Where does Taisei Lamick Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Taisei Lamick Co., Ltd. ranks #43,479 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Taisei Lamick Co., Ltd. hold?

Taisei Lamick Co., Ltd. holds 6 US utility patents granted between 2017 and 2022, spanning 9 technology areas.

What is Taisei Lamick Co., Ltd.'s Innovation Score?

Taisei Lamick Co., Ltd. has an Innovation Score of 27.5 out of 100 (24th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Taisei Lamick Co., Ltd.'s patent grant rate increasing or decreasing?

Taisei Lamick Co., Ltd.'s recent grant velocity is -50% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Taisei Lamick Co., Ltd.'s patents?

Taisei Lamick Co., Ltd.'s patents average 14.2 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Taisei Lamick Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Taisei Lamick Co., Ltd.

Q: What technology areas does Taisei Lamick Co., Ltd. focus on?

Taisei Lamick Co., Ltd.'s top technology area is B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing) with 5 patents, ranking #1,113 of 4,378 assignees active in that subclass. Grants appear in 9 CPC subclasses total.

USPTO PatentsView assignee record - 6 granted patents across 9 technology areas, recorded in grant years 2017–2022. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Taisei ranks #43,479 of 49,997 tracked US assignees by granted-patent volume, with 6 patents across 9 technology areas.

#43,479
of 49,997 US assignees by volume: 24th percentile
by Innovation Score (27.5/100): 14.2
avg claims per patent: -50%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R43479 · Foreign Corporation #43,479 · 6 grants

GRANTS-MICRO · LOWER-Q · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-RICH · TYPE-FRNCORP · VEL-DROP · BOOK-FULL

GRANTS-MICRO 6 grants
LOWER-Q #43,479/49,997
PHOTO-FINISH Tab Investco
CPC-NARROW B29C · 9 areas
INNOV-THIN 27.5/100
CLAIMS-RICH 14.2 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DROP -50% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Tab Investco Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Taisei’s 27.5 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 6.7 pts (24%) Velocity 1.7 pts (6%) Breadth 10.6 pts (39%) Claim depth 8.5 pts (31%)

Qualcomm Incorporated · highest

85
2724889 Ontario · near

28
LNJ Group · near

28
Pulmocide · near

28
Taisei Lamick · this assignee

28
MTI Wireless Edge · near

27
3D Lighting… · lowest

7

What this shows Taisei's Innovation Score is 27.5/100 (24th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Taisei?

Each dot is one of Taisei’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Taisei’s own 14.2 claims/patent is ABOVE the 5.2 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Taisei vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Taisei's grants concentrate

Taisei Lamick Co., Ltd. is a focused PatentsView assignee: 9 CPC subclasses with 83.3% of grants classified under B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing). Peak complete grant year is 2019 (3 grants) versus a trough of 1 in 2017. By volume, Taisei sits between Typeform, S.L. and Taizhou JiaoGuang Lighting Co., Ltd..

Taisei's three-year grant acceleration

Taisei Lamick Co., Ltd. shows 1 grants in 2022–2024 against only 4 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Typeform S L

6
Tyrenn

6
Tab Investco

6
Tacx B V

6
Taishan University

6
Taiwan Inpaq

6
Taiwan Resonant W…

6
Taizhou Jiaoguang…

6
Taisei Lamick ◀

6

What this shows Taisei holds 6 patents at rank #43,609, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Taisei

By rank, the assignees closest to #43,609 in granted patent volume.

Leaders in B29C (Shaping OR Joining OF Plastics)

Other assignees with the most granted patents in Taisei's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Taisei, neither rank-band nor same-CPC leaders (those blocks stay above). In B29C (Shaping OR Joining OF Plastics), Taisei ranks #1,113 of 4,378 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (28 here).

LNJ Group, LLC 28 Pulmocide Limited 28 2724889 Ontario Inc. 28 MTI Wireless Edge Ltd. 27

Taisei's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

28 24th percentile higher than 24% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2017–2022

Grants by year

Teal-shaded recent years (2020–present) versus the 2017–2019 baseline. Full figures in the table below.

View data table

Taisei Lamick Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2017	1	16.7%
2019	3	50.0%
2020	1	16.7%
2022	1	16.7%

Which technologies does Taisei Lamick Co., Ltd. patent most?

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 5

B65B - Machines, Apparatus OR Devices FOR, OR Methods OF, Packaging Articles OR MATERIALS; Unpacking 4

B29L - Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles 3

B65D - Containers FOR Storage OR Transport OF Articles OR Materials, e.g. Bags, Barrels, Bottles, Boxes, Cans, Cartons, Crates, Drums, Jars, Tanks, Hoppers, Forwarding CONTAINERS; Accessories, Closures, OR Fittings THEREFOR; Packaging ELEMENTS; Packages 2

C09J - ADHESIVES; Non-mechanical Aspects OF Adhesive Processes IN GENERAL; Adhesive Processes NOT Provided FOR ELSEWHERE; USE OF Materials AS Adhesives 1

B65H - Handling Thin OR Filamentary Material, e.g. Sheets, Webs, Cables 1

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 1

F16B - Devices FOR Fastening OR Securing Constructional Elements OR Machine Parts Together, e.g. Nails, Bolts, Circlips, Clamps, Clips OR WEDGES; Joints OR Jointing 1

E21D - SHAFTS; TUNNELS; GALLERIES; Large Underground Chambers 1

Top 9 of 9 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Taisei Lamick Co., Ltd.'s patent record in context - here's where to go next.

Taisei Lamick Co., Ltd.'s lead technology class is B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing), 83.3% of its portfolio - see every assignee active in that class. Explore B29C
Ranked #43,479 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Taisei Lamick Co., Ltd. against Typeform, S.L., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 27.5/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.