Where does TemperPack Technologies Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), TemperPack Technologies Inc. ranks #19,232 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does TemperPack Technologies Inc. hold?

TemperPack Technologies Inc. holds 15 US utility patents granted between 2019 and 2025, spanning 10 technology areas.

What is TemperPack Technologies Inc.'s Innovation Score?

TemperPack Technologies Inc. has an Innovation Score of 41.4 out of 100 (top 33% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does TemperPack Technologies Inc. focus on?

TemperPack Technologies Inc.'s top technology area is B32B (Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form) with 14 patents, ranking #284 of 3,088 assignees active in that subclass. Grants appear in 10 CPC subclasses total.

Is TemperPack Technologies Inc.'s patent grant rate increasing or decreasing?

TemperPack Technologies Inc.'s recent grant velocity is +900% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for TemperPack Technologies Inc.'s patents?

TemperPack Technologies Inc.'s patents average 21.1 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the TemperPack Technologies Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView US Corporation

TemperPack Technologies Inc.

USPTO PatentsView assignee record - 15 granted patents across 10 technology areas, recorded in grant years 2019–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B32B (Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Temperpack ranks #19,232 of 49,997 tracked US assignees by granted-patent volume, with 15 patents across 10 technology areas.

#19,232
of 49,997 US assignees by volume: Top 33%
by Innovation Score (41.4/100): 21.1
avg claims per patent: +900%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R19232 · US Corporation #19,232 · 15 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-DENSE · TYPE-USCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 15 grants
MID-PACK #19,232/49,997
PHOTO-FINISH Technische Universit…
CPC-FOCUS B32B · 10 areas
INNOV-PAR 41.4/100
CLAIMS-DENSE 21.1 claims/avg
TYPE-USCORP US Corporation
VEL-SURGE +900% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Technische Universität Ilmenau (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Temperpack’s 41.4 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 9.6 pts (23%) Velocity 8.0 pts (19%) Breadth 11.2 pts (27%) Claim depth 12.7 pts (31%)

Qualcomm Incorporated · highest

85
TemperPack · this assignee

41
3D Lighting… · lowest

7

What this shows Temperpack's Innovation Score is 41.4/100 (top 33% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Temperpack?

Each dot is one of Temperpack’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Temperpack’s own 21.1 claims/patent is ABOVE the 18.7 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Temperpack vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Temperpack's grants concentrate

TemperPack Technologies Inc. is a focused PatentsView assignee: 10 CPC subclasses with 93.3% of grants classified under B32B (Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form). Peak complete grant year is 2020 (4 grants) versus a trough of 1 in 2019. By volume, Temperpack sits between Technische Universität Ilmenau and The Research Foundation for The State University.

Temperpack's three-year grant acceleration

TemperPack Technologies Inc. shows 6 grants in 2022–2024 against only 5 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Technische Univer…

15
Tectum Holdings

15
Teledyne Flir

15
Teleflex Innovati…

15
Terawatt Technolo…

15
The Andersons

15
The Kingstar

15
The Research Foun…

15
Temperpack ◀

15

What this shows TemperPack holds 15 patents at rank #19,259, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near TemperPack

By rank, the assignees closest to #19,259 in granted patent volume.

Leaders in B32B (Layered Products)

Other assignees with the most granted patents in TemperPack's primary technology class.

Temperpack's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

41 Top 33% higher than 67% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2019–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2019–2019 baseline. Full figures in the table below.

View data table

TemperPack Technologies Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2019	1	6.7%
2020	4	26.7%
2023	3	20.0%
2024	3	20.0%
2025partial year	4	26.7%

Which technologies does TemperPack Technologies Inc. patent most?

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 14

B65D - Containers FOR Storage OR Transport OF Articles OR Materials, e.g. Bags, Barrels, Bottles, Boxes, Cans, Cartons, Crates, Drums, Jars, Tanks, Hoppers, Forwarding CONTAINERS; Accessories, Closures, OR Fittings THEREFOR; Packaging ELEMENTS; Packages 9

B31D - Making Articles OF Paper, Cardboard OR Material Worked IN A Manner Analogous TO Paper, NOT Provided FOR IN Subclasses B31b OR B31c 7

F16L - PIPES; Joints OR Fittings FOR PIPES; Supports FOR Pipes, Cables OR Protective TUBING; Means FOR Thermal Insulation IN General 7

B29L - Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles 4

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 4

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 4

B31F - Mechanical Working OR Deformation OF Paper, Cardboard OR Material Worked IN A Manner Analogous TO Paper 3

B31B - Making Containers OF Paper, Cardboard OR Material Worked IN A Manner Analogous TO Paper 3

Y10T - Technical Subjects Covered BY Former US Classification 3

Top 10 of 10 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

TemperPack Technologies Inc.'s patent record in context - here's where to go next.

TemperPack Technologies Inc.'s lead technology class is B32B (Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form), 93.3% of its portfolio - see every assignee active in that class. Explore B32B
Ranked #19,232 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare TemperPack Technologies Inc. against Technische Universität Ilmenau, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 41.4/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.