Where does Synventive Molding Solutions, Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Synventive Molding Solutions, Inc. ranks #3,986 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Synventive Molding Solutions, Inc. hold?

Synventive Molding Solutions, Inc. holds 91 US utility patents granted between 2015 and 2025, spanning 12 technology areas.

What is Synventive Molding Solutions, Inc.'s Innovation Score?

Synventive Molding Solutions, Inc. has an Innovation Score of 42.5 out of 100 (top 30% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Synventive Molding Solutions, Inc.'s patent grant rate increasing or decreasing?

Synventive Molding Solutions, Inc.'s recent grant velocity is +0% compared to the prior five-year period (grant years, not application filing dates). The company is maintaining or growing its granted-patent output.

What does claim depth mean for Synventive Molding Solutions, Inc.'s patents?

Synventive Molding Solutions, Inc.'s patents average 20.3 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Synventive Molding Solutions, Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView US Corporation

Synventive Molding Solutions, Inc.

Q: What technology areas does Synventive Molding Solutions, Inc. focus on?

Synventive Molding Solutions, Inc.'s top technology area is B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing) with 91 patents, ranking #54 of 4,378 assignees active in that subclass. Grants appear in 12 CPC subclasses total.

USPTO PatentsView assignee record - 91 granted patents across 12 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Synventive ranks #3,986 of 49,997 tracked US assignees by granted-patent volume, with 91 patents across 12 technology areas.

#3,986
of 49,997 US assignees by volume: Top 30%
by Innovation Score (42.5/100): 20.3
avg claims per patent: +0%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R3986 · US Corporation #3,986 · 91 grants

GRANTS-SMALL · TOP-DECILE · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-DENSE · TYPE-USCORP · VEL-FLAT · BOOK-FULL

GRANTS-SMALL 91 grants
TOP-DECILE #3,986/49,997
PHOTO-FINISH National University…
CPC-FOCUS B29C · 12 areas
INNOV-PAR 42.5/100
CLAIMS-DENSE 20.3 claims/avg
TYPE-USCORP US Corporation
VEL-FLAT +0% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: National University Corporation Kagawa University (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Synventive’s 42.5 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 15.6 pts (37%) Velocity 2.5 pts (6%) Breadth 12.2 pts (29%) Claim depth 12.2 pts (29%)

Qualcomm Incorporated · highest

85
Norgren · near

43
Rawles · near

43
Rhino Rack Australia… · near

43
Saint-gobain… · near

43
Synventive Molding… · this assignee

43
3D Lighting… · lowest

7

What this shows Synventive's Innovation Score is 42.5/100 (top 30% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Synventive?

Each dot is one of Synventive’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Synventive’s own 20.3 claims/patent is ABOVE the 15.0 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Synventive vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Synventive's grants concentrate

Synventive Molding Solutions, Inc. is a focused PatentsView assignee: 12 CPC subclasses with 100% of grants classified under B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing). Peak complete grant year is 2021 (18 grants) versus a trough of 4 in 2015. By volume, Synventive sits between National University Corporation Kagawa University and Tango Networks, Inc..

Synventive's three-year grant acceleration

From 2019–2021 to 2022–2024, Synventive Molding Solutions, Inc. moved from 43 to 16 grants (0.37x the prior three-year total, a multiple, not a CAGR). See the growth leaderboard.

National Universi…

91
Patent Investment…

91
SOCIÉTÉ BIC

91
Suzhou Opple Ligh…

91
Sage Therapeutics

91
Saint Louis Unive…

91
Silgan White Cap

91
Tango Networks

91
Synventive Moldin… ◀

91

What this shows Synventive holds 91 patents at rank #3,983, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Synventive

By rank, the assignees closest to #3,983 in granted patent volume.

Leaders in B29C (Shaping OR Joining OF Plastics)

Other assignees with the most granted patents in Synventive's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Synventive, neither rank-band nor same-CPC leaders (those blocks stay above). In B29C (Shaping OR Joining OF Plastics), Synventive ranks #54 of 4,378 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (43 here).

Rhino Rack Australia PTY Limited 43 Norgren Limited 43 Rawles LLC 43 Saint-gobain Performance Plastics Pampus GMBH 43

Similar claim depth

Nearest assignees by average claims per patent (20.3 here).

Polaris Wireless, Inc. 20.3 avg 8ME Nova, LLC 20.3 avg Bentley Systems, Incorporated 20.3 avg Symbotic LLC 20.3 avg

Synventive's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

43 Top 30% higher than 70% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Synventive Molding Solutions, Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	4	4.4%
2016	5	5.5%
2017	9	9.9%
2018	13	14.3%
2019	14	15.4%
2020	11	12.1%
2021	18	19.8%
2022	4	4.4%
2023	6	6.6%
2024	6	6.6%
2025partial year	1	1.1%

Which technologies does Synventive Molding Solutions, Inc. patent most?

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 91

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 37

G05B - Control OR Regulating Systems IN GENERAL; Functional Elements OF Such SYSTEMS; Monitoring OR Testing Arrangements FOR Such Systems OR Elements 23

G05D - Systems FOR Controlling OR Regulating Non-electric Variables 18

F15B - Systems Acting BY Means OF Fluids IN GENERAL; Fluid-pressure Actuators, e.g. SERVOMOTORS; Details OF Fluid-pressure Systems, NOT Otherwise Provided FOR 6

F16K - VALVES; TAPS; COCKS; ACTUATING-FLOATS; Devices FOR Venting OR Aerating 4

F16B - Devices FOR Fastening OR Securing Constructional Elements OR Machine Parts Together, e.g. Nails, Bolts, Circlips, Clamps, Clips OR WEDGES; Joints OR Jointing 3

G06F - Electric Digital Data Processing 2

G09G - Arrangements OR Circuits FOR Control OF Indicating Devices Using Static Means TO Present Variable Information 1

B29L - Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles 1

B05B - Spraying APPARATUS; Atomising APPARATUS; Nozzles 1

H02K - Dynamo-electric Machines 1

Top 12 of 12 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Synventive Molding Solutions, Inc.'s patent record in context - here's where to go next.

Synventive Molding Solutions, Inc.'s lead technology class is B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing), 100% of its portfolio - see every assignee active in that class. Explore B29C
Ranked #3,986 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Synventive Molding Solutions, Inc. against National University Corporation Kagawa University, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 42.5/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.