USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Tai-saw Technology Co., Ltd.

USPTO PatentsView assignee record - 10 granted patents across 13 technology areas, active 2016–2024. Filing-trend and competitive-moat analysis cross-referenced to USPTO Patent Public Search. Primary class: H03H (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS).

Compiled byPlainPatent Editorial, US Patent Intelligence Editorial Team

Explore the portfolio See the ranking

Total patents granted

CPC technology areas

17.0

Avg claims per patent

+133%

5-year filing velocity

The verdict

Tai-saw holds 10 US patents across 13 technology areas, rank #27,552 of 50,000 tracked assignees.

#27,552
of 50,000 US assignees by volume: Top 12%
by Innovation Score (51.2/100): 17.0
avg claims per patent: +133%
filing velocity, last 5 yrs

Portfolio overview

Tai-saw Technology Co., Ltd. has been granted 10 US utility patents between 2016 and 2024, placing Tai-saw Technology Co., Ltd. at rank #27,552 across all assignees tracked by PlainPatent. This portfolio spans 13 distinct Cooperative Patent Classification (CPC) subclasses, averaging 17.0 claims per patent with primary concentration in H03H (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS). As a Foreign Corporation, Tai-saw Technology Co., Ltd. is one of the more focused assignees in the PatentsView dataset. By volume, Tai-saw sits between Tabor Mountain Llc (10 patents, rank #27,548) and Tannpapier Gmbh (10 patents, rank #27,556) - the closest US assignees by grant volume. The composite Innovation Score of 51.2/100 blends portfolio volume, filing velocity, technology breadth, and claim depth into a single comparable measure drawn directly from USPTO PatentsView records.

Filing cadence tells the strategic story. Between 2020 and 2025 the company received 7 grants, compared with 3 in the 2015–2019 window, a +133% shift in five-year velocity. An acceleration of this magnitude signals aggressive R&D investment and expanding technical ambition. The Foreign Corporation classification further shapes interpretation, since corporate, government, and individual filers pursue patents for materially different reasons.

Claim depth and technology breadth together indicate competitive posture. Tai-saw Technology Co., Ltd.'s 17.0 average claims per patent sits within the typical range for solid legal coverage without excessive prosecution cost, while concentration in 13 subclasses points to a focused technical program. Combined with portfolio volume, these signals let analysts, investors, and licensing professionals benchmark Tai-saw Technology Co., Ltd. against peers pursuing similar technology classes.

Tabor Mountain

10
TAER Innovation

10
Taesung Industrial

10
Taghleef Industri…

10
Taishan Changjian…

10
Taiwan-n-lighting

10
Tangoe

10
Tannpapier

10
Tai-saw Technology ◀

10

What this shows Tai-saw holds 10 patents at rank #27,552, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Tai-saw

By rank, the assignees closest to #27,552 in granted patent volume.

Leaders in H03H (Impedance Networks)

Other assignees with the most granted patents in Tai-saw's primary technology class.

Tai-saw's Innovation Score vs. every tracked assignee

Composite of portfolio volume, filing velocity, technology breadth, and claim depth (0–100)

51 Top 12% higher than 88% of 50,000 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2016–2024

Grants by year

Teal-shaded recent years (2020–present) versus the 2016–2019 baseline. Full figures in the table below.

View data table

Tai-saw Technology Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2016	1	10.0%
2017	2	20.0%
2021	1	10.0%
2022	1	10.0%
2023	2	20.0%
2024	3	30.0%

Which technologies does Tai-saw Technology Co., Ltd. patent most?

H03H - IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS 4

Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION 3

H01L - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10 2

Y02P - CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS 2

H05K - PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2

H01Q - ANTENNAS, i.e. RADIO AERIALS 2

B01L - CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE 2

G01N - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 1

H03B - GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS 1

H10N - ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR 1

H01F - MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 1

C08J - WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H 1

C09J - ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES 1

Top 13 of 13 technology areas

Patent Moat Analysis

Portfolio Volume Light

Tech Breadth Focused

Claim Depth Standard

Velocity Accelerating

Where it ranks

Overall rank by patents

#27,552

Across all tracked assignees

Innovation Score

51.2 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

Frequently Asked Questions

How many patents does Tai-saw Technology Co., Ltd. hold?

Tai-saw Technology Co., Ltd. holds 10 US granted patents filed between 2016 and 2024, spanning 13 technology areas.

What is Tai-saw Technology Co., Ltd.'s Innovation Score?

Tai-saw Technology Co., Ltd. has an Innovation Score of 51.2 out of 100. This composite metric weighs portfolio volume (40%), filing velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Tai-saw Technology Co., Ltd. focus on?

Tai-saw Technology Co., Ltd.'s top technology area is H03H (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS) with 4 patents. The company has filed patents in 13 CPC subclasses total.

Is Tai-saw Technology Co., Ltd.'s patent filing rate increasing or decreasing?

Tai-saw Technology Co., Ltd.'s recent filing velocity is +133% compared to the prior five-year period. This indicates accelerating innovation.

What does claim depth mean for Tai-saw Technology Co., Ltd.'s patents?

Tai-saw Technology Co., Ltd.'s patents average 17.0 claims each. This falls within the standard range, providing solid legal coverage.

How is the Tai-saw Technology Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

How to use this portfolio

Tai-saw's 10 grants land it in the top 12% by Innovation Score, but volume alone doesn't tell you where the strength sits.

Read that count against the largest US assignees before treating it as dominance - Tai-saw ranks #27,552 of 50,000. Top 50 holders
Most of this portfolio concentrates in H03H - see who else leads that technology area. H03H leaders
Check what the four-part Innovation Score actually rewards before comparing it to another company. How the score works

Patent counts and the Innovation Score measure patenting activity, not commercial success or the legal strength of any patent. Many patents are filed defensively. Verify the status of an individual patent against official USPTO records.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent Editorial

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled byPlainPatent Editorial, US Patent Intelligence Editorial Team

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.