Where does Tai-saw Technology Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Tai-saw Technology Co., Ltd. ranks #27,563 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Tai-saw Technology Co., Ltd. hold?

Tai-saw Technology Co., Ltd. holds 10 US utility patents granted between 2016 and 2024, spanning 13 technology areas.

What is Tai-saw Technology Co., Ltd.'s Innovation Score?

Tai-saw Technology Co., Ltd. has an Innovation Score of 51.2 out of 100 (top 12% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Tai-saw Technology Co., Ltd.'s patent grant rate increasing or decreasing?

Tai-saw Technology Co., Ltd.'s recent grant velocity is +133% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Tai-saw Technology Co., Ltd.'s patents?

Tai-saw Technology Co., Ltd.'s patents average 17.0 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Tai-saw Technology Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Tai-saw Technology Co., Ltd.

Q: What technology areas does Tai-saw Technology Co., Ltd. focus on?

Tai-saw Technology Co., Ltd.'s top technology area is H03H (Impedance Networks, e.g. Resonant CIRCUITS; Resonators) with 4 patents. Grants appear in 13 CPC subclasses total.

USPTO PatentsView assignee record - 10 granted patents across 13 technology areas, recorded in grant years 2016–2024. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H03H (Impedance Networks, e.g. Resonant CIRCUITS; Resonators).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Tai-saw ranks #27,563 of 49,997 tracked US assignees by granted-patent volume, with 10 patents across 13 technology areas.

#27,563
of 49,997 US assignees by volume: Top 12%
by Innovation Score (51.2/100): 17.0
avg claims per patent: +133%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R27563 · Foreign Corporation #27,563 · 10 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-RICH · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 10 grants
MID-PACK #27,563/49,997
PHOTO-FINISH Tabor Mountain
CPC-FOCUS H03H · 13 areas
INNOV-PAR 51.2/100
CLAIMS-RICH 17.0 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +133% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Tabor Mountain LLC (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Tai-saw Technology · this assignee

51
3D Lighting… · lowest

7

What this shows Tai-saw's Innovation Score is 51.2/100 (top 12% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Tai-saw's grants concentrate

Tai-saw Technology Co., Ltd. is a focused PatentsView assignee: 13 CPC subclasses with 40% of grants classified under H03H (Impedance Networks, e.g. Resonant CIRCUITS; Resonators). Peak complete grant year is 2024 (3 grants) versus a trough of 1 in 2016. By volume, Tai-saw sits between Tabor Mountain LLC and Tannpapier GMBH.

Tai-saw's three-year grant acceleration

Tai-saw Technology Co., Ltd. shows 6 grants in 2022–2024 against only 1 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Tabor Mountain

10
Taer Innovation

10
Taesung Industrial

10
Taghleef Industri…

10
Taishan Changjian…

10
Taiwan-n-lighting

10
Tangoe

10
Tannpapier

10
Tai-saw Technology ◀

10

What this shows Tai-saw holds 10 patents at rank #27,552, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Tai-saw

By rank, the assignees closest to #27,552 in granted patent volume.

Leaders in H03H (Impedance Networks)

Other assignees with the most granted patents in Tai-saw's primary technology class.

Tai-saw's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

51 Top 12% higher than 88% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2016–2024

Grants by year

Teal-shaded recent years (2020–present) versus the 2016–2019 baseline. Full figures in the table below.

View data table

Tai-saw Technology Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2016	1	10.0%
2017	2	20.0%
2021	1	10.0%
2022	1	10.0%
2023	2	20.0%
2024	3	30.0%

Which technologies does Tai-saw Technology Co., Ltd. patent most?

H03H - Impedance Networks, e.g. Resonant CIRCUITS; Resonators 4

Y10T - Technical Subjects Covered BY Former US Classification 3

H01L - Semiconductor Devices NOT Covered BY Class H10 2

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 2

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 2

H01Q - Antennas, i.e. Radio Aerials 2

B01L - Chemical OR Physical Laboratory Apparatus FOR General USE 2

G01N - Investigating OR Analysing Materials BY Determining Their Chemical OR Physical Properties 1

H03B - Generation OF Oscillations, Directly OR BY Frequency-changing, BY Circuits Employing Active Elements Which Operate IN A Non-switching MANNER; Generation OF Noise BY Such Circuits 1

H10N - Electric Solid-state Devices NOT Otherwise Provided FOR 1

H01F - MAGNETS; INDUCTANCES; TRANSFORMERS; Selection OF Materials FOR Their Magnetic Properties 1

C08J - WORKING-UP; General Processes OF COMPOUNDING; After-treatment NOT Covered BY Subclasses C08b, C08c, C08f, C08g or C08h 1

C09J - ADHESIVES; Non-mechanical Aspects OF Adhesive Processes IN GENERAL; Adhesive Processes NOT Provided FOR ELSEWHERE; USE OF Materials AS Adhesives 1

Top 13 of 13 technology areas

Where it ranks

Overall rank by patents

#27,563

of 49,997 tracked assignees

Innovation Score

51.2 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Tai-saw Technology Co., Ltd.'s patent record in context - here's where to go next.

Tai-saw Technology Co., Ltd.'s lead technology class is H03H (Impedance Networks, e.g. Resonant CIRCUITS; Resonators), 40% of its portfolio - see every assignee active in that class. Explore H03H
Ranked #27,563 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Tai-saw Technology Co., Ltd. against Tabor Mountain LLC, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 51.2/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.