO PatentsView, granted utility patents As of 2015–2025

Companies ranked near Tongfu

By rank, the assignees closest to #10,784 in granted patent volume.

Leaders in H01L (Semiconductor Devices NOT Covered BY Class H10)

Other assignees with the most granted patents in Tongfu's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Tongfu, neither rank-band nor same-CPC leaders (those blocks stay above). In H01L (Semiconductor Devices NOT Covered BY Class H10), Tongfu ranks #562 of 3,373 assignees by patent count in that subclass.

Tongfu's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

34 46th percentile higher than 46% of 49,997 US assignees

This assignee 0 100 every tracked assignee, bucketed by value

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

02468 201720182019202020212022202320242025 1
USPTO utility patent grants by year · 2017–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2017–2019 baseline. Full figures in the table below.

View data table
Tongfu Microelectronics Co., Ltd. patent grants by year, 2015–2025
Year Patents Granted Share of Period
2017 4 13.8%
2018 7 24.1%
2019 1 3.4%
2020 2 6.9%
2021 5 17.2%
2022 1 3.4%
2023 2 6.9%
2024 6 20.7%
2025partial year 1 3.4%

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

What to do with this data

Tongfu Microelectronics Co., Ltd.'s patent record in context - here's where to go next.

  • Tongfu Microelectronics Co., Ltd.'s lead technology class is H01L (Semiconductor Devices NOT Covered BY Class H10), 75.9% of its portfolio - see every assignee active in that class. Explore H01L
  • Ranked #10,795 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
  • Compare Tongfu Microelectronics Co., Ltd. against Tenable, Inc., an assignee filing at a similar volume. Compare portfolios
  • Innovation Score of 34.0/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.