Where does Tokyo Seimitsu Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Tokyo Seimitsu Co., Ltd. ranks #4,742 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Tokyo Seimitsu Co., Ltd. hold?

Tokyo Seimitsu Co., Ltd. holds 74 US utility patents granted between 2015 and 2025, spanning 28 technology areas.

What is Tokyo Seimitsu Co., Ltd.'s Innovation Score?

Tokyo Seimitsu Co., Ltd. has an Innovation Score of 44.7 out of 100 (top 25% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Tokyo Seimitsu Co., Ltd.'s patent grant rate increasing or decreasing?

Tokyo Seimitsu Co., Ltd.'s recent grant velocity is -3% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Tokyo Seimitsu Co., Ltd.'s patents?

Tokyo Seimitsu Co., Ltd.'s patents average 10.1 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Tokyo Seimitsu Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Tokyo Seimitsu Co., Ltd.

Q: What technology areas does Tokyo Seimitsu Co., Ltd. focus on?

Tokyo Seimitsu Co., Ltd.'s top technology area is G01B (Measuring Length, Thickness OR Similar Linear DIMENSIONS; Measuring ANGLES; Measuring AREAS; Measuring Irregularities OF Surfaces OR Contours) with 28 patents, ranking #44 of 2,030 assignees active in that subclass. Grants appear in 28 CPC subclasses total.

USPTO PatentsView assignee record - 74 granted patents across 28 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: G01B (Measuring Length, Thickness OR Similar Linear DIMENSIONS; Measuring ANGLES; Measuring AREAS; Measuring Irregularities OF Surfaces OR Contours).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Tokyo ranks #4,742 of 49,997 tracked US assignees by granted-patent volume, with 74 patents across 28 technology areas.

#4,742
of 49,997 US assignees by volume: Top 25%
by Innovation Score (44.7/100): 10.1
avg claims per patent: -3%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R4742 · Foreign Corporation #4,742 · 74 grants

GRANTS-SMALL · TOP-DECILE · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-PAR · TYPE-FRNCORP · VEL-FLAT · BOOK-FULL

GRANTS-SMALL 74 grants
TOP-DECILE #4,742/49,997
PHOTO-FINISH Taiyo Nippon Sanso
CPC-FOCUS G01B · 28 areas
INNOV-PAR 44.7/100
CLAIMS-PAR 10.1 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-FLAT -3% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Taiyo Nippon Sanso Corporation (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Tokyo’s 44.7 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 14.9 pts (33%) Velocity 5.0 pts (11%) Breadth 18.7 pts (42%) Claim depth 6.0 pts (13%)

Qualcomm Incorporated · highest

85
Pierburg Pump… · near

45
Primetals Japan · near

45
SKYPE · near

45
Spire Global… · near

45
Tokyo Seimitsu · this assignee

45
3D Lighting… · lowest

7

What this shows Tokyo's Innovation Score is 44.7/100 (top 25% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Tokyo?

Each dot is one of Tokyo’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Tokyo’s own 10.1 claims/patent is at or below the 13.3 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Tokyo vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Tokyo's grants concentrate

Tokyo Seimitsu Co., Ltd. is a focused PatentsView assignee: 28 CPC subclasses with 37.8% of grants classified under G01B (Measuring Length, Thickness OR Similar Linear DIMENSIONS; Measuring ANGLES; Measuring AREAS; Measuring Irregularities OF Surfaces OR Contours). Peak complete grant year is 2019 (10 grants) versus a trough of 4 in 2015. By volume, Tokyo sits between Taiyo Nippon Sanso Corporation and Wuhan Xinxin Semiconductor Manufacturing Co., Ltd..

Tokyo's three-year grant acceleration

From 2019–2021 to 2022–2024, Tokyo Seimitsu Co., Ltd. moved from 24 to 18 grants (0.75x the prior three-year total, a multiple, not a CAGR). See the growth leaderboard.

Taiyo Nippon Sanso

74
TDK—Micronas

74
Teva Pharmaceutic…

74
Teijin Pharma

74
Universite Paris-…

74
Victor Equipment

74
WM Intellectual P…

74
Wuhan Xinxin Semi…

74
Tokyo Seimitsu ◀

74

What this shows Tokyo holds 74 patents at rank #4,742, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Tokyo

By rank, the assignees closest to #4,742 in granted patent volume.

Leaders in G01B (Measuring Length)

Other assignees with the most granted patents in Tokyo's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Tokyo, neither rank-band nor same-CPC leaders (those blocks stay above). In G01B (Measuring Length), Tokyo ranks #44 of 2,030 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (45 here).

SKYPE 45 Primetals Technologies Japan, Ltd. 45 Spire Global Subsidiary, Inc. 45 Pierburg Pump Technology GMBH 45

Similar claim depth

Nearest assignees by average claims per patent (10.1 here).

Dunlop Sports Co., Ltd. 10.1 avg Oncotherapy Science, Inc. 10.1 avg Mayekawa MFG. Co., Ltd. 10.1 avg National Chi Nan University 10.1 avg

Tokyo's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

45 Top 25% higher than 75% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Tokyo Seimitsu Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	4	5.4%
2016	6	8.1%
2017	8	10.8%
2018	5	6.8%
2019	10	13.5%
2020	8	10.8%
2021	6	8.1%
2022	8	10.8%
2023	4	5.4%
2024	6	8.1%
2025partial year	9	12.2%

Which technologies does Tokyo Seimitsu Co., Ltd. patent most?

G01B - Measuring Length, Thickness OR Similar Linear DIMENSIONS; Measuring ANGLES; Measuring AREAS; Measuring Irregularities OF Surfaces OR Contours 28

H01L - Semiconductor Devices NOT Covered BY Class H10 20

G01R - Measuring Electric VARIABLES; Measuring Magnetic Variables 16

B24B - Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents 10

G01D - Measuring NOT Specially Adapted FOR A Specific VARIABLE; Arrangements FOR Measuring TWO OR More Variables NOT Covered IN A Single Other SUBCLASS; Tariff Metering APPARATUS; Measuring OR Testing NOT Otherwise Provided FOR 8

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 6

B23C - Milling 4

B26D - CUTTING; Details Common TO Machines FOR Perforating, Punching, Cutting-out, Stamping-out OR Severing 4

B23Q - Details, Components, OR Accessories FOR Machine Tools, e.g. Arrangements FOR Copying OR Controlling ; Machine Tools IN General Characterised BY THE Construction OF Particular Details OR COMPONENTS; Combinations OR Associations OF Metal-working Machines, NOT Directed TO A Particular Result 4

Y10T - Technical Subjects Covered BY Former US Classification 3

G06T - Image Data Processing OR Generation, IN General 2

B28D - Working Stone OR Stone-like Materials 2

B24D - Tools FOR Grinding, Buffing OR Sharpening 2

G01N - Investigating OR Analysing Materials BY Determining Their Chemical OR Physical Properties 2

G02B - Optical Elements, Systems OR Apparatus 1

Top 15 of 28 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Tokyo Seimitsu Co., Ltd.'s patent record in context - here's where to go next.

Tokyo Seimitsu Co., Ltd.'s lead technology class is G01B (Measuring Length, Thickness OR Similar Linear DIMENSIONS; Measuring ANGLES; Measuring AREAS; Measuring Irregularities OF Surfaces OR Contours), 37.8% of its portfolio - see every assignee active in that class. Explore G01B
Ranked #4,742 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Tokyo Seimitsu Co., Ltd. against Taiyo Nippon Sanso Corporation, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 44.7/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.